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Hybrid composite wafer carrier for wet clean equipment

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B23Q-003/00
출원번호 US-0743516 (2007-05-02)
등록번호 US-8146902 (2012-04-03)
발명자 / 주소
  • Cheng, Wing Lau
  • Cheng, legal representative, Helen
  • Kholodenko, Arnold
출원인 / 주소
  • Lam Research Corporation
대리인 / 주소
    Martine Penilla Group, LLP
인용정보 피인용 횟수 : 0  인용 특허 : 100

초록

A carrier structure for supporting a substrate when being processed by passing the carrier through a meniscus formed by upper and lower proximity heads is described. The carrier includes a frame having an opening sized for receiving a substrate and a plurality of support pins for supporting the subs

대표청구항

1. A carrier for supporting a substrate, the carrier comprising: a frame having a top surface, a bottom surface and six sides, wherein a first side and a second side are parallel to each other and have thickened edges, third and fourth sides and fifth and sixth sides are respectively defined between

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