초록 ▼

A hermetically sealed device comprising a spacing unit and a resistive heating element desirably having a closed-loop structure and process for hermetically sealing a device by using such heating element and spacing unit. The frit can form multiple closed-loops to prevent crack propagation. The heat

A hermetically sealed device comprising a spacing unit and a resistive heating element desirably having a closed-loop structure and process for hermetically sealing a device by using such heating element and spacing unit. The frit can form multiple closed-loops to prevent crack propagation. The heating element can be advantageously made of a metal such as Invar® and/or Kovar®. The invention enables hermetic frit sealing with low residual stress in the seal for large-area displays. The invention is particularly advantageous for hermetic sealing of OLED display devices having a large area, such as those above 10 inches (25 cm).

대표청구항 ▼

What is claimed is: 1. A device comprising:(I) a first substrate;(II) a closed-loop-shaped inorganic spacing unit hermetically bonded to the first substrate;(III) a resistive-heating element hermetically bonded to the spacing unit, the resistive-heating element having a shape substantially correspon

What is claimed is: 1. A device comprising:(I) a first substrate;(II) a closed-loop-shaped inorganic spacing unit hermetically bonded to the first substrate;(III) a resistive-heating element hermetically bonded to the spacing unit, the resistive-heating element having a shape substantially corresponding to the spacing unit; and(IV) a first layer of frit material bonded to the resistive-heating element over the surface of the resistive-heating element farther from the first substrate, the first layer of frit material forming multiple closed loops.