초록 ▼

The bottom mold portion for a transfer molding system is covered with a deformable material. During mold clamping, the deformable material contacts the bottom surface of the packaging substrate on which the integrated circuit die is mounted. Deformation of this relatively soft covering on the bottom

The bottom mold portion for a transfer molding system is covered with a deformable material. During mold clamping, the deformable material contacts the bottom surface of the packaging substrate on which the integrated circuit die is mounted. Deformation of this relatively soft covering on the bottom mold portion accommodates thickness variations in the packaging substrate, as well as non-planarity of the adhesive layer between the integrated circuit die and packaging substrate in exposed active area integrated circuits.

대표청구항 ▼

1. A method of packaging integrated circuits comprising: clamping an upper mold portion and a lower mold portion around an integrated circuit die mounted on an upper surface of a packaging substrate, the upper and lower mold portions contacting upper and lower surfaces of the packaging substrate, re

1. A method of packaging integrated circuits comprising: clamping an upper mold portion and a lower mold portion around an integrated circuit die mounted on an upper surface of a packaging substrate, the upper and lower mold portions contacting upper and lower surfaces of the packaging substrate, respectively, during clamping; andbringing a surface on a projection within the upper mold portion into contact with an active area of the integrated circuit die during mold clamping, wherein the contacted active area remains exposed after encapsulation,wherein a deformable material is disposed on a surface of the lower mold portion, the deformable material having a soft deformable upper surface that contacts the bottom surface of the packaging substrate during mold clamping, the deformable material deforming during mold clamping as necessary to compensate for misalignment between the projection surface and the active area of the integrated circuit die and to thereby prevent injected encapsulating material from flowing between the projection surface and the contact area. 2. The method according to claim 1, wherein the deformable material deforms during mold clamping by an amount sufficient to accommodate thickness variations in the packaging substrate. 3. The method according to claim 1, wherein the deformable material deforms during mold clamping by an amount sufficient to accommodate non-planarity of an adhesive between the integrated circuit die and the packaging substrate. 4. The method according to claim 1, further comprising: receiving the integrated circuit die within a cavity in the upper mold portion during clamping, wherein the upper mold portion contacts the upper surface of the packaging substrate around a periphery of the cavity during mold clamping. 5. The method according to claim 1, wherein the deformable material deforms during mold clamping by an amount sufficient to accommodate thickness variations in the packaging substrate, non-planarity of an adhesive between the integrated circuit die and the packaging substrate, or both. 6. A method of packaging integrated circuits comprising: clamping an upper mold portion and a lower mold portion around an integrated circuit die mounted on an upper surface of a packaging substrate, the upper and lower mold portions contacting upper and lower surfaces of the packaging substrate, respectively, and a surface on a projection within the upper mold portion contacting an active area of the integrated circuit die during clamping, wherein the contacted active area remains exposed after encapsulation,wherein a deformable material on a surface of the lower mold portion contacts the bottom surface of the packaging substrate during mold clamping, the deformable material having a deformable upper surface contacting the bottom of the packaging substrate, the deformable upper surface of the deformable material deforming during mold clamping as necessary to compensate for misalignment between the projection surface and the active area of the integrated circuit die and to thereby prevent injected encapsulating material from flowing between the projection surface and the contact area. 7. The method according to claim 6, wherein the deformable material deforms during mold clamping by an amount sufficient to accommodate thickness variations in the packaging substrate. 8. The method according to claim 6, wherein the deformable material deforms during mold clamping by an amount sufficient to accommodate non-planarity of an adhesive between the integrated circuit die and the packaging substrate. 9. The method according to claim 6, further comprising: receiving the integrated circuit die within a cavity in the upper mold portion during clamping, wherein the upper mold portion contacts the upper surface of the packaging substrate around a periphery of the cavity during mold clamping. 10. The method according to claim 9, wherein the deformable material deforms during mold clamping by an amount sufficient to accommodate thickness variations in the packaging substrate, non-planarity of an adhesive between the integrated circuit die and the packaging substrate, or both. 11. A method comprising: receiving a substrate between a first mold portion, and a second mold portion,the first mold portion having a surface on a projection thereon contacting an active area of the substrate during clamping, wherein the contacted active area remains exposed after encapsulation, the second mold portion having a base and a deformable material on at least a portion of the base, the deformable material having an upper surface including a region that contacts at least a portion of the substrate during mold clamping and that is deformable within the region that contacts the substrate during mold clamping, the deformable portion of the upper surface of the deformable material deforming during mold clamping to compensate for misalignment between the projection surface and the active area of the substrate and to thereby prevent injected encapsulating material from flowing between the projection surface and the active area. 12. The method of claim 11, wherein the deformable material compensates for at least one of a variable thickness of the substrate and a non-planarity of an adhesive between an integrated circuit die and the substrate. 13. The method of claim 12, wherein the first mold portion includes a cavity capable of receiving an integrated circuit die mounted on the substrate, the first mold portion contacting a surface of the substrate around a periphery of the cavity during mold clamping. 14. The method according to claim 1, wherein the deformable material is an elastomeric material. 15. The method according to claim 14, wherein the elastomeric material is a neoprene rubber. 16. The method according to claim 1, further comprising injecting encapsulating material into at least a portion of a cavity in the upper mold. 17. The method according to claim 6, wherein the deformable material a neoprene rubber. 18. The method according to claim 6, further comprising injecting encapsulating material into at least a portion of a cavity in the upper mold. 19. The method according to claim 11, wherein the deformable material a neoprene rubber. 20. The method according to claim 11, further comprising injecting encapsulating material into at least a portion of a cavity in the upper mold.