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A method for electrically interconnecting two substrates, each having a corresponding set of preformed electrical contacts, the substrates comprising an electronic circuit, and the resulting module, is provided. A liquid curable adhesive is provided over the set of contacts of a first substrate, and

A method for electrically interconnecting two substrates, each having a corresponding set of preformed electrical contacts, the substrates comprising an electronic circuit, and the resulting module, is provided. A liquid curable adhesive is provided over the set of contacts of a first substrate, and the set of electrical contacts of the second substrate is aligned with the set of electrical contacts of the first substrate. The sets of electrical contacts of the first and second substrate are compressed to displace the liquid curable adhesive from the inter-contact region, and provide electrical communication between the respective sets of electrical contacts. The liquid curable adhesive is then cured to form a solid matrix which maintains a relative compression between the respective sets of electrical contacts. One embodiment of the module comprises a high-speed superconducting circuit which operates at cryogenic temperatures.

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1. A method for electrically interconnecting two substrates, each having a corresponding set of preformed electrical contacts, at least one of the substrates comprising a functional superconducting electronic circuit, comprising: providing a liquid curable adhesive over the set of contacts of a firs

1. A method for electrically interconnecting two substrates, each having a corresponding set of preformed electrical contacts, at least one of the substrates comprising a functional superconducting electronic circuit, comprising: providing a liquid curable adhesive over the set of contacts of a first substrate, wherein the liquid curable adhesive comprises an adhesive which maintains mechanical integrity down to cryogenic temperatures, has a positive coefficient of thermal expansion when cured, and a viscosity at 20C of less than about 10,000 cp;aligning the set of electrical contacts of the second substrate with the set of electrical contacts of the first substrate;compressing the sets of electrical contacts of the first and second substrates to displace the liquid curable adhesive and provide electrical communication between the respective sets of electrical contacts; andcuring the liquid curable adhesive to form a stable solid matrix which maintains a relative compression, and electrical conductivity between, the respective sets of electrical contacts over at least a range of temperatures between about +50C to −175C. 2. The method according to claim 1, wherein the liquid curable adhesive comprises an epoxy adhesive. 3. The method according to claim 1, wherein the liquid curable adhesive is substantially unfilled. 4. The method according to claim 1, wherein said compressing step comprises imposing a pressure of between about 5-100 gm per contact pair. 5. The method according to claim 1, wherein said compressing step comprises plastically deforming a metal on each of the set of contacts of at least one of the first and second substrate. 6. The method according to claim 1, wherein the sets of contacts comprises at least 20 contacts each, and wherein each of the contacts of the respective sets forms a conductive path between the first and second substrate. 7. The method according to claim 1, further comprising the step of heating the liquid curable adhesive to a temperature of between about 40C and 100C during curing, wherein a maximum process temperature is less than about 120C. 8. The method according to claim 1, wherein the liquid curable adhesive shrinks during curing. 9. The method according to claim 1, wherein the first and second substrates have matched coefficients of thermal expansion, and the cured adhesive has a substantially mismatched coefficient of thermal expansion with respect to the first and second substrates. 10. The method according to claim 1, wherein the liquid curable adhesive is removable after curing. 11. The method according to claim 1, wherein the functional superconducting electronic circuit comprises a superconducting integrated circuit device. 12. The method according to claim 1, wherein the functional superconducting electronic circuit comprises at least one rapid single flux quantum gate. 13. The method according to claim 1 wherein the two substrates are components of an electronic multichip module having at least two electrically interconnected substrates, at least one of the substrates having a deformable metal in a contact region, said compressing comprising compressing the sets of electrical contacts of the first and second substrates to deform the deformable metal and exclude liquid curable adhesive from an intercontact zone;further comprising operating a superconducting device on at least one of the electrically interconnected substrates at cryogenic temperatures. 14. The method according to claim 1, wherein the compressed sets of electrical contacts are configured for electrically communication single-flux-quantum pulses having a data rate of at least 20 GHz. 15. The method according to claim 1, wherein the solid matrix maintains a relative compression and electrical conductivity between the respective sets of electrical contacts when subject to repeated thermal cycling between a temperature less than −175C to a temperature of at least 20C and back again to less than −175C. 16. The method according to claim 1, wherein at least one set of preformed electrical contacts have a diameter of 30-100 μm and a height of 10-70 μm. 17. The method according to claim 1, wherein the electrical contacts have a diameter of 30 μm and a relative spacing of 80 μm. 18. The method according to claim 1, wherein at least one substrate comprises a multichip module. 19. The method according to claim 1, wherein the adhesive is selected so as to wet silicon dioxide. 20. The method according to claim 11, wherein the superconducting integrated circuit comprises the metal niobium. 21. The method according to claim 13, further comprising the step of heating the liquid curable adhesive to a temperature of less than about 100C during curing, wherein a maximum process temperature is less than about 120C, wherein: the liquid curable adhesive comprises an epoxy adhesive which shrinks during curing, and has a positive coefficient of thermal expansion when cured, the first and second substrates have matched coefficients of thermal expansion, and the cured adhesive has a substantially mismatched coefficient of thermal expansion with respect to the first and second substrates,said compressing step comprises imposing a pressure of between about 5-100 gm per contact pair, andthe electronic circuit comprises at least one rapid single flux quantum gate. 22. The method according to claim 14, wherein the compressed sets of contacts are configured for electrical communication of electrical pulses representing bits of a digital signal, having a bit error rate maintained at a level less than 5×10−14. 23. A method for electrically interconnecting two substrates, comprising: providing a first substrate and a second substrate each having preformed a set of exposed electrical contacts;dispensing a liquid curable adhesive over at least one exposed sets of exposed electrical contacts, wherein the liquid curable adhesive comprises an adhesive which maintains mechanical integrity down to cryogenic temperatures, has a positive coefficient of thermal expansion when cured, and a viscosity at 20C of less than about 10,000 cp;aligning the set of exposed electrical contacts of the second substrate with the set of exposed electrical contacts of the first substrate;compressing the sets of exposed electrical contacts of the first and second substrates, to displace the liquid curable adhesive from locations where the exposed sets of contacts of the first substrate and the second substrate are aligned, to provide electrical communication between the respective aligned sets of exposed electrical contacts; andcuring the liquid curable adhesive surrounding the aligned sets of exposed electrical contacts to form a stable solid matrix which maintains a relative compression, and electrical conductivity between, the respective sets of electrical contacts over at least a range of temperatures between about +50C to −175C, substantially without fusing the aligned sets of exposed electrical contacts. 24. The method according to claim 23, wherein the adhesive is further selected so as not to wet the electrical contacts. 25. The method according to claim 23, wherein the cryogenically stable liquid curable adhesive is dispensed in a layer less than about 100 microns thick, wherein the liquid curable adhesive is distributed over a bonding area encompassing the at least one set of exposed electrical contacts without voids; and wherein the liquid curable adhesive is readily squeezed from an intercontact space between respectively aligned exposed contacts of the first and second substrates, substantially without redistributing forces at contact points of respective exposed electrical contacts, said compressing being sufficient to plastically deform the respective aligned sets of exposed electrical contacts. 26. The method according to claim 25, wherein the liquid curable adhesive comprises a substantially unfilled epoxy adhesive, which prior to curing has a viscosity at 20C of less than about 1000 cp, wets silicon dioxide, and does not wet the sets of electrical contacts, and subsequent to curing, shrinks, has a positive coefficient of thermal expansion, and maintains mechanical integrity down to 9K, wherein said curing has a maximum process temperature of less than 120C.