초록 ▼

An implantable medical device is provided including a housing, an external circuit element extending outwardly from the housing, an internal circuit enclosed by the housing, a feedthrough array disposed along the housing having at least one filtered feedthrough and at least one unfiltered feedthroug

An implantable medical device is provided including a housing, an external circuit element extending outwardly from the housing, an internal circuit enclosed by the housing, a feedthrough array disposed along the housing having at least one filtered feedthrough and at least one unfiltered feedthrough, wherein the unfiltered feedthrough is adapted for connection to the outwardly extending circuit element; and including means for minimizing electromagnetic coupling between the filtered feedthrough and the unfiltered feedthrough.

대표청구항 ▼

1. A feedthrough array, comprising: an electrically conductive ferrule having an inner surface forming an aperture;at least one filtered feedthrough extending through the ferrule and electrically insulated from the ferrule;at least one unfiltered feedthrough comprising a conductive pin extending thr

1. A feedthrough array, comprising: an electrically conductive ferrule having an inner surface forming an aperture;at least one filtered feedthrough extending through the ferrule and electrically insulated from the ferrule;at least one unfiltered feedthrough comprising a conductive pin extending through the ferrule aperture and electrically insulated from the ferrule, the conductive pin comprising a first portion extending within the ferrule aperture and a second portion extending from the first portion; andmeans for minimizing electromagnetic coupling between the filtered feedthrough and the unfiltered feedthrough comprising a shield member having an electrically-grounded, conductive surface and extending along the second portion between the filtered and the unfiltered feedthroughs at a spaced apart distance from the second portion. 2. The feedthrough array of claim 1 wherein the means for minimizing electromagnetic coupling includes an insulating surface between the electrically grounded conductive surface and the second portion of the unfiltered feedthrough pin. 3. The feedthrough array of claim 1 wherein the shield member includes a generally cylindrical insulating member having an inner surface forming a feedthrough pin lumen and the electrically-grounded, conductive surface comprises an outer surface of the insulating member coated with a conductive coating. 4. The feedthrough array of claim 3 wherein the shield member is designed to function as a transmission line having an input impedance matching an impedance of a component coupled to an outwardly extending end of the unfiltered feedthrough pin. 5. The feedthrough array of claim 1, wherein means for minimizing electromagnetic coupling further comprises an insulator extending within the spaced apart distance between the conductive surface and the second portion. 6. The feedthrough array of claim 1, further comprising an insulating seal positioned in the aperture, and wherein the shield member includes an outwardly facing end surface positioned along the insulating seal, and further including an insulator disposed between the outwardly facing end surface of the shield member and the insulating seal. 7. The feedthrough array of claim 1, further comprising an insulating seal positioned in the aperture, and wherein the shield member includes an outwardly extending end surface bonded to the insulating seal. 8. The feedthrough array of claim 3 wherein the insulating member is provided with a generally C-shaped cross-section. 9. The feedthrough array of claim 1 wherein the shield member comprises a metallic material having an inner surface located at the spaced-apart distance from the unfiltered feedthrough pin and an insulative coating on the inner surface. 10. The feedthrough array of claim 1, wherein the means for minimizing electromagnetic coupling further comprises an insulating layer extending between the conductive surface and the second portion of the unfiltered feedthrough pin along the spaced-apart distance and comprising an adhesive to couple an inner surface of the insulating layer to the unfiltered feedthrough pin. 11. The feedthrough array of claim 3 wherein the generally cylindrical member includes a central axis and the feedthrough pin lumen is positioned off the central axis. 12. The feedthrough array of claim 1, further comprising a capacitive filter array, the at least one filtered feedthrough extending through the capacitive filter array, the filter array having an end surface adjacent the unfiltered feedthrough and wherein the electrically-grounded, conductive surface extends between the end surface and the unfiltered feedthough. 13. The feedthrough array of claim 1, further comprising a capacitive filter array having an outer surface, the at least one filtered feedthrough extending through the capacitive filter array, and further including means for minimizing the effects of inductive impedance comprising a conductive joint extending along an inner surface of the ferrule and at least one of an outer surface of the shield member and an outer surface of the capacitive filter array. 14. The feedthrough array of claim 1 wherein the means for minimizing electromagnetic coupling comprises a shielded conductor extending along the second portion toward internal circuitry enclosed in a hermetically sealed housing, the shielded conductor comprising the unfiltered feedthrough pin second portion as an active conductor. 15. The feedthrough array of claim 1 wherein the means for minimizing electromagnetic coupling includes a metallic shield extending inwardly from the electrically conductive ferrule along the second portion of the unfiltered feedthrough pin between the unfiltered feedthrouqh and the at least one filtered feedthrough. 16. The feedthrough array of claim 1 the means for minimizing electromagnetic coupling includes a shield plate electrically coupled to the ferrule and extending inwardly there from, between the filtered feedthrough and the unfiltered feedthrough. 17. The feedthrough array of claim 16 wherein the shield plate includes a side surface facing the unfiltered feedthrough and the side surface is provided with an insulating coating. 18. The feedthrough array of claim 1 further including an electronics module assembly and wherein the means for minimizing electromagnetic coupling includes a shield plate extending outwardly from the electronics module assembly between the filtered feedthrough and the unfiltered feedthrough. 19. The feedthrough array of claim 1 wherein the means for minimizing electromagnetic coupling includes a shielding manifold extending along at least a portion of the filtered feedthrough. 20. The feedthrough array of claim 19 wherein the shielding manifold includes a capacitive filter. 21. The feedthrough array of claim 19 wherein the shielding manifold includes an end surface adjacent the unfiltered feedthrough and the end surface is provided with an electrically conductive coating. 22. The feedthrough array of claim 19 further including an electronics module assembly and wherein the shielding manifold extends inwardly from the electronics module assembly. 23. The feedthrough array of claim 22 further including a second shielding manifold extending outwardly from the electronics module assembly. 24. The feedthrough array of claim 19 wherein the shielding manifold includes an inner wall forming a feedthrough pin lumen and wherein the inner wall includes a ferrite lining. 25. The feedthrough array of claim 1 further including at least one filtered feedthrough contact pad and wherein the means for minimizing electromagnetic coupling includes a substrate for the filtered contact pad formed from a dielectric material. 26. The feedthrough array of claim 25 wherein the filtered contact pad substrate includes an embedded capacitive filter. 27. The feedthrough array of claim 25 wherein the filtered contact pad substrate includes an end surface adjacent the unfiltered feedthrough and the end surface is provided with an electrically conductive coating. 28. The feedthrough array of claim 1 wherein the means for minimizing electromagnetic coupling comprises a material including ferrite. 29. The feedthrough array of claim 1 wherein the means for minimizing electromagnetic coupling includes means for minimizing radiation from the unfiltered feedthrough comprising one of a ferrite material and a shielded conductor electrically coupled to internal circuitry of an implantable medical device and incorporating the unfiltered feedthrough pin. 30. The feedthrough array of claim 1 further comprising a ground line providing a ground path to a medical device housing. 31. The feedthrough array of claim 14 wherein the means for minimizing electromagnetic coupling includes one of: a coaxial cable, a strip line conductor, and a microstrip line conductor. 32. The feedthrough array of claim 1 further comprising: a capacitive filter array disposed within the ferrule;the at least one filtered feedthrough extending through the capacitive filter array,the at least one unfiltered feedthrough not extending through the capacitive filter array.