IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0825756
(2010-06-29)
|
등록번호 |
US-8179677
(2012-05-15)
|
발명자
/ 주소 |
- Campbell, Levi A.
- Chu, Richard C.
- Ellsworth, Jr., Michael J.
- Iyengar, Madhusudan K.
- Simons, Robert E.
|
출원인 / 주소 |
- International Business Machines Corporation
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
22 인용 특허 :
145 |
초록
▼
Cooling apparatus and method are provided for immersion-cooling of an electronic subsystem of an electronics rack. The cooling apparatus includes a housing at least partially surrounding and forming a sealed compartment about the electronic subsystem and a dielectric fluid disposed within the sealed
Cooling apparatus and method are provided for immersion-cooling of an electronic subsystem of an electronics rack. The cooling apparatus includes a housing at least partially surrounding and forming a sealed compartment about the electronic subsystem and a dielectric fluid disposed within the sealed compartment, with the electronic subsystem being immersed within the dielectric fluid. A liquid-cooled vapor condenser is provided which includes a plurality of thermally conductive condenser fins extending within the sealed compartment in an upper portion of the compartment. The condenser fins facilitate cooling of dielectric fluid vapor rising to the upper portion of the compartment. A filler material is disposed within the sealed compartment to reduce the amount of dielectric fluid required within the compartment to achieve immersion-cooling of the electronic subsystem, and the filler material includes a shaped surface to direct dielectric fluid vapor within the compartment towards the condenser fins.
대표청구항
▼
1. A cooling apparatus comprising: a housing configured to at least partially surround and form a sealed compartment about an electronic subsystem comprising a plurality of electronic components to be cooled;a dielectric fluid disposed within the sealed compartment, wherein the electronic subsystem'
1. A cooling apparatus comprising: a housing configured to at least partially surround and form a sealed compartment about an electronic subsystem comprising a plurality of electronic components to be cooled;a dielectric fluid disposed within the sealed compartment, wherein the electronic subsystem's plurality of electronic components to be cooled are immersed within the dielectric fluid;a liquid-cooled vapor condenser, the liquid-cooled vapor condenser comprising a plurality of thermally conductive condenser fins extending within the sealed compartment in an upper portion of the sealed compartment, the plurality of thermally conductive condenser fins facilitating cooling and condensing of dielectric fluid vapor rising to the upper portion of the sealed compartment; anda filler material disposed within the sealed compartment and reducing an amount of dielectric fluid required within the sealed compartment to achieve immersion of the electronic subsystem's plurality of electronic components within the dielectric fluid, the filler material comprising a shaped surface, the shaped surface being configured to direct dielectric fluid vapor within the sealed compartment towards the plurality of thermally conductive condenser fins. 2. The cooling apparatus of claim 1, wherein the shaped surface of the filler material comprises at least one planar surface portion angled to direct dielectric fluid vapor within the sealed compartment towards the plurality of thermally conductive condenser fins of the liquid-cooled vapor condenser. 3. The cooling apparatus of claim 1, wherein the shaped surface of the filler material comprises at least one concave surface portion curved to direct dielectric fluid vapor within the sealed compartment towards the plurality of thermally conductive condenser fins, the at least one concave surface portion accommodating a height of one or more taller electronic components of the plurality of electronic components to be cooled. 4. The cooling apparatus of claim 1, wherein the shaped surface of the filler material comprises a convex surface portion with at least one recess therein accommodating a height of at least one electronic component of the plurality of electronic components to be cooled, and wherein the filler material further comprises at least one channel intersecting the at least one recess to direct dielectric fluid vapor within the at least one recess of the filler material towards the plurality of thermally conductive condenser fins of the liquid-cooled vapor condenser. 5. The cooling apparatus of claim 4, wherein the filler material comprises multiple parallel-extending recesses accommodating the height of multiple parallel-disposed electronic components of the plurality of electronic components of the electronic subsystem, and wherein the filler material further comprises multiple channels intersecting the multiple parallel-extending recesses to direct dielectric fluid vapor within the multiple parallel-extending recesses of the filler material towards the plurality of thermally conductive condenser fins of the liquid-cooled vapor condenser. 6. The cooling apparatus of claim 1, wherein at least a portion of the shaped surface of the filler material is covered by the dielectric fluid within the sealed compartment. 7. The cooling apparatus of claim 1, wherein the liquid-cooled vapor condenser has a footprint within the sealed compartment that is less than one-half a footprint of the electronic subsystem within the sealed compartment. 8. The cooling apparatus of claim 7, wherein the liquid-cooled vapor condenser is coupled in fluid communication with and disposed adjacent to a coolant inlet and a coolant outlet in the housing which facilitate passage of liquid coolant through the liquid-cooled vapor condenser. 9. The cooling apparatus of claim 7, wherein the liquid-cooled vapor condenser is aligned above a highest heat producing electronic component of the plurality of electronic components to be cooled of the electronic subsystem. 10. The cooling apparatus of claim 1, wherein the filler material comprises a plurality of air filled sealed volumes which reduce weight of the filler material within the sealed compartment. 11. The cooling apparatus of claim 1, wherein the filler material further comprises at least one storage volume for storing any non-condensable gas vaporizing from the dielectric fluid within the sealed compartment, the at least one storage volume being disposed within the filler material at a level of the sealed compartment at least partially above the plurality of thermally conductive condenser fins within the sealed compartment, and wherein the filler material further comprises at least one passage coupling in fluid communication a condenser fin region of the sealed compartment, within which the plurality of thermally conductive condenser fins extend, and the at least one storage volume. 12. A liquid-cooled electronics rack comprising: an electronics rack comprising an electronic subsystem, the electronic subsystem comprising a plurality of electronic components; anda cooling apparatus for immersion-cooling of the plurality of electronic components of the electronic subsystem, the cooling apparatus comprising: a housing at least partially surrounding and forming a sealed compartment about the electronic subsystem comprising the plurality of electronic components;a dielectric fluid disposed within the sealed compartment, wherein the electronic subsystem's plurality of electronic components to be cooled are immersed within the dielectric fluid;a liquid-cooled vapor condenser, the liquid-cooled vapor condenser comprising a plurality of thermally conductive condenser fins extending within the sealed compartment in an upper portion of the sealed compartment, the plurality of thermally conductive condenser fins facilitating cooling and condensing of dielectric fluid vapor rising to the upper portion of the sealed compartment; anda filler material disposed within the sealed compartment and reducing an amount of dielectric fluid required within the sealed compartment to achieve immersion of the electronic subsystem's plurality of electronic components within the dielectric fluid, the filler material comprising a shaped surface to direct dielectric fluid vapor within the sealed compartment towards the plurality of thermally conductive condenser fins. 13. The liquid-cooled electronics rack of claim 12, wherein the shaped surface of the filler material comprises at least one planar surface portioned angled to direct dielectric fluid vapor within the sealed compartment towards the plurality of thermally conductive condenser fins of the liquid-cooled vapor condenser. 14. The liquid-cooled electronics rack of claim 12, wherein the shaped surface of the filler material comprises at least one concave surface portion curved to direct dielectric fluid vapor within the sealed compartment towards the plurality of thermally conductive condenser fins, the at least one concave surface portion accommodating a height of one or more taller electronic components of the plurality of electronic components of the electronic subsystem. 15. The liquid-cooled electronics rack of claim 12, wherein the shaped surface of the filler material comprises a convex surface portion with at least one recess therein accommodating a height of at least one electronic component of the plurality of electronic components of the electronic subsystem, and wherein the filler material further comprises at least one channel intersecting the at least one recess to direct dielectric fluid vapor within the at least one recess of the filler material towards the plurality of thermally conductive condenser fins of the liquid-cooled vapor condenser. 16. The liquid-cooled electronics rack of claim 12, wherein the liquid-cooled vapor condenser has a footprint within the sealed compartment that is less than one-half a footprint of the electronic subsystem within the sealed compartment, and wherein at least a portion of the shaped surface of the filler material is covered by the dielectric fluid within the sealed compartment. 17. The liquid-cooled electronics rack of claim 16, wherein the liquid-cooled vapor condenser is coupled in fluid communication with and disposed adjacent to a coolant inlet and a coolant outlet in the housing which facilitate passage of liquid coolant through the liquid-cooled vapor condenser. 18. The liquid-cooled electronics rack of claim 16, wherein the liquid-cooled vapor condenser is aligned above a highest heat producing electronic component of the plurality of electronic components of the electronic subsystem. 19. The liquid-cooled electronics rack of claim 12, wherein the filler material further comprises at least one storage volume for storing any non-condensable gas vaporizing from the dielectric fluid within the sealed compartment, the at least one storage volume being disposed within the filler material at a level of the sealed compartment at least partially above the plurality of thermally conductive condenser fins within the sealed compartment, and wherein the filler material further comprises at least one passage coupling in fluid communication a condenser fin region of the sealed compartment, within which the plurality of thermally conductive condenser fins extend, and the at least one storage volume. 20. A method of facilitating cooling of an electronic subsystem, the method comprising: providing a housing at least partially surrounding and forming a sealed compartment about the electronic subsystem, the electronic subsystem comprising a plurality of electronic components to be cooled;immersing the electronic subsystem's plurality of electronic components in a dielectric fluid within the sealed compartment;providing a liquid-cooled vapor condenser comprising a plurality of thermally conductive condenser fins extending within the sealed compartment in an upper portion of the sealed compartment, the plurality of thermally conductive condenser fins facilitating cooling and condensing of dielectric fluid vapor rising to the upper portion of the sealed compartment; anddisposing a filler material within the sealed compartment to reduce an amount of dielectric fluid required within the sealed compartment to achieve immersion of the electronic subsystem's plurality of electronic components within the dielectric fluid, the filler material comprising a shaped surface, the shaped surface being configured to direct dielectric fluid vapor within the sealed compartment towards the plurality of thermally conductive condenser fins, wherein at least a portion of the shaped surface of the filler material is covered by the dielectric fluid within the sealed compartment.
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