IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0922979
(2006-06-30)
|
등록번호 |
US-8135466
(2012-03-13)
|
국제출원번호 |
PCT/US2006/026000
(2006-06-30)
|
§371/§102 date |
20090306
(20090306)
|
국제공개번호 |
WO2007/005842
(2007-01-11)
|
발명자
/ 주소 |
- Fuller, Thomas A.
- Wysk, Richard A.
- Sebastianelli, Wayne J.
|
출원인 / 주소 |
- ArgentumCidalElectrics, Inc.
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
5 인용 특허 :
35 |
초록
▼
A medical implant system is described for inhibiting infection associated with a joint prosthesis implant. An inventive system includes an implant body made of a biocompatible material which has a metal component disposed on an external surface of the implant body. A current is allowed to flow to th
A medical implant system is described for inhibiting infection associated with a joint prosthesis implant. An inventive system includes an implant body made of a biocompatible material which has a metal component disposed on an external surface of the implant body. A current is allowed to flow to the metal component, stimulating release of metal ions toxic to microbes, such as bacteria, protozoa, fungi, and viruses. One detailed system is completely surgically implantable in the patient such that no part of the system is external to the patient while the system is in use. In addition, externally controlled devices are provided which allow for modulation of implanted components.
대표청구항
▼
1. A medical implant system, comprising: an implant body made of a biocompatible material, the implant body having an external surface;a metal component containing an antimicrobial metal disposed on the external surface of the implant body;a power source having a first terminal and a second terminal
1. A medical implant system, comprising: an implant body made of a biocompatible material, the implant body having an external surface;a metal component containing an antimicrobial metal disposed on the external surface of the implant body;a power source having a first terminal and a second terminal, one of the terminals being in electrical communication with the metal component; andan insulator placed in a current path between the first terminal of the power source and the second terminal of the power source preventing current flowing from the first terminal from reaching the second terminal without completing a circuit including a conductive body tissue or fluid adjacent to the external surface of the implant system when implanted. 2. A medical implant system, comprising: an implant body made of a biocompatible material, the implant body having a first element having a first external surface and a second element having a second external surface;a first metal component containing an antimicrobial metal disposed on the first external surface of the implant body;a power source having a first terminal and a second terminal, the first terminal in electrical communication with the first metal component; andan insulator placed in a current path between the first terminal of the power source and the second terminal of the power source preventing current flowing from the first terminal from reaching the second terminal without completing a circuit including a conductive body tissue or fluid adjacent to the external surface of the implant system when implanted. 3. A medical implant system, comprising: an implant body made of a biocompatible material, the implant body having a main body portion having a first external surface and an internal cavity, the internal cavity having a wall and an opening, the implant body having a cap portion removably disposed in the opening of the internal cavity, the cap portion having a second external surface;an antimicrobial metal-containing coating disposed on the first external surface of the main body portion;a power source disposed in the internal cavity, the power source having a first terminal and a second terminal, the first terminal in electrical communication with the antimicrobial metal-containing coating; andan insulator placed in a current path between the first terminal of the power source and the second terminal of the power source preventing current flowing from the first terminal from reaching the second terminal without completing a circuit including a conductive body tissue or fluid adjacent to the external surface of the implant system when implanted. 4. A medical implant system, comprising: a support structure for supporting at least two orthopedic fixators, the support structure adapted to secure the at least two orthopedic fixators to the support;a first orthopedic fixator supported by the support structure, the first fixator having a first external surface;a second orthopedic fixator supported by the support structure, the second fixator having a second external surface;a first metal component containing an antimicrobial metal disposed on the first external surface of the first fixator;a power source having a first terminal and a second terminal, the first terminal in electrical communication with the first metal component; andan insulator disposed on the support structure in a current path between the first terminal of the power source and the second terminal of the power source preventing current flowing from the first terminal from reaching the second terminal without completing a circuit including a conductive body tissue or fluid adjacent to the external surface of the first fixator when implanted. 5. The medical implant system of claim 1, 2, 3 or 4 wherein the implant body further comprises: an internal cavity, the internal cavity having a wall and an opening; anda cap removably disposed in the opening of the internal cavity, wherein the power source is disposed in the internal cavity. 6. The medical implant system of claim 1, 2, 3 or 4 adapted to be disposed totally within a human body when in use. 7. The medical implant system of claim 5, further comprising a second metal component disposed on a portion of the internal cavity wall. 8. The medical implant system of claim 1, 2, 3 or 4 wherein the metal component comprises a metal selected from the group consisting of: silver; copper; both silver and copper; both silver and cadmium; both copper and cadmium; and a combination of silver, copper and cadmium. 9. The medical implant system of claim 1, 2, 3 or 4 wherein the metal component comprises a metal selected from the group consisting of: gold, zinc, cobalt, nickel, platinum, palladium, manganese, chromium; and a combination thereof. 10. The medical implant system of claim 1, 2, 3 or 4 wherein the metal component is a coating disposed on the external surface of the implant body. 11. The medical implant system of claim 10, wherein the metal coating ranges in thickness between 1×10−9-5×10−3 meters. 12. The medical implant system of claim 10, wherein the metal coating is disposed on a portion of the external surface of the implant body ranging from 1-100% of the external surface of the implant body, excluding any portion of the external surface occupied by the insulator. 13. The medical implant system of claim 10 wherein the metal coating is disposed on a portion of the external surface of the implant body ranging from 50-99% of the external surface of the implant body. 14. The medical implant system of claim 10, wherein the metal coating is disposed as two or more regions of coating on the external surface of the implant body, at least one region of coating in electrical communication with the first terminal and at least one region of coating in electrical communication with the second terminal, wherein the insulator is placed in the current path between the first terminal of the power source and the second terminal of the power source and wherein the insulator electrically insulates the two or more regions of coating from each other. 15. The medical implant system of claim 10, wherein the implant body comprises an articular surface having no coating. 16. The medical implant system of claim 10, wherein the metal component is in the form of a wire disposed on the external surface. 17. The medical implant system of claim 1, 2, 3 or 4 wherein the metal component is more electrically conductive than the biocompatible material. 18. The medical implant system of claim 1, 2, 3 or 4 further comprising a resistor in electrical communication with the power source. 19. The medical implant system of claim 1, 2, 3 or 4 further comprising a switch in electrical communication with the power source. 20. The medical implant system of claim 19, further comprising a controller in signal communication with the switch. 21. The medical implant system of claim 5, wherein at least a portion of the cap in contact with the wall of an internal cavity forms at least a portion of the insulator. 22. The medical implant system of claim 20, wherein the controller is external to the body of an individual having an implant body disposed therein. 23. The medical implant system of claim 1, 2, 3 or 4 wherein the implant body is a selected from the group consisting of: a joint replacement implant body, a fixation device, a spacer, and a combination thereof. 24. The medical implant system of claim 2, 3 or 4 further comprising a second metal component containing an antimicrobial metal disposed on the second external surface, wherein the second terminal is in electrical communication with the second metal component and wherein the insulator insulates the first metal component from the second metal component. 25. The medical implant system of claim 2, 3, 4, or 24 wherein the first metal component, the second metal component, or both the first metal component and the second metal component, is a metal-containing coating. 26. The medical implant system of claim 5, further comprising an electrical conductor disposed on a portion of the internal cavity wall. 27. The medical implant system of claim 5, wherein a portion of the cap in contact with the wall of an internal cavity is made of an electrically insulating material preventing current flowing from the first terminal of the power source from reaching the second terminal of the power source without completing a circuit including a conductive body tissue or fluid adjacent to the external surface of the implant system when implanted. 28. The medical implant system of claim 3, wherein the cap comprises a protruding portion, the internal cavity comprises a threaded surface and the insulator comprises a screw thread insert, and wherein the protruding portion of the cap interacts with the screw thread insert to form a male connector for reciprocal interaction of the threaded surface of the internal cavity and the male connector. 29. A method for inhibiting microbial infection associated with an orthopedic implant, comprising: providing a medical implant system according to claim 1, 2, 3 or 4;delivering a current to a metal component disposed on an external surface of an implant body, the implant body located in a human body at a site of potential infection, wherein the delivery of current to the metal component causes release of metal ions toxic to an infectious microbe at the site of potential infection, such that microbial infection is inhibited. 30. The method of claim 29 wherein the metal component comprises an antimicrobial metal selected from the group consisting of: silver; copper; both silver and copper; both silver and cadmium; both copper and cadmium; and a combination of silver, copper and cadmium. 31. The method of claim 30 wherein the infectious microbe is a Gram positive bacterium and the metal component comprises an antimicrobial metal selected from the group consisting of: silver; copper; both silver and copper; both silver and cadmium; both copper and cadmium; and a combination of silver, copper and cadmium. 32. The method of claim 30 wherein the infectious microbe is a Gram negative bacterium and the metal component comprises an antimicrobial metal selected from the group consisting of: copper; and both copper and cadmium. 33. The method of claim 30 wherein the infectious microbe is a fungus and the metal component comprises an antimicrobial metal selected from the group consisting of: silver; and both silver and copper.
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