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Polishing pad with microporous regions 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24B-001/00
출원번호 US-0931908 (2004-09-01)
등록번호 US8075372 (2011-11-29)
발명자 / 주소
  • Prasad, Abaneshwar
출원인 / 주소
  • Cabot Microelectronics Corporation
대리인 / 주소
    Thomas E., Omholt
인용정보 피인용 횟수 : 8  인용 특허 : 62

초록

The invention provides a polishing pad for chemical-mechanical polishing comprising a polymeric material comprising two or more adjacent regions, wherein the regions have the same polymer formulation and the transition between the regions does not include a structurally distinct boundary. In a first

대표청구항

What is claimed is: 1. A polishing pad for chemical-mechanical polishing comprising a pad body comprising a porous polymeric material, the pad body having at least one first region and at least one second region adjacent to the at least one first region, the pad body including pores having a first v

이 특허에 인용된 특허 (62)

  1. Rutherford Denise R. ; Goetz Douglas P. ; Thomas Cristina U. ; Webb Richard J. ; Bruxvoort Wesley J. ; Buhler James D. ; Hollywood William J., Abrasive construction for semiconductor wafer modification.
  2. Hartfelt Jorgen (36 Berkeley Dr. Horsholm MA DKX) Hoehn Ralf (36 Berkeley Dr. Chelmsford MA 01824), Abrasive of a microporous polymer matrix with inorganic particles thereon.
  3. Robinson Karl M., Abrasive polishing pad with covalently bonded abrasive particles.
  4. Kuramochi Hideto,JPX ; Kubota Yoshitaka,JPX, Abrasive shaped article, abrasive disc and polishing method.
  5. Birang Manoocher ; Pyatigorsky Grigory, Apparatus and method for in-situ monitoring of chemical mechanical polishing operations.
  6. Hyde Thomas C. (Chandler AZ) Roberts John V. H. (Newark DE), Apparatus for interlayer planarization of semiconductor material.
  7. Wiand Ronald C. ; Emmerling Richard J., Attachment system for lens surfacing pad.
  8. Kramer, Steve, CMP pad having isolated pockets of continuous porosity and a method for using such pad.
  9. Brian L. Mueller ; Shumin Wang, CMP polishing pad including a solid catalyst.
  10. Cruz Jose Luis ; Messier Steven James ; Sturtevant Douglas Keith ; Tiersch Matthew Thomas, Composite polish pad for CMP.
  11. Lofaro Michael F. (Milton NY), Composite polishing pad.
  12. Eppert, Jr., Stanley E.; Manzonie, Adam; Freeman, Peter W.; Langlois, Elizabeth A., Eliminating air pockets under a polished pad.
  13. Birang Manoocher ; Gleason Allan ; Guthrie William L., Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus.
  14. Birang Manoocher ; Gleason Allan ; Guthrie William L., Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus.
  15. Lustig Naftali E. (Croton-on-Hudson NY) Saenger Katherine L. (Ossining NY) Tong Ho-Ming (Yorktown Heights NY), In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing.
  16. Pant Anil K. ; Jairath Rahul ; Mishra Kamal ; Chadda Saket ; Krusell Wilbur C., Integrated pad and belt for chemical mechanical polishing.
  17. Tupil Srinath P. ; Buchner Klaus,CHX ; Lahmann Patrick M., Lamination of microcellular articles.
  18. Jairath Rahul ; Pecen Jiri ; Chadda Saket ; Krusell Wilbur C. ; Cutini Jerauld J. ; Engdahl Erik H., Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher.
  19. Burnham Theodore A. ; Cha Sung W. ; Walat Robert H. ; Kim Roland Y. ; Anderson Jere R. ; Stevenson James F. ; Suh Nam P. ; Pallaver Matthew, Method and apparatus for microcellular polymer extrusion.
  20. Blizard Kent ; Tupil Srinath ; Malavich William, Method and apparatus for microcellular polypropylene extrusion, and polypropylene articles produced thereby.
  21. Crevasse Annette Margaret ; Easter William Graham ; Maze John Albert ; Miceli ; III Frank, Method for making porous CMP article.
  22. Paul J. Yancey, Method of manufacturing a polymer or polymer/composite polishing pad.
  23. Cesna Joseph V., Methods and apparatus for improved polishing of workpieces.
  24. Cook Lee Melbourne ; James David B. ; Jenkins Charles William ; Reinhardt Heinz F. ; Roberts John V. H. ; Pillai Raj Raghav, Methods for using polishing pads.
  25. Blizard Kent ; Okamoto Kelvin T. ; Anderson Jere R., Microcellular articles and methods of their production.
  26. Prasad, Abaneshwar, Microporous polishing pads.
  27. Castro Anthony J. (Oak Park IL), Microporous products.
  28. Kuramochi Hideto,JPX ; Takato Shuji,JPX ; Kubota Yoshitaka,JPX, Molded abrasive product and polishing wheel using it.
  29. Roberts John V. H. ; Pinheiro Barry Scott ; James David B., Molded polishing pad having integral window.
  30. John V. H. Roberts ; Barry Scott Pinheiro ; David B. James, Molding a polishing pad having integral window.
  31. Jin-Ok Moon KR, Multi characterized chemical mechanical polishing pad and method for fabricating the same.
  32. Treur Randolph E. ; Boyd John M. ; Wolf Stephan H., Optical view port for chemical mechanical planarization endpoint detection.
  33. Zhang Liming ; Weling Milind Ganesh, Patterned polishing pad for use in chemical mechanical polishing of semiconductor wafers.
  34. Suzuki Kiyoshi,JPX ; Masumura Hisashi,JPX ; Fukami Teruaki,JPX, Polishing method for semiconductor wafer and polishing pad used therein.
  35. Otawa Kazuhiko,JPX ; Fukumoto Toshiyuki,JPX ; Kawakami Yasuaki,JPX, Polishing pad.
  36. Peter W. Freeman ; Stanley E. Eppert, Jr. ; Alan H. Saikin ; Marco A. Acevedo, Polishing pad.
  37. Robert G. Swisher ; Alan E. Wang, Polishing pad.
  38. Newell, Kelly J., Polishing pad comprising a filled translucent region.
  39. Cherian, Isaac K.; Anjur, Sriram P.; Grumbine, Steven K., Polishing pad comprising particles with a solid core and polymeric shell.
  40. Anjur Sriram P. ; Downing William C., Polishing pad for a semiconductor substrate.
  41. Sevilla Roland K. ; Kaufman Frank B. ; Anjur Sriram P., Polishing pad for a semiconductor substrate.
  42. Yu Tat-Kwan (Austin TX) Yu Chris C. (Austin TX), Polishing pad for chemical-mechanical polishing of a semiconductor substrate.
  43. Allison, William C.; Swisher, Robert G.; Wang, Alan E., Polishing pad for planarization.
  44. Thomas Michael E. (Milpitas CA), Polishing pad for planarization.
  45. Takiyama Masahiro (Shiojiri JPX) Miyazaki Kunihiro (Shiojiri JPX) Shiozawa Kenichiro (Ashiya JPX), Polishing pad for semiconductor wafers.
  46. Pinheiro, Barry Scott; Naugler, Steven, Polishing pad having an advantageous micro-texture and methods relating thereto.
  47. Nagahara Ronald J. ; Lee Dawn M., Polishing pad surface for improved process control.
  48. Aiyer Arun A., Polishing pad thinning to optically access a semiconductor wafer surface.
  49. Roberts John V. H. (Newark DE), Polishing pads.
  50. Cook Lee M. (Steelville PA) Roberts John V. H. (Newark DE) Jenkins Charles W. (Newark DE) Pillai Raj R. (Newark DE), Polishing pads and methods for their use.
  51. Cook Lee Melbourne ; James David B. ; Jenkins Charles William ; Reinhardt Heinz F. ; Roberts John V. H. ; Pillai Raj Raghav, Polishing pads and methods relating thereto.
  52. John V. H. Roberts ; David B. James ; Lee Melbourne Cook ; Charles W. Jenkins, Polishing pads and methods relating thereto.
  53. Roberts John V. H. ; James David B. ; Cook Lee Melbourne, Polishing pads and methods relating thereto.
  54. Sevilla Roland K. ; Kaufman Frank B. ; Anjur Sriram P., Polishing pads for a semiconductor substrate.
  55. David B. James ; Arun Vishwanathan ; Lee Melbourne Cook ; Peter A. Burke ; David Shidner, Polishing pads for chemical mechanical planarization.
  56. Sailesh Mansinh Merchant ; Sudhanshu Misra ; Pradip Kumar Roy, Polishing pads from closed-cell elastomer foam.
  57. Kimura Tsuguji (5-7-17 Asahi-Chou Souka-City ; Saitama Prefec. 340 JPX) Watanabe Shinichi (4-4 Enkaiji Touyo-City ; Ehime Prefec. 799-13 JPX), Polishing sheet material and method for its production.
  58. Kumar Vipin (Seattle WA), Polyethylene terephthalate foams with integral crystalline skins.
  59. Winings Richard H. (Berks County PA), Removably holding planar articles for polishing operations.
  60. Baker, III, Arthur Richard; Walls, Jr., Russell A.; Carter, Stephen P.; Hendron, Jeffrey J., Self-leveling pads and methods relating thereto.
  61. Kumar Vipin (Seattle WA) Schirmer Henry G. (Spartanburg SC), Semi-continuous production of solid state polymeric foams.
  62. Shih,Wen Chang; Chang,Yung Chung; Chu,Min Kuei, Single-layer polishing pad and method producing the same.

이 특허를 인용한 특허 (8)

  1. Qian, Bainian; Kozhukh, Julia; Brugarolas Brufau, Teresa; Veneziale, David Michael; Tong, Yuhua; Lugo, Diego; Miller, Jeffrey B.; Jacob, George C.; DeGroot, Marty W.; Tran, Tony Quan; Stack, Marc R.; Wank, Andrew; Yeh, Fengji, Chemical mechanical polishing pad and method of making same.
  2. Brugarolas Brufau, Teresa; Kozhukh, Julia; Qian, Bainian, Chemical mechanical polishing pad with composite polishing layer.
  3. Kozhukh, Julia; Brugarolas Brufau, Teresa; Qian, Bainian, Composite polishing layer chemical mechanical polishing pad.
  4. Korogi, Hayato, Method of manufacturing semiconductor device.
  5. Lefevre, Paul Andre; Allison, William C., Polishing pad having porogens with liquid filler.
  6. Huang, Ping; Scott, Diane; LaCasse, James P.; Allison, William C., Polishing pad with multi-modal distribution of pore diameters.
  7. Huang, Ping; Scott, Diane; LaCasse, James P.; Allison, William C., Polishing pad with multi-modal distribution of pore diameters.
  8. Qian, Bainian; DeGroot, Marty W.; Jensen, Michelle; Murnane, James; Hendron, Jeffrey J.; Nowland, John G.; James, David B.; Yeh, Fengji, Soft and conditionable chemical mechanical polishing pad with window.
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