$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Method for conditioning a cooling loop of a heat exchange system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28D-015/00
  • F16F-001/34
  • F28G-001/12
출원번호 US-0711440 (2007-02-26)
등록번호 US-8141620 (2012-03-27)
발명자 / 주소
  • Zrodnikov, Volodymyr
  • Kerner, James M.
  • Spokoiny, Michael
출원인 / 주소
  • United States Thermoelectric Consortium (USTC)
대리인 / 주소
    The Webostad Firm
인용정보 피인용 횟수 : 8  인용 특허 : 36

초록

Use of an inert gas in a fluid-operated heat exchange system. A cooling loop of a heat exchange system is purged with an inert gas to remove oxygen from the cooling loop. Coolant is added to the cooling loop of the heat exchange system. The coolant flows in the cooling loop of the heat exchange syst

대표청구항

1. A method for conditioning a cooling loop of a heat exchange system, comprising: first purging the cooling loop of the heat exchange system with a first inert gas to remove some oxygen from the cooling loop;adding coolant to the cooling loop of the heat exchange system;flowing the coolant in the c

이 특허에 인용된 특허 (36)

  1. McDunn Kevin J. ; Limper-Brenner Linda ; Press Minoo D., Apparatus for spray-cooling multiple electronic modules.
  2. Kamath, Vinod; Loebach, Beth Frayne; Matteson, Jason Aaron; Mansuria, Mohanlal S., Apparatus having forced fluid cooling and pin-fin heat sink.
  3. Novotny Shlomo D. (Wayland MA), Closed-cycle expansion-valve impingement cooling system.
  4. Ahn Tae-Bong,KRX, Cooling apparatus for electronic systems and computer systems with such apparatus.
  5. Chu, Richard C.; Ellsworth, Jr., Micheal J.; Simons, Robert E., Cooling system and cooled electronics assembly employing partially liquid filled thermal spreader.
  6. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Cooling system and method employing a closed loop coolant path and micro-scaled cooling structure within an electronics subsystem of an electronics rack.
  7. Jacoby John H. (Jackson Pond Rd. New Hampton NH 03256), Dimpled heat transfer surface and method of making same.
  8. Carter, Daniel P.; Crocker, Michael T.; Broili, Ben M.; Byquist, Tod A.; Llapitan, David J., Electronic assemblies with high capacity curved fin heat sinks.
  9. Richard C. Chu ; Michael J. Ellsworth, Jr. ; Robert E. Simons, Electronic module with integral refrigerant evaporator assembly and control system therefore.
  10. Chao-Fan Chu Richard (Poughkeepsie NY) Ellsworth ; Jr. Michael J. (Poughkeepsie NY) Goth Gary F. (Pleasant Valley NY) Simons Robert E. (Poughkeepsie NY) Zumbrunnen Michael L. (Poughkeepsie NY), Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels.
  11. Herbert Bimboes DE; Harald Raiser DE; Wolfgang Schmidt DE; Michael Sickelmann DE, Filling device for motor vehicle air-conditioning systems.
  12. Chu, Richard C.; Ellsworth, Jr., Michael J.; Simons, Robert E., Fin heat sink and airflow tube assembly employing annular airflows, and methods of fabrication thereof.
  13. Cannell, Michael J.; Cooley, Roger; Garman, Richard W.; Green, Geoffrey; Harrison, Peter N.; Walters, Joseph D., Fluid-cooled heat sink with turbulence-enhancing support pins.
  14. Gregory T. Wyler ; Peter B. Favini ; Blaine C. Wotring ; Bibek Chapagain, Folded fin heat sink and fan attachment.
  15. Cray Seymour R. (Colorado Springs CO) Sherwood Gregory J. (Colorado Springs CO), Gas-liquid forced turbulence cooling.
  16. Gabriel Rouchon, Heat dissipating device.
  17. Gedamu, Elias; Man, Denise, Heat dissipation apparatus and method.
  18. William B. Rife, Heat dissipation device with threaded fan module.
  19. Daman Ernest L. (Westfield NJ) McCallister Robert A. (Mountain Lakes NJ), Heat exchanger.
  20. Feenstra Sean D., Heat sink utilizing the chimney effect.
  21. Despois Jacques (Viroflay FRX) Nougarede Francis (La Celle Saint Cloud FRX), Heat transfer system for the utilization of cavities dug in the subsoil as heat silos.
  22. Tilton Donald E. (Kent WA) Tilton Charles L. (Kent WA), High heat flux evaporative spray cooling.
  23. Clark William E. (401 Hyder St. ; N.E. Palm Bay FL 32907), Liquid-cooled, flat plate heat exchanger.
  24. Anderson Timothy M. (Poughkeepsie NY) Chrysler Gregory M. (Poughkeepsie NY) Chu Richard C. (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY), Local condensation control for liquid impingement two-phase cooling.
  25. Kenny,Thomas W.; Munch,Mark; Zhou,Peng; Shook,James Gill; Upadhya,Girish; Goodson,Kenneth; Corbin,Dave; McMaster,Mark; Lovette,James, Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device.
  26. Kenny,Thomas W.; Munch,Mark; Zhou,Peng; Shook,James Gill; Upadhya,Girish; Goodson,Kenneth; Corbin,David, Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device.
  27. Sapp Jesse M. (Louisville GA), Methods and apparatus for cleaning refrigeration equipment.
  28. Ku, Shih-Chang, Multi-opening heat-dissipation device for high-power electronic components.
  29. Ward Terence G. ; Downer Scott D., Pin fin heat sink and pin fin arrangement therein.
  30. Burgener David (Elmhurst IL), Process to clean a lubricated vapor compression refrigeration system by using carbon dioxide.
  31. Wijmans Johannes G. (Menlo Park CA) Baker Richard W. (Palo Alto CA), Refrigeration process with purge and recovery of refrigerant.
  32. Wakita Katsuya,JPX ; Kawakami Tetsuji,JPX ; Nakajima Keizo,JPX ; Sato Shigehiro,JPX ; Ozaki Yusuke,JPX ; Sonoda Nobuo,JPX, Refrigeration system and method of installing same.
  33. Lofredo Antony (Springfield NJ), Removing radioactive noble gases from nuclear process off-gases.
  34. Tantoush, Mohammad A., Scalable and modular heat sink-heat pipe cooling system.
  35. Kieda Shigekazu (Ishioka JPX) Nakajima Tadakatsu (Ibaraki JPX) Kuwahara Heikichi (Ibaraki JPX) Sato Motohiro (Ibaraki JPX), Semiconductor cooling device.
  36. Kerner James M. (779 Hillgrove Chico CA 95926), Thermoelectric closed-loop heat exchange system.

이 특허를 인용한 특허 (8)

  1. Shedd, Timothy A.; Lindeman, Brett A., Flexible two-phase cooling system.
  2. Shedd, Timothy A.; Meives, Mark S., Fluid distribution unit for two-phase cooling system.
  3. Shedd, Timothy A.; Lindeman, Brett A., Heat sink module.
  4. Shedd, Timothy A., Method of absorbing sensible and latent heat with series-connected heat sinks.
  5. Shedd, Timothy A.; Lindeman, Brett A., Method of cooling series-connected heat sink modules.
  6. Shedd, Timothy A.; Lindeman, Brett A.; Buchanan, Robert A., Microprocessor assembly adapted for fluid cooling.
  7. Lu, Qiao; Godecker, William, Refrigeration systems and methods for connection with a vehicle's liquid cooling system.
  8. Adamson, Gary A.; Cho, Wei-Lin, Two-phase thermal loop with membrane separation.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로