An enclosure is provided for housing electronic equipment that accommodates the different cooling and ventilating requirements of different types of equipment. The enclosure is constructed and arranged to support cooling airflow in a front-to-back configuration through the enclosure and in a side-to
An enclosure is provided for housing electronic equipment that accommodates the different cooling and ventilating requirements of different types of equipment. The enclosure is constructed and arranged to support cooling airflow in a front-to-back configuration through the enclosure and in a side-to-side configuration from one side to an opposite side of the enclosure. The enclosure can thereby provide within a single enclosure means cooling air for components using front-to-back airflow for cooling, such as information technology (IT) equipment, and for components using side-to-side airflow, such as certain types of telecommunications equipment. The enclosure can thereby support a mix of IT and telecommunications equipment, providing flexibility and adaptability in network room and data center configuration. The enclosure is further configured to separate intake air used by equipment for cooling from exhaust air vented by equipment into its interior during operation. As a result, the enclosure promotes sufficient equipment cooling and prevents/minimizes equipment overheating.
대표청구항▼
1. An enclosure for containing electronic equipment that produces heat during operation, the enclosure comprising: a housing including a front panel and a back panel opposite to the front panel, a first side panel defining a side of the housing and a second side panel opposite to the first side pane
1. An enclosure for containing electronic equipment that produces heat during operation, the enclosure comprising: a housing including a front panel and a back panel opposite to the front panel, a first side panel defining a side of the housing and a second side panel opposite to the first side panel defining an opposite side of the housing, and a top panel and a bottom panel opposite to the top panel, the housing defining an interior chamber;the housing further defining at least one air opening defined along the front panel to intake cooling air external to the enclosure;the housing further defining a front air intake plenum defined between the front panel and one or more equipment components mounted within the interior chamber, the front air intake plenum being disposed in direct fluid communication with the at least one air intake opening;the housing further defining a first side air plenum defined between one of the first side panel and the second side panel and one or more equipment components contained within the interior chamber, the first side air plenum being disposed in direct fluid communication with the front air intake plenum, the first side air intake plenum having a plurality of openings formed therein in communication with air inlets of one or more equipment components contained within the interior chamber to deliver cooling air from the first side air plenum to the one or more equipment components; anda second side air plenum defined between the other of the first side panel and the second side panel and one or more equipment components contained within the interior chamber, the second side air plenum having a plurality of openings formed therein in communication with air outlets of the one or more equipment components to exhaust fluid from the one or more equipment components to the second side air plenum; and,a rear air plenum in fluid communication with at least the second side air plenum for receiving said fluid from the second side air plenum,wherein the first and second side air plenums cooperate to promote fluid flow across the one or more equipment components to achieve cooling by side-to-side airflow and wherein the cooling air received through the first air intake plenum is exhausted through the rear plenum. 2. The enclosure of claim 1, wherein the first side air plenum is further defined by one or more airflow blocking partitions disposed within the interior chamber between one of the first side panel and the second side panel and one or more equipment components, and between the top panel and the bottom panel. 3. The enclosure of claim 2, wherein the one or more airflow blocking partitions collectively extend between the top panel and the bottom panel to form a barrier to prevent mixing of air contained within the first side air plenum with air contained along an exhaust side of the enclosure defined between the back panel and one or more equipment components contained within the interior chamber. 4. The enclosure of claim 2, wherein the one or more airflow blocking partitions are configured to removably connect to at least one of the first side panel and the second side panel, and at least one of the top panel, the bottom panel, another airflow blocking partition and an equipment component contained in the interior chamber. 5. The enclosure of claim 1, wherein the front air intake plenum is disposed and configured to permit at least a portion of air contained within the front air intake plenum to flow into the side air intake plenum. 6. The enclosure of claim 1, wherein the front intake air plenum is disposed opposite to an exhaust side of the enclosure defined between the back panel and one or more equipment components contained within the interior chamber, wherein the exhaust side is configured to receive exhaust air vented from any of the one or more equipment components achieving cooling by front-to-back airflow. 7. The enclosure of claim 6, wherein the housing further defines at least one air exhaust opening defined along at least one of the back panel and the top panel. 8. The enclosure of claim 1, wherein the second side air intake plenum is configured to receive exhaust air vented from any of the one or more equipment components achieving cooling by side-to-side airflow. 9. The enclosure of claim 8, wherein the second side air plenum is in fluid communication with an exhaust side of the enclosure defined between the back panel and one or more equipment components contained within the interior chamber. 10. The enclosure of claim 8, wherein the housing further defines at least one air exhaust opening defined along at least one of the back panel and the top panel. 11. The enclosure of claim 1, further comprising one or more blanking panels disposed at locations along at least one of: (i) above, (ii) below and (iii) between one or more equipment components, the one or more blanking panels being disposed and configured to prevent flow of received air from the side air intake plenum into one or more other portions of the interior chamber. 12. The enclosure of claim 1, wherein the first side air plenum is disposed at a substantially perpendicular orientation relative to the front air intake plenum. 13. The enclosure of claim 3, wherein the rear air plenum is defined within the interior chamber between the back panel and one or more equipment components contained within the interior chamber, the back air exhaust area disposed at the exhaust side and opposite to the front air intake area. 14. A method of cooling electronic equipment components within an enclosure, the method comprising: mounting electronic equipment components at a front of the enclosure;receiving air in a front air intake area of the enclosure via intake openings in a front panel of the enclosure;circulating at least a portion of the received air from the front air intake area directly to a side air intake area;delivering air from the side air intake area directly to one or more electronic equipment components via openings in the side air intake area in communication with inlets of the one or more electronic equipment components; andreceiving exhaust air vented from outlets of any of the one or more electronic equipment components achieving cooling by side-to-side airflow through the one or more electronic equipment components via openings in a side exhaust intake area located opposite to the side air intake area, receiving exhaust air vented from the exhaust intake area in a rear exhaust plenum. 15. The method of claim 14, further comprising receiving exhaust air vented from any of one or more electronic components achieving cooling by front-to-back airflow along a back exhaust area located opposite to the front air intake area. 16. The method of claim 14, further comprising preventing mixing of air contained within the side air intake area with air contained within the back exhaust area. 17. The method of claim 14, further comprising containing air in at least one of the front air intake area and a first side plenum. 18. The method of claim 15, further comprising circulating exhaust air between the second side plenum and the back exhaust area. 19. The enclosure of claim 1, wherein the plurality of openings are formed along a length of each of the first and second side air intake plenums. 20. The enclosure of claim 1, wherein at least one of the first side air intake plenum and second side air intake plenum extends from the bottom panel to the top panel and has a uniform depth in a direction from the front panel to the back panel. 21. The enclosure of claim 6, wherein the front air intake plenum is in fluid communication with air inlets of at least one equipment component achieving cooling by front-to-back airflow, and wherein the second side air plenum is in fluid communication with the air outlets of the at least one equipment component achieving cooling of the at least one equipment component by front-to-back airflow. 22. The enclosure of claim 1, wherein the housing further comprises mounting rails at a front of the enclosure to facilitate mounting equipment components within the interior chamber.
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