초록 ▼

To enable the circuit board to be fixed on a predetermined position and to be conveyed to the solder processing portion. Conveying hooks 10 that hold the printed circuit board W1 therebetween, conveying chains 15a, 15b that drive so that the conveying hooks 10 are movable from a heater part 4 to a s

To enable the circuit board to be fixed on a predetermined position and to be conveyed to the solder processing portion. Conveying hooks 10 that hold the printed circuit board W1 therebetween, conveying chains 15a, 15b that drive so that the conveying hooks 10 are movable from a heater part 4 to a solder bath 5, first frames 9A that guide the conveying chains 15a, 15b along the heater part 4, second frames 9B that guide the conveying chain 15 along the solder bath 5, and an absorbing member 124 that is provided between each of the first frames 9A and each of the second frames 9B and absorbs an expansion and contraction based on difference of any thermal expansion between the frames 9A, 9B and the conveying chains 15a, 15b are provided. Since the absorbing member 124 absorbs the expansion and contraction based on difference of any thermal expansion between the frames 9A, 9B and the conveying chains 15a, 15b, it is possible to prevent the conveying chains 15a, 15b from being deviated from the frames 9A, 9B. This enables the printed circuit board W1 to be fixed on the predetermined position and to be conveyed to the heater part 4 and the solder bath 5.

대표청구항 ▼

1. An automatic soldering apparatus comprising a heat treatment portion that performs a heat treatment on a circuit board at a predetermined temperature, a solder processing portion that performs solder processing on the circuit board on which a heat treatment is performed by the heat treatment port

1. An automatic soldering apparatus comprising a heat treatment portion that performs a heat treatment on a circuit board at a predetermined temperature, a solder processing portion that performs solder processing on the circuit board on which a heat treatment is performed by the heat treatment portion, anda conveying portion that conveys the circuit board from the heat treatment portion to the solder processing portion, whereinthe conveying portion includes:plural conveying hooks that hold the circuit board therebetween;conveying chains, each being provided with the conveying hooks, which drive so that the conveying hooks holding the circuit board therebetween are movable from the heat treatment portion to the solder processing portion;a pair of first frames that have a first sliding portion and guide the conveying chains slid by the first sliding portion along the heat treatment portion;a pair of second frames that have a second sliding portion that slides the conveying chains continuously transferred from the first sliding portion, are continuously provided to the first sliding portion and guide the conveying chains slid by the second sliding portion along the solder processing portion; andan absorbing member that is provided between each of the first frames and each of the second frames and absorbs an expansion and contraction based on difference of any thermal expansion between the first and second frames and the conveying chains chains,and wherein each first frame has an end that is toward an end of a corresponding second frame and each first frame and each second frame are respectively provided with a recess at said end,each absorbing member comprises a shaft having a first end and a second end, a first bushing provided inside the first frame at said end of the first frame, and a second bushing provided inside the second frame at said end of the second frame,and the first and second ends of the shaft are disposed in the first and second bushings respectively. 2. The automatic soldering apparatus according to claim 1, wherein the heat treatment portion is provided with heater parts that heat the circuit board; the solder processing portion is provided with a solder bath in which the solder is adhered to the circuit board heated by the heater parts;the first frames are provided with the heater parts and the second frames are provided with the solder bath. 3. The automatic soldering apparatus according to claim 2, wherein the first and second frames are provided with a pair of reinforcement frames that reinforce the first and second frames. 4. A conveying device wherein when a system which performs a first heat treatment on a conveyed object is set as a first heat treatment system and a system which performs a second heat treatment on the conveyed object on which the first heat treatment is performed by the first heat treatment system is set as a second heat treatment system, the device is provided with:plural conveying hooks that hold the conveyed object therebetween,conveying chains, each being provided with the conveying hooks, which drive so that the conveying hooks holding the circuit board therebetween are movable from the first heat treatment system to the second heat treatment system,a pair of first frames that have a first sliding portion and guide the conveying chains slid by the first sliding portion along the first heat treatment system;a pair of second frames that have a second sliding portion that slides the conveying chains continuously transferred from the first sliding portion, are continuously provided to the first sliding portion and guide the conveying chains slid by the second sliding portion along the second heat treatment system; andan absorbing member that is provided between each of the first frames and each of the second frames and absorbs an expansion and contraction based on difference of any thermal expansion between the first and second frames and the conveying chains chains,and wherein each first frame has an end that is toward an end of a corresponding second frame and each first frame and each second frame is provided with a recess at said end,each absorbing member comprises a shaft having a first end and a second end, a first bushing provided inside the first frame at said end of the first frame, and a second bushing provided inside the second frame at said end of the second frame,and the first and second ends of the shaft are disposed in the first and second bushings respectively. 5. The automatic soldering apparatus according to claim 1, wherein the first and second frames are provided with a pair of reinforcement frames that reinforce the first and second frames.