초록

An electronic housing assembly is formed with an environmental seal (20), EMI control (56) and a good thermal coupling (44, 46) made between enclosed hot electric components (48, 50) and an exterior heat sink (52, 54).

대표청구항 ▼

1. An electronic assembly comprising: a housing having a first housing portion (10) and a second housing portion (12), said first housing portion (10) and said second housing portion (12) being substantially quadrangular in configuration and each including concave portions (14, 16);a peripheral groo

1. An electronic assembly comprising: a housing having a first housing portion (10) and a second housing portion (12), said first housing portion (10) and said second housing portion (12) being substantially quadrangular in configuration and each including concave portions (14, 16);a peripheral groove (18) formed in said second housing portion (12);an O-ring (20) positioned in said groove (18);a depending peripheral flange (22) formed on said first housing portion (10) for engaging said O-ring (20) when said portions are mated;at least one first upstanding wall (24) formed in said first housing portion (10) and at least one second upstanding wall (26) formed in said second housing portion (12), said walls being in opposition to one another and defining a space therebetween;a printed circuit board (28) positioned between said wall (24) in said first housing portion (10) and said wall (26) in said second housing portion (12), said printed circuit board (28) having first and second surfaces (30, 32);a first peripheral electrical conductor (34) formed on said first surface (30) and a second peripheral electrical conductor (36) formed on said second surface (32) and in contact with said first upstanding wall (24) and said second upstanding wall (26);at least one electrical conductor (38) extending through said printed circuit board (28) and in electrical contact with said peripheral electrical conductors (34, 36) formed on said first and second surfaces (30, 32); anda plurality of retainers (40) passing through said first half housing portion (10) and into said second housing portion (12),whereby pressure is applied to said printed circuit board (28) for maintaining said printed circuit board (28) in its desired location and electromagnetic interference is suppressed by virtue of the contact between said peripheral electrical conductors (34, 36) and said first and second halves housing portions (10, 12), wherein said first peripheral electrical conductor (34) and said second peripheral electrical conductor (36) extend substantially about the entire periphery of said printed circuit board (28). 2. The electronic assembly of claim 1 wherein said printed circuit board (28) includes at least one heat generating component (42), said heat generating component (42) having thermal transferring media (44, 46) placed between the component (42) and the printed circuit board (28). 3. The electronic assembly of claim 1 wherein said printed circuit board (28) includes electrical components (48, 50) and said electrical components are isolated from said first and second housing portions by air gaps (52, 54). 4. The electronic assembly of claim 1 wherein said printed circuit board (28) contains a ferrite component (56) comprising two ferrite portions (58, 60), said ferrite portions (58, 60) being joined together by a spring clip (62) that includes at least two leaf springs (64) in contact with a surface of one of said first housing portion (10) or said second housing portion (12).