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특허 상세정보

Thermal management systems and methods

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H05K-007/20   
미국특허분류(USC) 361/679.48; 361/679.49; 361/679.5; 361/695; 165/104.34
출원번호 US-0787245 (2010-05-25)
등록번호 US-8189331 (2012-05-29)
발명자 / 주소
출원인 / 주소
인용정보 피인용 횟수 : 7  인용 특허 : 16
초록

A thermal management system is provided. The system can include an electronic device enclosure having a first surface and a second surface. At least a portion of the perimeter of the first surface can be disposed proximate the second surface to provide a chamber between the first and second surfaces. At least one first aperture in fluid communication with the chamber can be disposed on the second surface, while at least one second aperture in fluid communication with the chamber can be disposed on the first surface. A fluid mover, having a fluid inlet an...

대표
청구항

1. A thermal management system, comprising: an electronic device enclosure of a computing device, the electronic device enclosure comprising a first surface and a second surface, wherein the second surface is an exterior surface of the computing device; wherein at least a portion of a perimeter of the first surface is disposed proximate the second surface to provide a chamber between the first and second surfaces;at least one first aperture in fluid communication with the chamber and disposed on the second surface;at least one second aperture in fluid co...

이 특허에 인용된 특허 (16)

  1. Bhatia Rakesh. Airflow heat exchanger for a portable electronic device and port replicator, docking station, or mini-docking station. USP2000076094347.
  2. Wolford,Robert Russell; Hardee,Donna Casteel; Foster, Sr.,Jimmy Grant; Keener,Don Steven. Cooling apparatus for vertically stacked printed circuit boards. USP2007057218517.
  3. Katooka Masao (Kawanishi JPX) Kawashima Yoshimasa (Kobe JPX) Sakurada Makoto (Yao JPX) Makitani Atsushi (Toyonaka JPX). Cooling structure for power supply device. USP1995065424915.
  4. Takasou, Kazuo. Electronic apparatus cooling structure. USP2009107606027.
  5. Katsui, Tadashi; Yamamoto, Haruhiko. Electronic device. USP2003046545866.
  6. Hirota,Masayuki; Huang,Mingxi; Ibori,Satoshi; Maeno,Yutaka. Frequency converter. USP2006057054157.
  7. Gedamu, Elias; Man, Denise. Heat dissipation apparatus and method. USP2005096940718.
  8. Liu, Chien Hsiang; Yeh, Fun Son; Chang, Brian. Heat dissipation structure for electronic devices. USP2009067554805.
  9. Lo, Li-Chun. Heat isolation apparatus. USP2004086775135.
  10. Miyahara, Masaharu; Mehara, Koji; Yoshida, Shinji. Heat sink unit and electronic apparatus using the same. USP2003036529375.
  11. Heady Gregory S. ; Bendik Steve J.. Heat transfer system and method for electronic displays. USP1999115991153.
  12. Nakamura, Fusanobu. Housing temperature suppressing structure in electronic device and portable computer. USP2010017643284.
  13. Seeger, Mark E.; DiFonzo, John; Ligtenberg, Chris; Zeliff, Zachary. Method and apparatus for controlling the temperature of electronic device enclosures. USP2005126980418.
  14. Yuasa, Akiko; Tanimoto, Yasuaki; Hirai, Chie. Portable information appliance. USP2005026859364.
  15. Hara,Chikashi; Hayakawa,Kazuyo; Kumai,Satoru; Nomura,Taichiroh; Sakurai,Toshio; Takenoshita,Hiroyuki. System for cooling interior and external housing surfaces of an electronic apparatus. USP2009017480140.
  16. Nelson, Michael J.; Wayman, Michael J.. Systems and methods for Venturi fan-assisted cooling. USP2010057724521.