초록 ▼

A thermal management system is provided. The system can include an electronic device enclosure having a first surface and a second surface. At least a portion of the perimeter of the first surface can be disposed proximate the second surface to provide a chamber between the first and second surfaces

A thermal management system is provided. The system can include an electronic device enclosure having a first surface and a second surface. At least a portion of the perimeter of the first surface can be disposed proximate the second surface to provide a chamber between the first and second surfaces. At least one first aperture in fluid communication with the chamber can be disposed on the second surface, while at least one second aperture in fluid communication with the chamber can be disposed on the first surface. A fluid mover, having a fluid inlet and a fluid discharge, can be disposed proximate the second aperture. Fluid from the chamber can provide an inflow to the fluid inlet and an outflow from the fluid discharge can be directed to the exterior of the electronic enclosure.

대표청구항 ▼

1. A thermal management system, comprising: an electronic device enclosure of a computing device, the electronic device enclosure comprising a first surface and a second surface, wherein the second surface is an exterior surface of the computing device; wherein at least a portion of a perimeter of t

1. A thermal management system, comprising: an electronic device enclosure of a computing device, the electronic device enclosure comprising a first surface and a second surface, wherein the second surface is an exterior surface of the computing device; wherein at least a portion of a perimeter of the first surface is disposed proximate the second surface to provide a chamber between the first and second surfaces;at least one first aperture in fluid communication with the chamber and disposed on the second surface;at least one second aperture in fluid communication with the chamber and disposed on the first surface; andat least one fluid mover comprising a fluid inlet and a fluid discharge disposed proximate the second aperture; wherein fluid from the chamber provides an inflow to the fluid inlet; andwherein an outflow from the fluid discharge is directed to the exterior of the electronic device enclosure. 2. The system of claim 1, further comprising a thermal sensor to measure a temperature of the second surface. 3. The system of claim 2, further comprising a controller to modulate the inflow to the fluid mover proportionate to the measured temperature of the second surface. 4. The system of claim 1, further comprising a heat producing electronic device disposed proximate the first surface, opposite the chamber. 5. The system of claim 4, wherein the heat-producing electronic device comprises at least one selected from the group consisting of: a central processing unit, a graphical processing unit, a hard disk drive, and a solid state storage device. 6. A thermal management method, comprising: flowing a fluid into a chamber via a first aperture; wherein the chamber is between a first surface and a second surface and is disposed within an electronic enclosure;wherein the first surface comprises a surface disposed between a heat producing electronic device and the chamber;wherein the second surface comprises an exterior surface of the electronic enclosure; andwherein the first aperture is disposed on the second surface;drafting a fluid from the chamber via a second aperture; wherein the second aperture is disposed on the first surface and the second aperture has an adjustable cross-sectional area. 7. The method of claim 6, further comprising: measuring a temperature of the second surface using a thermal sensor; andadjusting the cross-sectional area of the second aperture to modulate a draft rate of the fluid from the chamber based upon the measured temperature of the second surface. 8. The method of claim 6, wherein the electronic device is at least one selected from the group consisting of: a central processing unit, a graphical processing unit, a hard disk drive, and a solid state storage device. 9. The method of claim 6, further comprising: creating a first pressure within the chamber less than a second pressure surrounding the chamber using a fluid mover comprising a fluid inlet disposed proximate the second aperture; wherein an inflow to the fluid mover inlet is provided, at least in part, from the chamber. 10. A thermal control system, comprising: a chamber located inside a computing device, the chamber defined by a first surface and a second surface; wherein the first surface comprises a surface disposed between a heat producing electronic device and the chamber; andwherein the second surface comprises an exterior surface of the computing device;at least one first aperture in communication with the chamber and disposed on the second surface; wherein the at least one first aperture permits a flow of a fluid into the chamber;at least one second aperture in communication with the chamber and disposed on the first surface; wherein the at least one second aperture permits an outflow of the fluid from the chamber; anda fluid mover disposed proximate the at least one second aperture; wherein an inlet to the fluid mover is disposed proximate the second aperture to permit an outflow from the chamber to the fluid mover; andwherein an outlet from the fluid mover is disposed to permit the outflow from the fluid mover to exit the computing device. 11. The system of claim 10, wherein the electronic device is at least one selected from the group consisting of: a central processing unit, a graphical processing unit, a hard disk drive, and a solid state storage device. 12. A thermal management method, comprising: introducing a fluid into a chamber via a first aperture disposed on a second surface; wherein the chamber is between a first surface and the second surface disposed within an electronic enclosure; andwherein a heat producing electronic device is disposed proximate the first surface;flowing a fluid through the chamber;creating a negative pressure within the chamber, the negative pressure measured within the chamber with respect to an ambient pressure outside of the chamber; wherein the negative pressure is created by using at least a portion of the fluid within the chamber as an inflow to a fluid mover; andwherein the inflow to the fluid mover exits the chamber via a second aperture having an adjustable cross-sectional area; andexhausting at least a portion of the fluid as an outflow from the fluid mover. 13. The method of claim 12, further comprising: measuring a temperature of the second surface. 14. The method of claim 13, further comprising: modulating the fluid outflow from the chamber in response to the measured temperature of the second surface. 15. The method of claim 14, wherein modulating the fluid outflow from the chamber comprises varying the cross-sectional area of the second aperture. 16. The method of claim 14, wherein modulating the fluid outflow from the chamber comprises varying the outflow from the fluid mover.