초록 ▼

A 3D smart power module for power control, such as a three phase power control module, includes a two sided printed circuit (PC) board with power semiconductor devices attached to one side and control semiconductor devices attached to the other side. The power semiconductor devices are die bonded to

A 3D smart power module for power control, such as a three phase power control module, includes a two sided printed circuit (PC) board with power semiconductor devices attached to one side and control semiconductor devices attached to the other side. The power semiconductor devices are die bonded to a direct bonded copper substrate which has a bottom surface exposed in the molded package. In one embodiment the module has 27 external connectors attached to one side of the PC board and arranged in the form of a ball grid array.

대표청구항 ▼

1. A method of forming an encapsulated semiconductor package comprising the steps of: die bonding first semiconductor devices to die bond surfaces of a planar substrate respectively, the surfaces lying in a single plane and being disposed in regions;attaching and electrically connecting the first se

1. A method of forming an encapsulated semiconductor package comprising the steps of: die bonding first semiconductor devices to die bond surfaces of a planar substrate respectively, the surfaces lying in a single plane and being disposed in regions;attaching and electrically connecting the first semiconductor devices to selected traces respectively on a first side of a printed circuit (PC) board, the PC board having vias between the selected traces and traces on a second side of said PC board opposite to the first side;attaching and electrically connecting second semiconductor devices to selected traces of the second side of the PC board respectively; andattaching external pins to some of the traces on the second side of the PC board. 2. The method set forth in claim 1 wherein the regions having die bond surfaces are part of a heat sink which has an exposed surface that is not encapsulated. 3. The method set forth in claim 1 wherein the first semiconductor devices are die bonded using a soft solder. 4. The method set forth in claim 1 wherein the second semiconductor devices are die bonded with an epoxy die bonding material. 5. The method set forth in claim 1 wherein the external pins are placed orthogonal to the second side of the PC board. 6. The method set forth in claim 1 further including the step of forming electrical connections between the regions having the die bond surfaces and selected traces on the first side of the PC board respectively. 7. The method set forth in claim 1 further including the step of forming an electrical connections between die surfaces of the second semiconductor devices and selected traces on the second side of the PC board respectively. 8. The method set forth in claim 1 further including the step of forming solder balls on ends of the external pins. 9. The method set forth in claim 1 wherein the external pins are arranged in rows and columns. 10. The method set forth in claim 1 wherein the external pins are arranged to form a ball grid array.