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A process control method is provided for a surface mount line including a solder printer for printing solder on a surface of a substrate, a solder print inspector for inspecting the printed solder and outputting printing quality data, a mounter for mounting components on the substrate with the solder printed, a mount inspector for inspecting a state of the mounted components and outputting mounting quality data, a reflow furnace for heating the solder to solder the components to the substrate, and a soldering inspector for inspecting a state of the solde...
A process control method is provided for a surface mount line including a solder printer for printing solder on a surface of a substrate, a solder print inspector for inspecting the printed solder and outputting printing quality data, a mounter for mounting components on the substrate with the solder printed, a mount inspector for inspecting a state of the mounted components and outputting mounting quality data, a reflow furnace for heating the solder to solder the components to the substrate, and a soldering inspector for inspecting a state of the soldering and outputting soldering pass/fail data. The process control method includes: retrieving the printing quality data, the mounting quality data, and the soldering pass/fail data from a primary recorder with the printing quality data, the mounting quality data, and the soldering pass/fail data recorded therein, calculating representative data for each said component from the printing quality data, and recording the representative data, the mounting quality data, and the soldering pass/fail data for each said component in a secondary recorder; and determining whether the solder printer and the mounter need adjustment by using the data of the components with the soldering pass/fail data indicating conforming among the data recorded in the secondary recorder.
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1. A process control method for a surface mount line including a solder printer configured to print solder on a surface of a substrate, a solder print inspector configured to inspect the printed solder and outputting printing quality data, a mounter configured to mount components on the substrate with the solder printed, a mount inspector configured to inspect a state of the mounted components and outputting mounting quality data, a reflow furnace configured to heat the solder to solder the components to the substrate, and a soldering inspector configure...
1. A process control method for a surface mount line including a solder printer configured to print solder on a surface of a substrate, a solder print inspector configured to inspect the printed solder and outputting printing quality data, a mounter configured to mount components on the substrate with the solder printed, a mount inspector configured to inspect a state of the mounted components and outputting mounting quality data, a reflow furnace configured to heat the solder to solder the components to the substrate, and a soldering inspector configured to inspect a state of the soldering and outputting soldering pass/fail data, the process control method comprising: retrieving the printing quality data, the mounting quality data, and the soldering pass/fail data from a primary recorder with the printing quality data, the mounting quality data, and the soldering pass/fail data recorded therein, calculating representative data for each of the components from the printing quality data, and recording the representative data, the mounting quality data, and the soldering pass/fail data for each of the components in a secondary recorder; anddetermining whether the solder printer and the mounter need adjustment by using the data of the components with the soldering pass/fail data indicating conforming among the data recorded in the secondary recorder by a computer, whereinthe printing quality data includes numerical data representing a shape of the solder printed on each electrode of the substrate,the representative data includes statistics obtained by aggregating the numerical data for each of the components, andthe statistics includes an average and a standard deviation of the numerical data. 2. The process control method according to claim 1, wherein the determining further includes issuing an operation instruction to adjust the solder printer in response to the determination that the solder printer needs adjustment, and issuing an operation instruction to adjust the mounter in response to the determination that the mounter needs adjustment. 3. A process control method for a surface mount line including a solder printer configured to print solder on a surface of a substrate, a solder print inspector configured to inspect the printed solder and outputting printing quality data, a mounter configured to mount components on the substrate with the solder printed, a mount inspector configured to inspect a state of the mounted components and outputting mounting quality data, a reflow furnace configured to heat the solder to solder the components to the substrate, and a soldering inspector configured to inspect a state of the soldering and outputting soldering pass/fail data, the process control method comprising: retrieving the printing quality data, the mounting quality data, and the soldering pass/fail data from a primary recorder with the printing quality data, the mounting quality data, and the soldering pass/fail data recorded therein, calculating representative data for each of the components from the printing quality data, and recording the representative data, the mounting quality data, and the soldering pass/fail data for each of the components in a secondary recorder; anddetermining whether the solder printer and the mounter need adjustment by using the data of the components with the soldering pass/fail data indicating conforming among the data recorded in the secondary recorder by a computer,wherein the determining includes;defining an upper control bound and a lower control bound for each type of the components by using the data of the components with the soldering pass/fail data indicating conforming; anddetermining whether the solder printer needs adjustment by using the upper control bound and the lower control bound. 4. The process control method according to claim 3, wherein the determining by using the upper control bound and the lower control bound includes: defining a ratio of instances of which the representative data falls within the range between the upper control bound and the lower control bound versus a total number of the components processed by the solder printer; anddetermining in such a manner that , if the ratio is more than or equal to a target value, it is determined that the solder printer does not need adjustment and, if the ratio is less than the target value, it is determined whether the amount of solder is too large or too small on the basis of the representative data. 5. A process control method for a surface mount line including a solder printer configured to print solder on a surface of a substrate, a solder print inspector configured to inspect the printed solder and outputting printing quality data, a mounter configured to mount components on the substrate with the solder printed, a mount inspector configured to inspect a state of the mounted components and outputting mounting quality data, a reflow furnace configured to heat the solder to solder the components to the substrate, and a soldering inspector configured to inspect a state of the soldering and outputting soldering pass/fail data, the process control method comprising: retrieving the printing quality data, the mounting quality data, and the soldering pass/fail data from a primary recorder with the printing quality data, the mounting quality data, and the soldering pass/fail data recorded therein, calculating representative data for each of the components from the printing quality data, and recording the representative data, the mounting quality data, and the soldering pass/fail data for each of the components in a secondary recorder by a computer; anddetermining whether the solder printer and the mounter need adjustment by using the data of the components with the soldering pass/fail data indicating conforming among the data recorded in the secondary recorder by a computer,wherein the mounting quality data includes amount of displacement of a mounting position of the component from a scheduled mounting position of the component on the substrate, andwherein the determining includes determining in such a manner that a maximum and a standard deviation of the amount of displacement are compared with associated reference values for each type of the components and, if both the maximum and the standard deviation exceed the reference values, it is determined that the mounter needs adjustment. 6. A data registration program for a surface mount line including a solder printer configured to print solder on a surface of a substrate, a solder print inspector configured to inspect the printed solder and outputting printing quality data, a mounter configured to mount components on the substrate with the solder printed, a mount inspector configured to inspect a state of the mounted components and outputting mounting quality data, a reflow furnace configured to heat the solder to solder the components to the substrate, and a soldering inspector configured to inspect a state of the soldering and outputting soldering pass/fail data, the data registration program registering each of the data by causing a computer to execute: retrieving the printing quality data, the mounting quality data, and the soldering pass/fail data from a primary recorder with the printing quality data, the mounting quality data, and the soldering pass/fail data recorded therein;calculating representative data for each of the components from the printing quality data; andrecording the representative data, the mounting quality data, and the soldering pass/fail data for each of the components in a secondary recorder,wherein the printing quality data includes numerical data representing a shape of the solder printed on each electrode of the substrate, and the representative data includes statistics obtained by aggregating the numerical data for each of the components, andwherein the statistics include an average and a standard deviation of the numerical data. 7. The data registration program according to claim 6, wherein the mounting quality data includes amount of displacement of a mounting position of the component from a scheduled mounting position of the component on the substrate. 8. A method for manufacturing an electronic device with components packaged on a substrate, the method comprising: printing solder on a surface of the substrate;inspecting the printed solder and recording printing quality data in a primary recorder;mounting the components on the substrate with the solder printed;inspecting a state of the mounted components and recording mounting quality data in the primary recorder;heating the solder to solder the components to the substrate;inspecting a state of the soldering and recording soldering pass/fail data in the primary recorder;retrieving the printing quality data, the mounting quality data, and the soldering pass/fail data from the primary recorder, calculating representative data for each of the components from the printing quality data, and recording the representative data, the mounting quality data, and the soldering pass/fail data for each of the components in a secondary recorder;determining whether the solder printer and the mounter need adjustment by using the data of the components with the soldering pass/fail data indicating conforming among the data recorded in the secondary recorder by a computer; andadjusting the solder printer in response to the determination in the determining step that the solder printer needs adjustment, and adjusting the mounter in response to the determination in the determining step that the mounter needs adjustment, whereinthe printing quality data includes numerical data representing a shape of the solder printed on each electrode of the substrate, and the representative data includes statistics obtained by aggregating the numerical data for each of the components, andthe statistics include an average and a standard deviation of the numerical data. 9. The method for manufacturing an electronic device according to claim 8, wherein the adjusting includes issuing an operation instruction to adjust the solder printer in response to the determination that the solder printer needs adjustment, and issuing an operation instruction to adjust the mounter in response to the determination that the mounter needs adjustment. 10. A method for manufacturing an electronic device with components packaged on a substrate, the method comprising: printing solder on a surface of the substrate;inspecting the printed solder and recording printing quality data in a primary recorder;mounting the components on the substrate with the solder printed;inspecting a state of the mounted components and recording mounting quality data in the primary recorder;heating the solder to solder the components to the substrate;inspecting a state of the soldering and recording soldering pass/fail data in the primary recorder;retrieving the printing quality data, the mounting quality data, and the soldering pass/fail data from the primary recorder, calculating representative data for each of the components from the printing quality data, and recording the representative data, the mounting quality data, and the soldering pass/fail data for each of the components in a secondary recorder;determining whether the solder printer and the mounter need adjustment by using the data of the components with the soldering pass/fail data indicating conforming among the data recorded in the secondary recorder by a computer; andadjusting the solder printer in response to the determination in the determining step that the solder printer needs adjustment, and adjusting the mounter in response to the determination in the determining step that the mounter needs adjustment,wherein the determining includes;defining an upper control bound and a lower control bound for each type of the components by using the data of the components with the soldering pass/fail data indicating conforming; anddetermining whether the solder printer needs adjustment by using the upper control bound and the lower control bound. 11. The method for manufacturing an electronic device according to claim 10, wherein the determining by using the upper control bound and the lower control bound includes: defining a ratio of instances of which the representative data falls between the upper control bound and the lower control bound versus a total number of components processed by the solder printer; anddetermining in such a manner that, if the ratio is more than or equal to a target value, it is determined that the solder printer does not need adjustment and, if the ratio is less than the target value, it is determined whether the amount of solder is too large or too small on the basis of the representative data. 12. A method for manufacturing an electronic device with components packaged on a substrate, the method comprising: printing solder on a surface of the substrate;inspecting the printed solder and recording printing quality data in a primary recorder;mounting the components on the substrate with the solder printed;inspecting a state of the mounted components and recording mounting quality data in the primary recorder;heating the solder to solder the components to the substrate;inspecting a state of the soldering and recording soldering pass/fail data in the primary recorder;retrieving the printing quality data, the mounting quality data, and the soldering pass/fail data from the primary recorder, calculating representative data for each of the components from the printing quality data, and recording the representative data, the mounting quality data, and the soldering pass/fail data for each of the components in a secondary recorder;determining whether the solder printer and the mounter need adjustment by using the data of the components with the soldering pass/fail data indicating conforming among the data recorded in the secondary recorder by a computer; andadjusting the solder printer in response to the determination in the determining step that the solder printer needs adjustment, and adjusting the mounter in response to the determination in the determining step that the mounter needs adjustment,wherein the mounting quality data includes amount of displacement of a mounting position of the component from a scheduled mounting position of the component on the substrate,wherein the determining includes determining in such a manner that a maximum and a standard deviation of the amount of displacement are compared with associated reference values for each type of the components and, if both the maximum and the standard deviation exceed the reference values, it is determined that the mounter needs adjustment.
