초록 ▼

The present invention provides an ultrathin thin film integrated circuit and a thin film integrated circuit device including the thin film integrated circuit device. Accordingly, the design of a product is not spoilt while an integrated circuit formed from a silicon wafer, which is thick and produce

The present invention provides an ultrathin thin film integrated circuit and a thin film integrated circuit device including the thin film integrated circuit device. Accordingly, the design of a product is not spoilt while an integrated circuit formed from a silicon wafer, which is thick and produces irregularities on the surface of the product container. The thin film integrated circuit according to the present invention includes a semiconductor film as an active region (for example a channel region in a thin film transistor), unlike an integrated circuit formed from a conventional silicon wafer. The thin film integrated circuit according to the present invention is thin enough that the design is not spoilt even when a product such as a card or a container is equipped with the thin film integrated circuit.

대표청구항 ▼

1. An article comprising: a sensor portion configured to receive information wirelessly from a flexible integrated circuit,wherein the flexible integrated circuit comprises an antenna and a transistor including an impurity region, which are disposed over a substrate with flexibility, andwherein the

1. An article comprising: a sensor portion configured to receive information wirelessly from a flexible integrated circuit,wherein the flexible integrated circuit comprises an antenna and a transistor including an impurity region, which are disposed over a substrate with flexibility, andwherein the antenna is formed in a same layer as a wiring directly connected to the impurity region. 2. The article according to claim 1, wherein the substrate with flexibility is a plastic substrate. 3. The article according to claim 1, wherein the transistor includes a semiconductor film comprising silicon. 4. The article according to claim 1, wherein nonuniformity of a film thickness of the flexible integrated circuit is at most several hundred nanometers. 5. The article according to claim 1, wherein the article is a cellular phone provided with a reading function. 6. The article according to claim 1, wherein the article is a reader/writer of a contactless type. 7. An article comprising: a sensor portion configured to receive information wirelessly from a flexible integrated circuit,wherein the flexible integrated circuit comprises an antenna and a transistor including an impurity region, which are disposed over a substrate with flexibility,wherein the antenna is formed in a same layer as a wiring directly connected to the impurity region, andwherein a thickness of the flexible integrated circuit is 1500 nm to 3000 nm. 8. The article according to claim 7, wherein the substrate with flexibility is a plastic substrate. 9. The article according to claim 7, wherein the transistor includes a semiconductor film comprising silicon. 10. The article according to claim 7, wherein nonuniformity of a film thickness of the flexible integrated circuit is at most several hundred nanometers. 11. The article according to claim 7, wherein the article is a cellular phone provided with a reading function. 12. The article according to claim 7, wherein the article is a reader/writer of a contactless type. 13. An information receiving system comprising: an article comprising a sensor portion configured to receive information wirelessly from a flexible integrated circuit,wherein the flexible integrated circuit comprises an antenna and a transistor including an impurity region, which are disposed over a substrate with flexibility, andwherein the antenna is formed in a same layer as a wiring directly connected to the impurity region. 14. The information receiving system according to claim 13, wherein the substrate with flexibility is a plastic substrate. 15. The information receiving system according to claim 13, wherein the transistor includes a semiconductor film comprising silicon. 16. The information receiving system according to claim 13, wherein nonuniformity of a film thickness of the flexible integrated circuit is at most several hundred nanometers. 17. The information receiving system according to claim 13, wherein the article is a cellular phone provided with a reading function. 18. The information receiving system according to claim 13, wherein the article is a reader/writer of a contactless type. 19. An information receiving system comprising: an article comprising a sensor portion configured to receive information wirelessly from a flexible integrated circuit,wherein the flexible integrated circuit comprises an antenna and a transistor including an impurity region, which are disposed over a substrate with flexibility,wherein the antenna is formed in a same layer as a wiring directly connected to the impurity region, andwherein a thickness of the flexible integrated circuit is 1500 nm to 3000 nm. 20. The information receiving system according to claim 19, wherein the substrate with flexibility is a plastic substrate. 21. The information receiving system according to claim 19, wherein the transistor includes a semiconductor film comprising silicon. 22. The information receiving system according to claim 19, wherein nonuniformity of a film thickness of the flexible integrated circuit is at most several hundred nanometers. 23. The information receiving system according to claim 19, wherein the article is a cellular phone provided with a reading function. 24. The information receiving system according to claim 19, wherein the article is a reader/writer of a contactless type.