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A method for manufacturing a semiconductor substrate is provided, which includes a step of forming a buffer layer over a first semiconductor substrate, a step of forming a damaged region in the first semiconductor substrate by irradiating the first semiconductor substrate with ions, a step of bondin

A method for manufacturing a semiconductor substrate is provided, which includes a step of forming a buffer layer over a first semiconductor substrate, a step of forming a damaged region in the first semiconductor substrate by irradiating the first semiconductor substrate with ions, a step of bonding the first semiconductor substrate and a second semiconductor substrate with the buffer layer interposed between, a step of separating the first semiconductor substrate with a single crystal semiconductor layer left over the second semiconductor substrate by heating the first semiconductor substrate and the second semiconductor substrate, and a step of irradiating the single crystal semiconductor layer with a laser beam and heating the single crystal semiconductor layer.

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1. A method for manufacturing a semiconductor substrate, comprising the steps of: forming a buffer layer over a first semiconductor substrate;forming a damaged region in the first semiconductor substrate by irradiating the first semiconductor substrate with ions;bonding the first semiconductor subst

1. A method for manufacturing a semiconductor substrate, comprising the steps of: forming a buffer layer over a first semiconductor substrate;forming a damaged region in the first semiconductor substrate by irradiating the first semiconductor substrate with ions;bonding the first semiconductor substrate and a second semiconductor substrate with the buffer layer interposed between;separating the first semiconductor substrate with a single crystal semiconductor layer left over the second semiconductor substrate by heating the first semiconductor substrate and the second semiconductor substrate; andre-single-crystallizing the single crystal semiconductor layer by irradiating with a laser beam and concurrently heating and melting the single crystal semiconductor layer. 2. The method for manufacturing a semiconductor substrate according to claim 1, wherein the single crystal semiconductor layer is melted by irradiating the single crystal semiconductor layer with the laser beam and heating the single crystal semiconductor layer. 3. The method for manufacturing a semiconductor substrate according to claim 1, wherein each of the first semiconductor substrate and the second semiconductor substrate is a single crystal semiconductor substrate. 4. The method for manufacturing a semiconductor substrate according to claim 1, wherein the first semiconductor substrate is a single crystal semiconductor substrate, and the second semiconductor substrate is a polycrystalline semiconductor substrate. 5. The method for manufacturing a semiconductor substrate according to claim 1, wherein the buffer layer includes an oxide film which is formed by oxidizing one of the first semiconductor substrate and the second semiconductor substrate. 6. The method for manufacturing a semiconductor substrate according to claim 1, wherein the buffer layer includes a silicon nitride film and a silicon nitride oxide film. 7. The method for manufacturing a semiconductor substrate according to claim 1, wherein the buffer layer includes an insulating film in contact with the single crystal semiconductor layer, and wherein the insulating film contains a halogen. 8. The method for manufacturing a semiconductor substrate according to claim 1, wherein heating temperature of the single crystal semiconductor layer at time of irradiation with the laser beam is higher than or equal to 500° C. and lower than or equal to 1100° C. 9. The method for manufacturing a semiconductor substrate according to claim 1, wherein a shape of a top surface of a region irradiated with the laser beam is one of a linear shape, a square, and a rectangle. 10. The method for manufacturing a semiconductor substrate according to claim 1, wherein a diameter of the second semiconductor substrate is 5 inches or more. 11. The method for manufacturing a semiconductor substrate according to claim 1, wherein the single crystal semiconductor layer is heated by a heating means. 12. The method for manufacturing a semiconductor substrate according to claim 11, wherein the heating means is selected from the group consisting of a stage, spraying a heated gas, and lamp irradiation. 13. A method for manufacturing a semiconductor substrate, comprising the steps of: forming a buffer layer over a first semiconductor substrate;forming a damaged region in the first semiconductor substrate by irradiating the first semiconductor substrate with H3+ ions by an ion doping method;bonding the first semiconductor substrate and a second semiconductor substrate with the buffer layer interposed between;separating the first semiconductor substrate with a single crystal semiconductor layer left over the second semiconductor substrate by heating the first semiconductor substrate and the second semiconductor substrate; andre-single-crystallizing the single crystal semiconductor layer by irradiating with a laser beam and concurrently heating and melting the single crystal semiconductor layer. 14. The method for manufacturing a semiconductor substrate according to claim 13, wherein the single crystal semiconductor layer is melted by irradiating the single crystal semiconductor layer with the laser beam and heating the single crystal semiconductor layer. 15. The method for manufacturing a semiconductor substrate according to claim 13, wherein each of the first semiconductor substrate and the second semiconductor substrate is a single crystal semiconductor substrate. 16. The method for manufacturing a semiconductor substrate according to claim 13, wherein the first semiconductor substrate is a single crystal semiconductor substrate, and the second semiconductor substrate is a polycrystalline semiconductor substrate. 17. The method for manufacturing a semiconductor substrate according to claim 13, wherein the buffer layer includes an oxide film which is formed by oxidizing one of the first semiconductor substrate and the second semiconductor substrate. 18. The method for manufacturing a semiconductor substrate according to claim 13, wherein the buffer layer includes a silicon nitride film and a silicon nitride oxide film. 19. The method for manufacturing a semiconductor substrate according to claim 13, wherein the buffer layer includes an insulating film in contact with the single crystal semiconductor layer, and wherein the insulating film contains a halogen. 20. The method for manufacturing a semiconductor substrate according to claim 13, wherein heating temperature of the single crystal semiconductor layer at time of irradiation with the laser beam is higher than or equal to 500° C. and lower than or equal to 1100° C. 21. The method for manufacturing a semiconductor substrate according to claim 13, wherein a shape of a top surface of a region irradiated with the laser beam is one of a linear shape, a square, and a rectangle. 22. The method for manufacturing a semiconductor substrate according to claim 13, wherein a diameter of the second semiconductor substrate is 5 inches or more. 23. The method for manufacturing a semiconductor substrate according to claim 13, wherein the single crystal semiconductor layer is heated by a heating means. 24. The method for manufacturing a semiconductor substrate according to claim 23, wherein the heating means is selected from the group consisting of a stage, spraying a heated gas, and lamp irradiation.