Modular high-power drive stack system and method
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H02B-013/02
H05K-007/20
H01R-013/64
H02P-027/04
출원번호
US-0743735
(2007-05-03)
등록번호
US-8094435
(2012-01-10)
발명자
/ 주소
Howes, Jeremy
Levett, David
Froeb, John
출원인 / 주소
Parker-Hannifin Corporation
대리인 / 주소
Renner, Otto, Boisselle & Sklar, LLP
인용정보
피인용 횟수 :
7인용 특허 :
15
초록▼
A power drive stack system comprises a series of power electronic modules, each one of the modules containing power components and module contacts electrically and mechanically aligned for building a portion of a complete AC/DC drive stack. The modules utilize a common set of circuit connection poin
A power drive stack system comprises a series of power electronic modules, each one of the modules containing power components and module contacts electrically and mechanically aligned for building a portion of a complete AC/DC drive stack. The modules utilize a common set of circuit connection points that are matched to a common set of physical connection points. The modules can be plugged together like building blocks to form a large variety of AC/DC drive stacks that can be tailored to meet an exact system requirement. The drive stack may be used in conjunction with a controller to adjust the torque and speed of an AC/DC electric motor.
대표청구항▼
1. A high power drive stack system comprising: a common support structure having a plurality of receivers located in predetermined locations, wherein at least some of the receivers have at least one receiver contact coupled to the receiver;a plurality of modules in a stacked configuration and secure
1. A high power drive stack system comprising: a common support structure having a plurality of receivers located in predetermined locations, wherein at least some of the receivers have at least one receiver contact coupled to the receiver;a plurality of modules in a stacked configuration and secured to the common support structure, wherein the plurality of modules comprise a power component and at least one module contact, wherein the at least one module contact for each of the plurality of modules is arranged in a prescribed position based on electrical signal type and coupled to at least a portion of the power component associated with each respective module, wherein each of the module contacts of the same signal type for each of the plurality of modules are matingly coupled to corresponding receiver contacts; anda plurality of couplers, wherein each of the plurality of couplers is selectively coupled to the receiver contacts for each of the plurality of modules based on electrical signal type to configure the plurality of modules to perform one or more high power functions, wherein at least one of the receivers has less receiver contacts than one or more other receivers. 2. The system of claim 1, further including control electronics located remotely from the common support structure and the modules, wherein the control electronics are communicatively coupled to the each of the modules to control the one or more high power functions. 3. The system of claim 1 further including a cooling system for each module. 4. The system of claim 1 further including a cooling system that is common to the plurality modules. 5. A high power electronic system formed by a plurality of power electronic modules, the system comprising: a plurality of power electronic modules, each module having a power component and a plurality of module contacts, wherein the plurality of module contacts are arranged in a first direction in a predetermined configuration corresponding to a plurality of common signals and each module contact from one of the power electronic modules having a common signal with another module contact is arranged spaced apart from the another module contact in a second direction, wherein the second direction is perpendicular to the first direction such that the plurality of modules can be configured together to form one or more high power circuits by one or more couplers selectively coupled to the module contacts of two or more of the plurality of electronic modules in the second direction, wherein each of the plurality of couplers is coupled to one of the plurality of common signals. 6. The system of claim 5, wherein the plurality of power electronic modules are stacked together. 7. The system of claim 6, wherein the plurality of power electronic modules are configured to be stacked together in a common support structure. 8. The system of claim 5 further including a plurality of receivers for each of the plurality of power electronic modules for securing at least one of the plurality of power electronic modules to a common support structure, wherein at least some of the receivers have at least one receiver contact. 9. The system of claim 8, wherein the plurality of module contacts are configured to be removably inserted into the plurality of receiving contacts secured to the common support structure. 10. The system of claim 9, wherein the plurality of receivers are also configured to receive the one or more couplers for configuring two or more of the power electronic modules to form the one or more high power circuits. 11. The system of claim 10, wherein an electrical characteristic of one or more high power functions determines a quantity of module contacts associated with one or more of the common signals contained in a particular power electric module. 12. The system of claim 5 further including control electronics housed remotely from and communicatively coupled to the each of the plurality of power electronic modules, wherein the control electronics controls operation of the one or more power circuits. 13. The system of claim 5 further including a cooling system housed within each of the power electronic modules. 14. The system of claim 5 further including a cooling system that is common to the plurality of power electronic modules. 15. The system of claim 5, wherein each of the power electronic modules includes a housing that at least partially houses the power component and the plurality of module contacts. 16. The system of claim 15, wherein the housing for each of the plurality of power electronic modules has a substantially same size and shape. 17. A high power drive stack system comprising: a first power electronic module comprising a first power component and a plurality of first module contacts, wherein the plurality of first module contacts are positioned based on signal type and each of the first module contacts having a different signal type are spaced apart in a first direction and the first module contacts having a common signal type are positioned spaced apart in a second direction, wherein the second direction is perpendicular to the first direction;a second power electronic module comprising a second power component and a plurality of second module contacts, wherein the plurality of second module contacts are positioned based on signal type and each of the second module contacts having a different signal type are spaced apart in the first direction and the second module contacts having the common signal type are positioned spaced apart in the second direction;a common support structure for securing the first power electronic module and the second power electronic module to the common support structure, wherein the common support structure comprising a plurality of receivers configured in the first direction to receive contacts from one power electronic module and the receivers are configured in the second direction to receive contacts of more than one power electronic module, wherein in the first direction each of the receivers is electrically isolated and in the second direction each of the receivers share the common signal type;a plurality of couplers configured to selectively couple one receiver that received first module contacts with another receiver that received second module contacts to perform one or more high power functions using the first power electronic module and the second power electronic module, wherein each coupler selectively couples receivers having the common signal type in the second direction. 18. The system of claim 17, wherein a quantity of the module contacts associated with each of the power electronic modules is based on electrical signal requirements of the one or more high power functions. 19. The system of claim 17, wherein module contacts having a common signal from one of the power electronic modules form a group for each of the common signals and at least one group has fewer module contacts than another group of module contacts on the same power electronic module. 20. The system of claim 17, wherein module contacts having a common signal from one of the power electronic modules form a group for each of the common signals and at least one group has more module contacts than another group of module contacts on the same power electronic module. 21. The system of claim 17 further including control electronics located remotely from the common support structure and the modules, wherein the control electronics are communicatively coupled to each of the modules to control the one or more high power functions. 22. The system of claim 17 further including a cooling system for each module. 23. The system of claim 17 further including a cooling system that is common to the first and second electronic modules. 24. The system of claim 17, additionally including a plurality of receiver contacts, wherein one of the plurality of receiver contacts is secured to one of the plurality of receivers and the receiver contact is configured to matingly engage with the first or second module contacts to facilitate coupling one of the first power electronic module or the second power electronic module to the common support structure. 25. The system of claim 17, wherein the power electronic modules are stacked together and secured to the common support structure. 26. The system of claim 25, wherein the common support structure is a rack. 27. The system of claim 25, wherein each of the module contacts received at one of the plurality of receivers corresponds to one signal type.
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