IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0320922
(2009-02-09)
|
등록번호 |
US-8132660
(2012-03-13)
|
우선권정보 |
KR-10-2008-0024890 (2008-03-18) |
발명자
/ 주소 |
- Park, Chul-jun
- Shin, Yong-soo
- Hwang, Jae-woong
- Kim, Jin-gi
|
출원인 / 주소 |
- Samsung Electronics Co., Ltd.
|
대리인 / 주소 |
Harness, Dickey & Pierce, P.L.C.
|
인용정보 |
피인용 횟수 :
1 인용 특허 :
10 |
초록
▼
Provided is a system for handling a semiconductor module, the system may include a rotor, a rotational driving device, at least one insertion portion, and at least one extraction portion. The rotor may be configured to rotate clockwise and counterclockwise around a rotation axis. The rotational driv
Provided is a system for handling a semiconductor module, the system may include a rotor, a rotational driving device, at least one insertion portion, and at least one extraction portion. The rotor may be configured to rotate clockwise and counterclockwise around a rotation axis. The rotational driving device may be configured to rotate the rotor. The at least one insertion portion may be connected to the rotor and may be configured to insert a semiconductor module into a socket. The at least one extraction portion may be connected to the rotor and may be configured to extract the semiconductor module from the socket.
대표청구항
▼
1. A system for handling a semiconductor module, the system comprising: a rotor configured to rotate clockwise or counterclockwise;a rotation driving device configured to rotate the rotor;at least one insertion portion configured to insert a semiconductor module into a socket, the at least one inser
1. A system for handling a semiconductor module, the system comprising: a rotor configured to rotate clockwise or counterclockwise;a rotation driving device configured to rotate the rotor;at least one insertion portion configured to insert a semiconductor module into a socket, the at least one insertion portion connected to the rotor at a first position; andat least one extraction portion configured to extract the semiconductor module from the socket, the at least one extraction portion connected to the rotor at a second position, wherein the rotor is further configured to move the at least one insertion portion and the at least one extraction portion near the socket, wherein the insertion portion includes: an insertion portion body connected to the rotor;a movable plate connected to the insertion portion body, the movable plate configured to move up and down;a pusher on the movable plate, the pusher configured to contact an upper surface of the semiconductor module and configured to press the semiconductor module towards the socket;a gripper configured to grip both lateral surfaces of the semiconductor module, the gripper being further configured to move along a slider, the slider being on the movable plate and the slider being configured to direct the gripper towards a lateral surface of the semiconductor module;a gripper driving device in the movable plate and configured to drive the gripper; anda movable plate driving device in the insertion portion body configured to move the movable plate up and down. 2. The system of claim 1, wherein the pusher is connected to the movable plate by a screw. 3. The system of claim 1, wherein the gripper includes a gripper finger connected to a gripper body by a screw. 4. The system of claim 1, wherein the gripper includes a module groove corresponding to a lateral surface of the semiconductor module. 5. The system of claim 1, wherein the gripper driving device includes a fluid cylinder in the movable plate. 6. The system of claim 5, wherein the fluid cylinder is connected to a hydraulic pressure transferring line, the hydraulic pressure transferring line including a cylinder-shaped flow channel in the insertion portion body and a hollow rod connected to the cylinder-shaped flow channel, the hollow rod configured to move up and down together with the movable plate along a linear bush. 7. The system of claim 1, wherein the movable plate driving device is a fluid cylinder in the insertion portion body. 8. The system of claim 1, wherein the movable plate driving device includes at least two fluid cylinders in the insertion portion body, each fluid cylinder including a piston with a magnet sensor for detecting a position of the movable plate, the sensors of adjacent pistons being installed in a diagonally opposite pattern. 9. The system of claim 1, further comprising: a stopper between the movable plate and the gripper, the configured to regulate a distance between grippers. 10. The system of claim 1, further comprising: a module detection sensor in the movable plate configured to detect the semiconductor module; andan open/close detection sensor configured to detect opening and closing positions. 11. A system for handling a semiconductor module, the system comprising: a rotor configured to rotate clockwise or counterclockwise;a rotation driving device configured to rotate the rotor;at least one insertion portion configured to insert a semiconductor module into a socket, the at least one insertion portion connected to the rotor at a first position; andat least one extraction portion configured to extract the semiconductor module from the socket, the at least one extraction portion connected to the rotor at a second position, wherein the rotor is further configured to move the at least one insertion portion and the at least one extraction portion near the socket, wherein the insertion portion includes: an extraction portion body connected to the rotor;a movable plate connected to the extraction portion body, the movable plate configured to move up and down;a gripper configured to grip both lateral surfaces of the semiconductor module, the gripper being further configured move along a slider, the slider being on the movable plate and the slider being configured to direct the gripper towards a lateral surface of the semiconductor module;a gripper driving device in the movable plate and configured to drive the gripper; anda movable plate driving device in the extraction portion body configured to move the movable plate up and down. 12. The system of claim 11, wherein the gripper includes a flange corresponding to a groove formed in a surface of the semiconductor module. 13. A system for handling a semiconductor module, the system comprising: a rotor configured to rotate clockwise or counterclockwise;a rotation driving device configured to rotate the rotor;at least one insertion portion configured to insert a semiconductor module into a socket, the at least one insertion portion connected to the rotor at a first position;at least one extraction portion configured to extract the semiconductor module from the socket, the at least one extraction portion connected to the rotor at a second position, wherein the rotor is further configured to move the at least one insertion portion and the at least one extraction portion near the socket;a position confirming sensor in the rotor, the position confirming sensor including a light emitting unit configured to output an optical signal to confirm a position of the socket and a light receiving unit configured to receive the optical signal that passes through a through hole of a jig to be reflected on a alignment point; anda controlling unit configured to receive a position signal from the position confirmation sensor and configured to send a rotation controlling signal to the rotation driving device. 14. The system of claim 13, wherein the rotation driving device is a driving motor.
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