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Stackable ball grid array package

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/00
출원번호 US-0438125 (2006-05-18)
등록번호 US-RE43112 (2012-01-17)
발명자 / 주소
  • Corisis, David J.
  • Brooks, Jerry M.
  • Moden, Walter L.
출원인 / 주소
  • Round Rock Research, LLC
대리인 / 주소
    Lerner, David, Littenberg, Krumholz & Mentlik, LLP
인용정보 피인용 횟수 : 1  인용 특허 : 171

초록

A stackable FBGA package is configured such that conductive elements are placed along the outside perimeter of an integrated circuit (IC) device mounted to the FBGA. The conductive elements also are of sufficient size so that they extend beyond the bottom or top surface of the IC device, including t

대표청구항

1. A computer system having an input device, an output device, a processor connected to said input device and said output device, and a memory connected to said processor, comprising: said memory comprising a memory module connected to said processor, said memory module including: a ball grid array,

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이 특허를 인용한 특허 (1)

  1. Masuda, Naomi, Flip-chip package covered with tape.
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