초록 ▼

A device for air-cooling an electronic apparatus, where a suction opening (4) is provided in a housing (1), discharge openings (5) are provided in housings (1, 2), an airflow passing the inside of the housings is generated by a fan (6), and heat produced by a heart-producing body (9) is released to

A device for air-cooling an electronic apparatus, where a suction opening (4) is provided in a housing (1), discharge openings (5) are provided in housings (1, 2), an airflow passing the inside of the housings is generated by a fan (6), and heat produced by a heart-producing body (9) is released to the outside of the housings by the airflow. Air introduction plates inclined to change the direction of the airflow are arranged at the suction opening (4), and a large number of projections are formed on the surfaces of the air introduction plates. The device for air-cooling an electronic apparatus has increased capacity for cooling a heat-producing part without increase in the size of the device, and in the device, accumulation of dust on the heat-producing part can be prevented.

대표청구항 ▼

1. A device for air-cooling an electronic apparatus, comprising: a housing provided with a hole for suction air and a discharge opening for discharge air;a heat-producing body provided in the housing;a fan for generating an airflow from the hole to the discharge opening, heat produced by the heat-pr

1. A device for air-cooling an electronic apparatus, comprising: a housing provided with a hole for suction air and a discharge opening for discharge air;a heat-producing body provided in the housing;a fan for generating an airflow from the hole to the discharge opening, heat produced by the heat-producing body being released to an outside of the housing by the airflow; anda dustproof unit sealing the hole and including a plurality of air introduction plates, a plurality of projections being formed on surfaces of the air introduction plates,wherein a suction opening to receive airflow is formed between edges of adjacent air introduction plates,wherein the air introduction plates are inclined to change a direction of the airflow entering via the suction opening,wherein the fan is arranged downstream of the airflow relative to the air introduction plates,wherein the projections formed on the surfaces of the air introduction plates on a side of the suction opening are extended in a direction of the suction opening, andwherein the projections formed on the surfaces of the air introduction plates on an opposite side of the suction opening are extended in an opposite direction of the suction opening. 2. The device for air-cooling an electronic apparatus according to claim 1, wherein a plurality of air lead-through boards inclined in a direction different from the air introduction plates is arranged at a downstream region of the air introduction plates. 3. The device for air-cooling an electronic apparatus according to claim 1, wherein at least one portion of the air introduction plates is arranged in a same direction and inclined at a prescribed angle. 4. The device for air-cooling an electronic apparatus according to claim 1, wherein the air introduction plates are constituted of resin in an integrated manner. 5. The device for air-cooling an electronic apparatus according to claim 1, further comprising a chassis for transmitting the heat produced by the heat-producing body, the chassis being arranged in the housing to divide a space of the housing, wherein the airflow travels along each of the divided spaces and is discharged via the discharge opening. 6. The device for air-cooling an electronic apparatus according to claim 1, further comprising a first portion of the air introduction plates inclined at a first angle and a second portion of the air introduction plates inclined at a second angle, wherein the first angle and the second angle have line symmetry with each other centering on a line parallel to a line between an endpoint of a first air introduction plate on the side of the suction opening and an endpoint of a second air introduction plate adjacent to the first air introduction plate on the opposite side of the suction opening. 7. The device for air-cooling an electronic apparatus according to claim 1, wherein a line between an endpoint of a first air introduction plate on the side of the suction opening and an endpoint of a second air introduction plate adjacent to the first air introduction plate on the opposite side of the suction opening is perpendicular to a line between the endpoint of the first air introduction plate on the side of the suction opening and an endpoint of the second air introduction plate on the side of the suction opening. 8. The device for air-cooling an electronic apparatus according to claim 1, wherein plural suction openings are aligned in parallel between adjacent air introduction plates. 9. A device for air-cooling an electronic apparatus, comprising: a housing provided with a hole for suction air and a discharge opening for discharge air;a heat-producing body provided in the housing;a fan for generating an airflow from the hole to the discharge opening, heat produced by the heat-producing body being released to an outside of the housing by the airflow, anda dustproof unit sealing the hole and including a plurality of air introduction plates, a plurality of projections being formed on surfaces of the air introduction plates,wherein suction openings to receive airflow are formed in parallel between edges of adjacent air introduction plates,wherein the air introduction plates are inclined to change a direction of the airflow entering via the suction openings, andwherein the fan is arranged downstream of the airflow relative to the air introduction plates. 10. The device for air-cooling an electronic apparatus according to claim 9, wherein a plurality of air lead-through boards inclined in a direction different from the air introduction plates are arranged at a downstream region of the air introduction plates. 11. The device for air-cooling an electronic apparatus according to claim 9, wherein at least one portion of the air introduction plates is arranged in a same direction and inclined at a prescribed angle. 12. The device for air-cooling an electronic apparatus according to claim 9, wherein the air introduction plates are constituted of resin in an integrated manner. 13. The device for air-cooling an electronic apparatus according to claim 9, wherein the projections formed on the surfaces of the air introduction plates on a side of the suction openings are extended in a direction of the suction openings; andwherein the projections formed on the surfaces of the air introduction plates on an opposite side of the suction openings are extended in an opposite direction of the suction openings. 14. The device for air-cooling an electronic apparatus according to claim 9, further comprising a chassis for transmitting the heat produced by the heat-producing body, the chassis being arranged in the housing to divide a space of the housing, wherein the airflow travels along each of the divided spaces and is discharged via the discharge opening. 15. The device for air-cooling an electronic apparatus according to claim 9, further comprising a first portion of the air introduction plates inclined at a first angle and a second portion of the air introduction plates inclined at a second angle, wherein the first angle and the second angle have line symmetry with each other centering on a line parallel to a line between an endpoint of a first air introduction plate on a side of the suction openings and an endpoint of a second air introduction plate adjacent to the first air introduction plate on an opposite side of the suction openings. 16. The device for air-cooling an electronic apparatus according to claim 9, wherein a line between an endpoint of a first air introduction plate on a side of the suction openings and an endpoint of a second air introduction plate adjacent to the first air introduction plate on an opposite side of the suction openings is perpendicular to a line between the endpoint of the first air introduction plate on the side of the suction openings and an endpoint of the second air introduction plate on the side of the suction openings.