초록 ▼

The present invention is based on the discovery that certain electron poor olefins combined with nucleophiles and a base catalyst are useful as adhesive compositions for the electronic packaging industry. In particular, the adhesive formulations set forth herein are useful as low temperature curing

The present invention is based on the discovery that certain electron poor olefins combined with nucleophiles and a base catalyst are useful as adhesive compositions for the electronic packaging industry. In particular, the adhesive formulations set forth herein are useful as low temperature curing formulations with high adhesion to a variety of substrates. Invention formulations typically cure at about 80° C. and have a potlife of about 24 hours. The formulations cure by the well-known Michael addition reaction.

대표청구항 ▼

What is claimed is: 1. An adhesive composition comprising an electron poor olefin comprising at least one maleimide or at least one (meth)acrylate, a nucleophile, and a base catalyst, wherein the composition is a one-part composition that cures by Michael addition at a temperature of between about 5

What is claimed is: 1. An adhesive composition comprising an electron poor olefin comprising at least one maleimide or at least one (meth)acrylate, a nucleophile, and a base catalyst, wherein the composition is a one-part composition that cures by Michael addition at a temperature of between about 50° C. and about 100° C., wherein the (meth)acrylate is selected from the group consisting of zinc diacrylate, calcium diacrylate, trimethylolpropane trimethacrylate, trimethylolpropane triacrylate, pentaerythritol tetraacrylate, tricyclodecanedimethanol diacrylate, 2-butyl-2-ethyl-1,3-propanediol diacrylate, ditrimethylolpropane tetraacrylate and dipentaerythritol pentaacrylate.