IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0834137
(2007-08-06)
|
등록번호 |
US-8092735
(2012-01-10)
|
발명자
/ 주소 |
- Thompson, D. Scott
- Boardman, Larry D.
- Leatherdale, Catherine A.
|
출원인 / 주소 |
- 3M Innovative Properties Company
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
6 인용 특허 :
68 |
초록
▼
Disclosed herein is a method of making a light emitting device having an LED die and a molded encapsulant made by polymerizing at least two polymerizable compositions. The method includes: (a) providing an LED package having an LED die disposed in a reflecting cup, the reflecting cup filled with a f
Disclosed herein is a method of making a light emitting device having an LED die and a molded encapsulant made by polymerizing at least two polymerizable compositions. The method includes: (a) providing an LED package having an LED die disposed in a reflecting cup, the reflecting cup filled with a first polymerizable composition such that the LED die is encapsulated; (b) providing a mold having a cavity filled with a second polymerizable composition; (c) contacting the first and second polymerizable compositions; (d) polymerizing the first and second polymerizable compositions to form first and second polymerized compositions, respectively, wherein the first and second polymerized compositions are bonded together; and (e) optionally separating the mold from the second polymerized composition. Light emitting devices prepared according to the method are also described.
대표청구항
▼
1. A method of making a light emitting device, the method comprising: (a) providing an LED package comprising an LED die disposed in a reflecting cup, the reflecting cup filled with a first photopolymerizable composition such that the LED die is encapsulated, and partially polymerizing the first pho
1. A method of making a light emitting device, the method comprising: (a) providing an LED package comprising an LED die disposed in a reflecting cup, the reflecting cup filled with a first photopolymerizable composition such that the LED die is encapsulated, and partially polymerizing the first photopolymerizable composition to form a first partially photopolymerized composition, wherein partially polymerizing comprises applying actinic radiation having a wavelength of 700 nm or less;(b) providing a mold having a cavity filled with a second polymerizable composition;(c) contacting the first partially photopolymerized composition and the second polymerizable composition;(d) polymerizing the first partially photopolymerized composition and the second polymerizable composition to form first and second polymerized compositions, respectively, wherein the first and second polymerized compositions are bonded together; and(e) optionally separating the mold from the second polymerized composition. 2. The method of claim 1, wherein contacting the first partially photopolymerized composition and the second polymerizable composition comprises inverting the LED package. 3. The method of claim 1, wherein contacting the first partially photopolymerized composition and the second polymerizable compositions comprises inverting the mold. 4. The method of claim 1, wherein the second polymerizable composition comprises a second partially polymerized composition. 5. The method of claim 1, wherein the first photopolymerizable composition and/or the second polymerizable compositions are thixotropic. 6. The method of claim 1, wherein the first photopolymerizable composition comprises a resin selected from the group consisting of silicon-containing resins comprising silicon-bonded hydrogen and aliphatic unsaturation, epoxy silicones, and (meth)acrylated silicones. 7. The method of claim 1, wherein the second polymerizable composition comprises a resin selected from the group consisting of silicon-containing resins comprising silicon-bonded hydrogen and aliphatic unsaturation, epoxy silicones, and (meth)acrylated silicones. 8. The method of claim 1, wherein the second polymerizable composition comprises a multi-functional (meth)acrylate. 9. The method of claim 1, wherein the first photopolymerizable composition and the second polymerizable compositions are the same. 10. The method of claim 1, wherein the second polymerized composition is harder than the first. 11. The method of claim 1, wherein the first polymerized composition has a refractive index greater than that of the second. 12. The method of claim 1, wherein the second polymerized composition is harder than the first, and the first polymerized composition has a refractive index greater than that of the second. 13. The method of claim 1, wherein the first photopolymerizable composition comprises two layers having the same or different composition. 14. The method of claim 1, wherein the second polymerizable composition comprises two layers having the same or different composition. 15. The method of claim 1, the mold comprising a mold material and being shaped to impart a positive or negative lens on a substantial portion of the surface of the second polymerizable composition. 16. The method of claim 1, the mold comprising a mold material and being shaped to impart macrostructures, each macrostructure having a dimension of from 10 um to 1 mm. 17. The method of claim 1, the mold comprising a mold material and being shaped to impart microstructures, each microstructure having a dimension of from 100 nm to less than 10 um. 18. The method of claim 1, wherein polymerizing the first partially photopolymerized composition and the second polymerizable composition comprises applying actinic radiation having a wavelength of 700 nm or less. 19. The method of claim 1, wherein polymerizing the first partially photopolymerized composition and the second polymerizable composition comprises simultaneously applying actinic radiation having a wavelength of 700 nm or less and heating at less than 150° C. 20. The method of claim 1, comprising separating the mold from the second polymerized composition to form a molded second polymerized composition, and the method further comprising heating the molded second polymerized composition at less than 150° C. 21. The method of claim 1, the LED die comprising a plurality of LED dice. 22. The method of claim 21, wherein each LED die of the LED dice emits light of substantially the same wavelength. 23. The method of claim 21, wherein the LED dice emit light of different wavelengths. 24. The method of claim 1, wherein providing an LED package comprising an LED die disposed in a reflecting cup comprises providing a plurality of LED packages disposed on a lead frame, each LED package comprising an LED die disposed in a reflecting cup.
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