초록 ▼

Ceramic inserts and hermetically sealed or sealable connectors incorporating a ceramic insert providing conductive pathways between opposing faces and/or side-walls and fabricated using multi-layer ceramic fabrication techniques are described. Conductive pads provided as metalized surfaces on the ce

Ceramic inserts and hermetically sealed or sealable connectors incorporating a ceramic insert providing conductive pathways between opposing faces and/or side-walls and fabricated using multi-layer ceramic fabrication techniques are described. Conductive pads provided as metalized surfaces on the ceramic insert facilitate conductive communication between the conductive pathways transiting the ceramic inserts and conductive structures contacting the conductive pads, such as sockets, pins, wires, and the like.

대표청구항 ▼

1. A connector assembly comprising: a connector shell; a ceramic insert constructed from an insulative ceramic material using a multi-layer ceramic fabrication process mounted in the connector shell and incorporating at least one conductive pathway transiting through an internal portion of the insul

1. A connector assembly comprising: a connector shell; a ceramic insert constructed from an insulative ceramic material using a multi-layer ceramic fabrication process mounted in the connector shell and incorporating at least one conductive pathway transiting through an internal portion of the insulative ceramic material from one face to another; and at least two conductive pads provided on exposed surfaces of the ceramic insert, each conductive pad being electrically connected to at least one terminus of at least one conductive pathway, wherein the conductive pathway(s) follow generally linear path(s) transiting the ceramic insert and provide conductive pathway(s) between conductive pads located generally opposite one another. 2. A connector assembly comprising: a connector shell; a ceramic insert constructed from an insulative ceramic material mounted in the connector shell and incorporating at least one conductive pathway transiting through an internal portion of the insulative ceramic material from one face to another; and at least two conductive pads provided on exposed surfaces of the ceramic insert, each conductive pad being electrically connected to at least one terminus of at least one conductive pathway, wherein—the connector shell is constructed from a metallic material selected from the group consisting of: [Kovar®] iron-nickel alloy, stainless steel, titanium, titanium-containing alloys, aluminum, aluminum-containing alloys, high strength and low thermal expansion alloys. 3. A connector assembly comprising: a connector shell: a ceramic insert constructed from an insulative ceramic material using a multi-layer ceramic fabrication process mounted in the connector shell and incorporating at least one conductive pathway transiting through an internal portion of the insulative ceramic material from one face to another: and at least two conductive pads provided on exposed surfaces of the ceramic insert, each conductive pad being electrically connected to at least one terminus of at least one conductive pathway, wherein at least one of the conductive pathway(s) follows a generally non-linear path and provides a conductive pathway between conductive pads located at disparate, generally non-opposite locations on the ceramic insert. 4. A ceramic insert for mounting in a connector shell, wherein the ceramic insert comprises a plurality of conductive traces transiting through an internal portion of the insert from one face or side-wall to another and terminating, at each thee or side wall, at a conductive pad provided as a metalized surface on the ceramic insert, wherein the ceramic insert is constructed from an insulative ceramic material using a multi-laver ceramic fabrication process, and wherein the conductive traces follow generally linear path(s) transiting the ceramic insert and provide conductive pathways between conductive pads located generally opposite one another. 5. A ceramic insert for mounting in a connector shell, wherein the ceramic insert comprises at least one conductive pathway transiting the insert from one face or side-wall to another and terminating, at each face or side wall, at a conductive pad provided as a metalized surface on the ceramic insert, wherein the ceramic insert is constructed from an insulative ceramic material using a multi-layer ceramic fabrication process, and wherein at least one of the conductive pathways follows a generally non-linear path and provides a conductive pathway between conductive pads located at disparate, generally non-opposite locations on the ceramic insert. 6. The connector assembly of either of claims 1 or 3, additionally comprising a conductive element mounted to and projecting from each conductive pad, providing an electrical pathway from the conductive element, through the conductive pad and the conductive pathway. 7. The connector assembly of claim 6, comprising a plurality of conductive elements mounted to and projecting from a plurality of conductive pads provided on at least two exposed surfaces of the ceramic insert, providing a plurality of conductive pathways transiting the insulative ceramic material. 8. The connector assembly of claim 6, wherein the conductive elements mounted to and projecting from each conductive pad are sockets having a conductive receptacle bonded to the conductive pad. 9. The connector assembly of claim 8, wherein the sockets comprise a conductive receptacle portion extending from the ceramic insert and a mounting portion bonded to the conductive pad. 10. A connector assembly of either of claims 1 or 3, additionally comprising: a conductive element mounted to and projecting from each conductive pad, wherein the connector assembly has a micro-, nano- or sub-d configuration. 11. The connector assembly of claim 2, wherein the connector shell additionally comprises a multi-metallic transition bushing. 12. The connector assembly of either of claim 1 or 3, wherein the ceramic insert is constructed from an insulative ceramic material using a high temperature co-fired ceramic fabrication process. 13. The connector assembly of either of claims 1 or 3, wherein the ceramic insert is constructed from an insulative material selected from the group consisting of: Alumina; aluminum nitride; alumina-containing ceramic materials; low temperature co-fired ceramic materials; zirconia-alumina materials; and beryllium oxide. 14. The connector assembly of claim 6, wherein the conductive elements comprise sockets, pins, and/or wires. 15. The connector assembly of claim 14, wherein the conductive elements are connected to terminated conductive pads by brazing, soldering, conductive adhesives, epoxies or other conductive bonding agents. 16. The connector assembly of claim 7, wherein the conductive pads are arranged in a regularly spaced linear arrangement and have a generally constant configuration and size. 17. The connector assembly of claim 7, wherein the conductive pads substantially span the width of each end face of the ceramic insert. 18. The connector assembly of claim 7, wherein the conductive pads contact on each end face and contact at least a portion of a side face of the connector insert adjacent to the end face. 19. The connector assembly of claim 7, wherein conductive pads are provided on each end face of the ceramic insert and have a different size and/or configuration. 20. The ceramic insert of either of claims 4 or 5, wherein the ceramic insert is constructed from an insulative ceramic material using a high temperature co-fired ceramic fabrication process. 21. A method for constructing connectors, comprising: providing a ceramic insert of either of claims 4 or 5; mounting the ceramic insert in a connector shell; and mounting conductive members having conductive portions extending from the ceramic insert to metalized conductive pads of the ceramic insert. 22. A method for constructing connectors, comprising: providing a ceramic insert of either of claims 4 or 5, the ceramic insert additionally comprising a metallization band extending along a perimeter of the ceramic insert on side walls to facilitate sealing of the ceramic insert in the connector shell; mounting the ceramic insert in a connector shell; mounting conductive members having conductive portions extending from the ceramic insert to metalized conductive pads of the ceramic insert; and bonding the metallization band to a portion of the connector shell. 23. The method of claim 21, additionally comprising bonding a mounting portion of a socket to a portion of a conductive pad to establish a conductive pathway between the conductive pad and the underlying conductive pathway and a conductive receptacle provided in the socket.