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Method and apparatus for providing hermetic electrical feedthrough 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-001/03
출원번호 US-0165388 (2011-06-21)
등록번호 US-8163397 (2012-04-24)
발명자 / 주소
  • Ok, Jerry
  • Greenberg, Robert J.
출원인 / 주소
  • Second Sight Medical Products, Inc.
대리인 / 주소
    Dunbar, Scott B.
인용정보 피인용 횟수 : 46  인용 특허 : 20

초록

A method and apparatus suitable for forming hermetic electrical feedthroughs in a ceramic sheet having a thickness of .ltoreq.40 mils. More particularly, the method yields an apparatus including a hermetic electrical feedthrough which is both biocompatible and electrochemically stable and suitable f

대표청구항

1. A hermetic structure comprising: a sheet of ceramic material having upper and lower parallel surfaces spaced by less than 40 mils; at least one feedthrough filled with electrically conductive material formed of substantially pure platinum, extending through said sheet, in contact with said sheet;

이 특허에 인용된 특허 (20)

  1. Rolf Eckmiller DE, Adaptive sensory-motor encoder for visual or acoustic prosthesis.
  2. Malmgren Richard P., Brazeless ceramic-to-metal bonding for use in implantable devices.
  3. Webster Harold F. (Scotia NY), Ceramic-to-conducting-lead hermetic seal.
  4. Kuzma Janusz (Stanmore AUX), Feedthrough assembly for cochlear prosthetic package.
  5. Behfar Alex A. ; McHerron Dale Curtis ; Perry Charles Hampton, High density Z-axis connector.
  6. Taylor William J. ; Seifried Lynn M ; Weiss Douglas ; Lessar Joseph F., Implantable medical device wtih multi-pin feedthrough.
  7. Greenberg, Robert J.; Talbot, Neil Hamilton; Neysmith, Jordan Matthew; Ok, Jerry; Jiang, Honggang, Implantable microelectronic device and method of manufacture.
  8. Greenberg, Robert J.; Ok, Jerry, Method and apparatus for providing hermetic electrical feedthrough.
  9. Strojnik Primoz (Granada Hills CA), Method of forming a tubular feed-through hermetic seal for an implantable medical device.
  10. Kuzma Janusz (Stanmore AUX), Method of making feedthrough assemblies having hermetic seals between electrical feedthrough elements and ceramic carrie.
  11. Horine David A. (Los Altos CA) Love David G. (Pleasanton CA), Methods for making high-density/long-via laminated connectors.
  12. Chirino Octavio I. (Endwell NY) Hromek Joseph (Endwell NY) Joshi Kailash C. (Endicott NY) Phillips ; Jr. George C. (Endwell NY), Multilayer ceramic substrate structure.
  13. Feuersanger Alfred E. (Framingham MA) Rhodes William H. (Lexington MA), Niobium-ceramic feedthrough assembly.
  14. de Juan ; Jr. Eugene (Durham NC) Humayun Mark S. (Durham NC) Phillips D. Howard (Durham NC), Retinal microstimulation.
  15. Gregg J?rgen Suaning AU, Retinal stimulator.
  16. Mizuhara Howard (Hillsborough CA) Smith P. C. (Burlingame CA), Sealed conductive active alloy feedthroughs.
  17. Horiuchi Michio,JPX ; Takeuchi Yukiharu,JPX ; Harayama Yoichi,JPX, Sintered body for manufacturing ceramic substrate.
  18. Yueh Ray,TWX, Solder strip exclusively for semiconductor packaging.
  19. Humayun Mark S. ; de Juan ; Jr. Eugene ; Greenberg Robert J., Visual prosthesis and method of using same.
  20. Horiuchi Michio,JPX ; Takeuchi Yukiharu,JPX, Wiring substrate having vias.

이 특허를 인용한 특허 (46)

  1. Specht, Heiko; Markham, Jacob; Pavlovic, Goran; Hausch, Ulrich, Capacitor and method to manufacture the capacitor.
  2. Specht, Heiko; Glynn, Jeremy, Ceramic bushing for an implantable medical device.
  3. Reisinger, Andreas, Ceramic bushing with filter.
  4. Reisinger, Andreas, Ceramic bushing with filter.
  5. Markham, Jacob; Hausch, Ulrich; Pavlovic, Goran, Ceramic feedthrough brazed to an implantable medical device housing.
  6. Troetzschel, Jens; Specht, Heiko, Cermet-containing bushing for an implantable medical device.
  7. Tang, Xiaohong; Thiebolt, William C.; Frysz, Christine A.; Seitz, Keith W.; Stevenson, Robert A.; Brendel, Ricahrd L.; Marzano, Thomas; Woods, Jason; Frustaci, Dominick J.; Winn, Steven W., Co-fired hermetically sealed feedthrough with alumina substrate and platinum filled via for an active implantable medical device.
  8. Tang, Xiaohong; Thiebolt, William C.; Frysz, Christine A.; Seitz, Keith W.; Stevenson, Robert A.; Brendel, Richard L.; Marzano, Thomas; Woods, Jason; Frustaci, Dominick J.; Winn, Steven W., Co-fired hermetically sealed feedthrough with alumina substrate and platinum filled via for an active implantable medical device.
  9. Markham, Jacob; Hausch, Ulrich, Direct integration of feedthrough to implantable medical device housing by sintering.
  10. Markham, Jacob; Hausch, Ulrich, Direct integration of feedthrough to implantable medical device housing using a gold alloy.
  11. Markham, Jacob; Hausch, Ulrich, Direct integration of feedthrough to implantable medical device housing with ultrasonic welding.
  12. Markham, Jacob; Hausch, Ulrich, Direct integration of feedthrough to implantable medical device housing with ultrasonic welding.
  13. Markham, Jacob; Hausch, Ulrich, Directly integrated feedthrough to implantable medical device housing.
  14. Stevenson, Robert A.; Marzano, Thomas; Seitz, Keith W.; Frysz, Christine A., EMI filtered co-connected hermetic feedthrough, feedthrough capacitor and leadwire assembly for an active implantable medical device.
  15. Stevenson, Robert A.; Marzano, Thomas; Seitz, Keith W.; Winn, Steven W.; Frysz, Christine A.; Brendel, Richard L.; Woods, Jason; Frustaci, Dominick J.; Tang, Xiaohong; Thiebolt, William C., EMI filtered co-connected hermetic feedthrough, feedthrough capacitor and leadwire assembly for an active implantable medical device.
  16. Stevenson, Robert A.; Marzano, Thomas; Seitz, Keith W.; Winn, Steven W.; Frysz, Christine A.; Brendel, Richard L.; Woods, Jason; Frustaci, Dominick J.; Tang, Xiaohong; Thiebolt, William C., EMI filtered co-connected hermetic feedthrough, feedthrough capacitor and leadwire assembly for an active implantable medical device.
  17. Troetzschel, Jens; Specht, Heiko, Electrical bushing for an implantable medical device.
  18. Kempf, Mark; Reisinger, Andreas, Electrical bushing with cermet-containing connecting element for an active implantable medical device.
  19. Troetzschel, Jens; Pavlovic, Goran; Manhardt, Harald; Staudt, Nicole, Electrical bushing with gradient cermet.
  20. Marzano, Thomas; Seitz, Keith W.; Stevenson, Robert A.; Tang, Xiaohong; Thiebolt, William C.; Frysz, Christine A.; Brendel, Richard L.; Woods, Jason; Winn, Steven W.; Frustaci, Dominick J.; Truex, Bruehl E.; Hickel, Jr., Donald H., Elevated hermetic feedthrough insulator adapted for side attachment of electrical conductors on the body fluid side of an active implantable medical device.
  21. Marzano, Thomas; Seitz, Keith W.; Stevenson, Robert A.; Tang, Xiaohong; Thiebolt, William C.; Frysz, Christine A.; Brendel, Richard L.; Woods, Jason; Winn, Steven W.; Frustaci, Dominick J.; Truex, Buehl E.; Hickel, Jr., Donald, Elevated hermetic feedthrough insulator adapted for side attachment of electrical conductors on the body fluid side of an active implantable medical device.
  22. Markham, Jacob; Hausch, Ulrich, Feedthrough with integrated brazeless ferrule.
  23. Greenberg, Robert J.; Talbot, Neil Hamilton; Neysmith, Jordan Matthew; Ok, Jerry, Flexible circuit electrode array and method of manufacturing the same.
  24. Reisinger, Andreas; Glynn, Jeremy, Head part for an implantable medical device.
  25. Seitz, Keith W.; Stevenson, Robert A.; Frysz, Christine A.; Marzano, Thomas, Hermetic filter feedthrough including MLCC-type capacitors for use with an active implantable medical device.
  26. Stevenson, Robert A.; Tang, Xiaohong; Thiebolt, William C.; Frysz, Christine A.; Seitz, Keith W.; Brendel, Richard L.; Marzano, Thomas; Woods, Jason; Frustaci, Dominick J.; Winn, Steven W., Hermetically sealed feedthrough with co-fired filled via and conductive insert for an active implantable medical device.
  27. Stevenson, Robert A.; Tang, Xiaohong; Thiebolt, William C.; Frysz, Christine A.; Seitz, Keith W.; Brendel, Richard L.; Marzano, Thomas; Woods, Jason; Frustaci, Dominick J.; Winn, Steven W., Hermetically sealed feedthrough with co-fired filled via and conductive insert for an active implantable medical device.
  28. Kempf, Mark; Pavlovic, Goran, Implantable device having an integrated ceramic bushing.
  29. Markham, Jacob; Hausch, Ulrich; Pavlovic, Goran, Laser welding a feedthrough.
  30. Frysz, Christine A.; Stevenson, Robert A.; Woods, Jason, Low impedance oxide resistant grounded capacitor for an AIMD.
  31. Woods, Jason; Brendel, Richard L.; Stevenson, Robert A.; Williams, Christopher M.; Naugler, Robert; Frysz, Christine A., Low impedance oxide resistant grounded capacitor for an AIMD.
  32. Woods, Jason; Brendel, Richard L.; Stevenson, Robert A.; Williams, Christopher Michael; Naugler, Robert; Frysz, Christine A., Low impedance oxide resistant grounded capacitor for an AIMD.
  33. Woods, Jason; Brendel, Richard L.; Stevenson, Robert A.; Williams, Christopher Michael; Naugler, Robert; Frysz, Christine A., Low impedance oxide resistant grounded capacitor for an AIMD.
  34. Marzano, Thomas; Stevenson, Robert A.; Frysz, Christine A.; Woods, Jason; Brendel, Richard L., Low inductance and low resistance hermetically sealed filtered feedthrough for an AIMD.
  35. Specht, Heiko, Method for manufacturing an electrical bushing for an implantable medical device.
  36. Troetzschel, Jens; Pavlovic, Goran; Manhardt, Harald; Wollenberg, Norbert; Guebler, Nicole, Method for sintering electrical bushings.
  37. Pavlovic, Goran, Method for the manufacture of a cermet-containing bushing.
  38. Pavlovic, Goran, Method for the manufacture of a cermet-containing bushing for an implantable medical device.
  39. Markham, Jacob; Hausch, Ulrich; Pavlovic, Goran, Method of coupling a feedthrough assembly for an implantable medical device.
  40. Pavlovic, Goran; Glynn, Jeremy, Method of forming a cermet-containing bushing for an implantable medical device having a connecting layer.
  41. Markham, Jacob; Hausch, Ulrich, Method of forming feedthrough with integrated brazeless ferrule.
  42. Terao, Eiji, Method of manufacturing glass substrate and method of manufacturing electronic components.
  43. Troetzschel, Jens; Specht, Heiko, Method of producing a cermet-containing bushing for an implantable medical device.
  44. Troetzschel, Jens; Pavlovic, Goran; Manhardt, Harald; Guebler, Nicole, Method of producing an electrical bushing with gradient cermet.
  45. Seitz, Keith W.; Rensel, Dallas J.; Hohl, Brian P.; Calamel, Jonathan; Tang, Xiaohong; Stevenson, Robert A.; Frysz, Christine A.; Marzano, Thomas; Woods, Jason; Brendel, Richard L., Process for manufacturing a leadless feedthrough for an active implantable medical device.
  46. Troetzschel, Jens; Pavlovic, Goran; Manhardt, Harald; Wollenberg, Norbert; Staudt, Nicole, Sintered electrical bushings.
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