IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0818776
(2010-06-18)
|
등록번호 |
US-8169778
(2012-05-01)
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발명자
/ 주소 |
- Doglio, Jean
- Zielnicki, Steven J.
- Sim, Vibora
|
출원인 / 주소 |
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
0 인용 특허 :
6 |
초록
▼
A peripheral card EMI shielding scheme which comprises a sandwich of three layers. The first layer comprises a chassis rear wall (e.g., constructed of sheet metal). The next layer, which in certain embodiments is the middle of the sandwich, comprises a relatively thin plate (e.g., 0.15 mm+/−0.1 mm)
A peripheral card EMI shielding scheme which comprises a sandwich of three layers. The first layer comprises a chassis rear wall (e.g., constructed of sheet metal). The next layer, which in certain embodiments is the middle of the sandwich, comprises a relatively thin plate (e.g., 0.15 mm+/−0.1 mm) with spring arms. The third layer comprises a sheet metal plate (in certain embodiments, the third layer has a similar thickness to the rear wall). The thick sheet metal plate completely covers the thin plate, except for areas where the spring arms protrude. The three plates are staked together by a method similar to an extrude-and-roll process (e.g., where one piece is fastened to another without the need for additional hardware or welding).
대표청구항
▼
1. An apparatus for reducing electro magnetic interference (EMI) associated with mounting peripheral cards in an information handling system, the apparatus comprising: a chassis;a frame, the frame mounted on the chassis, the frame comprising at least one opening adjacent to a peripheral card slot, t
1. An apparatus for reducing electro magnetic interference (EMI) associated with mounting peripheral cards in an information handling system, the apparatus comprising: a chassis;a frame, the frame mounted on the chassis, the frame comprising at least one opening adjacent to a peripheral card slot, the frame comprising an EMI reduction scheme, the EMI reduction scheme comprising a first layer, a second layer and a third layer, the second layer being sandwiched between the first layer and the third layer, the second layer comprising a plurality of spring arms arranged around the opening, the first layer, second layer and third layer comprising electrically conductive material; anda shield bracket, the shield bracket configured for coupling with the plurality of spring arms arranged around the opening, the shield bracket comprising electrically conductive material. 2. The apparatus of claim 1 wherein: the second layer comprises a relatively thin plate relative to a thickness of the first layer and the third layer. 3. The apparatus of claim 1 wherein: the first layer comprises a sheet metal plate; and,the third layer comprises a sheet metal plate, the sheet metal plate of the third layer completely covering the second layer but for areas where the spring arms protrude. 4. The apparatus of claim 1 wherein: the three layers are staked together so that the layers are fastened together without a need for additional hardware or welding. 5. The apparatus of claim 1 wherein: the first layer and the third layer define a gap; and,the plurality of spring arms comprise respective ends, the respective ends fitting within the gap defined by the first layer and the third layer, the gap allowing the plurality of spring arms to translate from an un loaded position to a loaded position. 6. The apparatus of claim 1 wherein: the plurality of spring arms comprise at least one of a rectangular profile and a half circle shape. 7. An information handling system comprising a processor;memory coupled to the processor;a chassis, the processor and the memory being contained within the chassis;a frame, the frame mounted on the chassis, the frame comprising at least one opening adjacent to a peripheral card slot, the frame comprising an EMI reduction scheme, the EMI reduction scheme comprising a first layer, a second layer and a third layer, the second layer being sandwiched between the first layer and the third layer, the second layer comprising a plurality of spring arms arranged around the opening, the first layer, second layer and third layer comprising electrically conductive material; anda shield bracket, the shield bracket configured for coupling with the plurality of spring arms arranged around the opening, the shield bracket comprising electrically conductive material. 8. The information handling system of claim 7 wherein: the second layer comprises a relatively thin plate relative to a thickness of the first layer and the third layer. 9. The information handling system of claim 7 wherein: the first layer comprises a sheet metal plate; and,the third layer comprises a sheet metal plate, the sheet metal plate of the third layer completely covering the second layer but for areas where the spring arms protrude. 10. The information handling system of claim 7 wherein: the three layers are staked together so that the layers are fastened together without a need for additional hardware or welding. 11. The information handling system of claim 7 wherein: the first layer and the third layer define a gap; and,the plurality of spring arms comprise respective ends, the respective ends fitting within the gap defined by the first layer and the third layer, the gap allowing the plurality of spring arms to translate from an un loaded position to a loaded position. 12. The information handling system of claim 7 wherein: the plurality of spring arms comprise at least one of a rectangular profile and a half circle shape.
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