최소 단어 이상 선택하여야 합니다.
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다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
NTIS 바로가기다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
DataON 바로가기다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
Edison 바로가기다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
Kafe 바로가기국가/구분 | United States(US) Patent 등록 |
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국제특허분류(IPC7판) |
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출원번호 | US-0866065 (2007-10-02) |
등록번호 | US-8198138 (2012-06-12) |
발명자 / 주소 |
|
출원인 / 주소 |
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대리인 / 주소 |
|
인용정보 | 피인용 횟수 : 0 인용 특허 : 174 |
Methods for providing and using semiconductor device assemblies or packages include providing or using various elements of a semiconductor device assembly or package. Such a semiconductor device package or assembly may include a substrate and a semiconductor die adjacent to a first surface of the su
Methods for providing and using semiconductor device assemblies or packages include providing or using various elements of a semiconductor device assembly or package. Such a semiconductor device package or assembly may include a substrate and a semiconductor die adjacent to a first surface of the substrate. The substrate of such a semiconductor device assembly or package may also include a second surface opposite from the first surface, an opening extending from the first surface and the second surface, contact pads on the second surface, and substrate pads on the second surface, adjacent to the opening. Bond pads of the semiconductor die may be aligned with the opening through the substrate. Intermediate conductive elements, such as bond wires, may extend from bond pads of the semiconductor die, extend through the opening, protrude beyond the second surface of the substrate, and extend to substrate pads on the second surface. An encapsulant, which may fill the opening and cover the intermediate conductive elements, protrudes beyond a plane in which the second surface of the substrate is located. Discrete conductive elements, such as solder balls, may protrude from the contact pads of the substrate.
1. A method for providing a semiconductor device, comprising: providing a substrate with no more than one opening therethrough, the opening elongated along a center axis of the substrate, the substrate otherwise being substantially uniform in thickness and further comprising a first surface, a secon
1. A method for providing a semiconductor device, comprising: providing a substrate with no more than one opening therethrough, the opening elongated along a center axis of the substrate, the substrate otherwise being substantially uniform in thickness and further comprising a first surface, a second surface opposite the first surface, a first array of substrate pads adjacent to a first side of the opening on the second surface, and a second array of substrate pads adjacent to a second side of the opening on the second surface wherein the first and second arrays have at least three rows of substrate pads parallel to the opening;providing a semiconductor die comprising die pads on an active surface;providing an adhesive material securing the semiconductor die to the first surface of the substrate with the active surface of the semiconductor die facing the first surface of the substrate;providing bond wires that extend between the die pads, through the opening, and to the first and second arrays of substrate pads;providing an encapsulant substantially filling the opening, the encapsulant covering the bond wires and protruding a first distance beyond a plane of the second surface of the substrate forming a protrusion beneath the opening, wherein the protrusion protrudes a first profile distance from the second surface; andproviding solder balls located on the second surface, in electrical communication with the first and second arrays of substrate pads, and protruding from the second surface a second profile distance, with the second profile distance exceeding the first profile distance. 2. The method of claim 1 wherein providing the semiconductor die comprises providing a semiconductor die with the die pads including: a first row of die pads in electrical communication with the first array of substrate pads; anda second row of die pads in electrical communication with the second array of substrate pads. 3. The method of claim 2, wherein providing the substrate comprises providing a substrate with the first and second sides of the opening being parallel to each other. 4. The method of claim 3, wherein providing the substrate comprises providing a substrate lacking substrate pads adjacent to ends of the opening. 5. The method of claim 1, wherein providing the adhesive comprises providing an adhesive that extends beyond an outer periphery of the semiconductor die. 6. The method of claim 5, wherein providing the adhesive comprises providing an adhesive that does not extend beyond a periphery of the opening of the substrate. 7. The method of claim 1, wherein providing the adhesive comprises providing an adhesive that does not extend beyond a periphery of the opening of the substrate. 8. The method of claim 1, wherein providing solder balls comprises providing at least some solder balls at locations on the second surface of the substrate with which the semiconductor die adjacent to the first surface of the substrate is not superimposed. 9. The method of claim 8, wherein providing solder balls comprises providing at least some solder balls at locations on the second surface of the substrate with which the semiconductor die adjacent to the first surface of the substrate is superimposed. 10. The method of claim 9, wherein providing solder balls comprises providing a majority of the solder balls at locations on the second surface of the substrate with which the semiconductor die adjacent to the first surface of the substrate is superimposed. 11. The method of claim 1, wherein providing solder balls comprises providing at least some solder balls at locations on the second surface of the substrate with which the semiconductor die adjacent to the first surface of the substrate is superimposed. 12. The method of claim 1, further comprising: providing a master printed circuit board including connector pads to which the solder balls are soldered, the master printed circuit board including conductive traces for establishing electrical communication between the connector pads and electrical components mounted to the master printed circuit board. 13. The method of claim 12, wherein: providing the semiconductor die comprises providing a semiconductor die with die pads arranged in a non-industry-standard pattern; andproviding the master printed circuit board comprises providing a master printed circuit board with connector pads arranged in an industry-standard pattern. 14. The method of claim 1, wherein: providing the semiconductor die comprises providing a semiconductor die with die pads arranged in a non-industry-standard pattern; andproviding the solder balls comprises providing the solder balls on the second surface of the substrate in an industry-standard pattern. 15. The method of claim 1, wherein providing the substrate comprises providing a substrate with a substantially planar first surface and at least one lateral dimension that exceeds a corresponding lateral dimension of the semiconductor die. 16. The method of claim 15, wherein providing the semiconductor die comprises providing a semiconductor die in an arrangement with the substrate the at least one lateral dimension of the substrate and the corresponding lateral dimension of the semiconductor die are substantially aligned and a portion of the substrate extends laterally beyond an outer periphery of the semiconductor die. 17. The method of claim 1, wherein providing the substrate comprises providing a substrate with an opening having a length at least as long as a corresponding dimension of the semiconductor die. 18. The method of claim 17, wherein providing the semiconductor die comprises providing the semiconductor die in an arrangement with the substrate in which the opening of the substrate extends substantially from one outer peripheral edge of the semiconductor die to an opposite outer peripheral edge of the semiconductor die. 19. The method of claim 1, wherein providing the solder balls comprises: providing a first three rows of solder balls arranged parallel to the center axis of the substrate, in a first region of the second surface of the substrate, the first region being located between the encapsulant and a first edge of the substrate; andproviding a second three rows of solder balls arranged parallel to the center axis of the substrate, in a second region of the second surface of the substrate, the second region being located between the encapsulant and a second edge of the substrate, the second edge being opposite from the first edge. 20. The method of claim 19, wherein providing solder balls comprises providing no more than three rows of solder balls in the first region of the second surface of the substrate and no more than three rows of solder balls in the second region of the second surface of the substrate. 21. The method of claim 19, wherein providing solder balls comprises providing at least some solder balls at locations on the second surface of the substrate with which the semiconductor die adjacent to the first surface of the substrate is not superimposed. 22. The method of claim 1, wherein providing the encapsulant comprises providing an encapsulant substantially laterally confined within a boundary over the second surface of the substrate surrounding the opening and located between the substrate pads and the solder balls. 23. The method of claim 1, wherein providing the encapsulant comprises providing an encapsulant that is substantially absent from regions of the second surface in a vicinity of the solder balls. 24. The method of claim 1, wherein providing the substrate comprises providing a substantially planar substrate of sufficient rigidity to maintain planarity in an outer peripheral region located laterally beyond an outer periphery of the semiconductor die. 25. The method of claim 24, wherein providing the substrate comprises providing a substrate with the peripheral region being at least as wide as a pitch between the solder balls. 26. The method of claim 1, further comprising: providing an encapsulating material on the first surface of the substrate and surrounding an outer periphery of the semiconductor die. 27. A method for providing a semiconductor device, comprising: providing a semiconductor die comprising die pads along a center region of an active surface;providing a substrate comprising a single slot aligned with the die pads, a substantially planar first surface, a substantially planar second surface parallel to the first surface, and first and second arrays of substrate pads on the substantially planar second surface, proximate first and second sides of the single slot, respectively, wherein the first and second arrays of substrate pads have at least three rows of substrate pads parallel to the slot;providing adhesive between the active surface of the die and the first surface of the substrate;providing bond wires that pass through the single slot, with first ends of the bond wires bonded to the die pads and second ends of the bond wires bonded to the first and second arrays of substrate pads;providing encapsulant filling the single slot and protruding a first distance beyond a plane in which the second surface of the substrate is located; andproviding solder balls protruding a second distance from the second surface of the substrate, the second distance being greater than the first distance, the solder balls being configured to establish electrical communication between the semiconductor die and at least one other electronic component. 28. The method of claim 27, wherein providing the semiconductor die comprises providing a semiconductor die with die pads arranged in: a first row in electrical communication with the first array of substrate pads; anda second row in electrical communication with the second array of substrate pads. 29. The method of claim 27, wherein providing the substrate comprise providing a substrate with all of the substrate pads being located proximate to a first side of the single slot or a second side of the single slot. 30. The method of claim 27, wherein providing the adhesive comprises providing an adhesive that extends laterally beyond an outer periphery of the semiconductor die. 31. The method of claim 30, further comprising: providing another encapsulant on the first surface of the substrate and surrounding an outer periphery of the semiconductor die. 32. The method of claim 30, wherein providing the adhesive comprises providing an adhesive substantially laterally confined outside of an interior periphery of the substrate defining the single slot. 33. The method of claim 27, wherein providing the adhesive comprises providing an adhesive substantially laterally confined outside of an interior periphery of the substrate defining the single slot. 34. The method of claim 27, wherein providing the solder balls comprises providing at least some solder balls at locations on the second surface of the substrate with which the semiconductor die adjacent to the first surface of the substrate is not superimposed. 35. The method of claim 34, wherein providing solder balls comprises providing a majority of the solder balls at locations on the second surface of the substrate with which the semiconductor die adjacent to the first surface of the substrate is superimposed. 36. The method of claim 27, wherein providing solder balls comprises providing a majority of the solder balls at locations on the second surface of the substrate with which the semiconductor die adjacent to the first surface of the substrate is superimposed. 37. The method of claim 27, further comprising: providing a printed circuit board including connector pads to which the solder balls are soldered, the printed circuit board including conductive traces for establishing electrical communication between the connector pads and electrical components mounted to the printed circuit board. 38. The method of claim 37, wherein: providing the semiconductor die comprises providing a semiconductor die with die pads arranged in a non-industry-standard pattern; andproviding the printed circuit board comprises providing a printed circuit board with connector pads arranged in an industry-standard pattern. 39. The method of claim 27, wherein: providing the semiconductor die comprises providing a semiconductor die with die pads arranged in a non-industry-standard pattern; andproviding the solder balls comprises providing solder balls in an industry-standard pattern. 40. The method of claim 27, wherein providing the substrate comprises providing a substrate of sufficient rigidity to maintain planarity in an outer peripheral region located laterally beyond an outer periphery of the semiconductor die. 41. The method of claim 40, wherein providing the substrate comprises providing a substrate with the peripheral region being at least as wide as a pitch between the solder balls. 42. The method of claim 27, wherein providing the substrate comprises providing a substrate with the single slot having a length at least as long as a corresponding dimension of the semiconductor die. 43. The method of claim 42, wherein providing the semiconductor die comprises providing the semiconductor die in an arrangement with the substrate in which the single slot of the substrate extends substantially from one outer peripheral edge of the semiconductor die to an opposite outer peripheral edge of the semiconductor die. 44. The method of claim 43, wherein providing the substrate comprises providing a substrate of sufficient rigidity to maintain planarity in outer peripheral region located laterally beyond an outer periphery of the semiconductor die. 45. The method of claim 27, wherein providing the solder balls comprises: providing a first three rows of solder balls arranged parallel to the single slot of the substrate, in a first region of the second surface of the substrate, the first region being located between the encapsulant and a first edge of the substrate; andproviding a second three rows of solder balls arranged parallel to the single slot of the substrate, in a second region of the second surface of the substrate, the second region being located between the encapsulant and a second edge of the substrate, the second edge being opposite from the first edge. 46. The method of claim 45, wherein providing solder balls comprises providing no more than three rows of solder balls in the first region of the second surface of the substrate and no more than three rows of solder balls in the second region of the second surface of the substrate. 47. The method of claim 45, wherein providing solder balls comprises providing at least some solder balls at locations on the second surface of the substrate with which the semiconductor die adjacent to the first surface of the substrate is not superimposed. 48. The method of claim 27, wherein providing the encapsulant comprises providing an encapsulant substantially laterally confined within a boundary over the second surface of the substrate surrounding the single slot and located between the substrate pads and the solder balls. 49. The method of claim 27, wherein providing the encapsulant comprises providing an encapsulant that does not encroach into the first or second region of the second surface of the substrate. 50. The method of claim 27, wherein providing the substrate comprises providing a printed circuit board. 51. A method, comprising: providing a packaged device comprising a semiconductor die, having die pads near a center line of the die, adhered to a top side of a substantially planar package substrate having a through-hole through which conductive wires, bonded to the die pads, pass through and touch down on a bottom side of the substrate wherein the bottom side of the substrate has two arrays of substrate connectors a first array disposed on a first side of the through hole and having at least three rows of substrate pads and a second array disposed on a second side of the through hole and having at least three rows of substrate pads, wherein an encapsulating material is disposed in the through-hole and protrudes a first distance beyond a plane defined by the bottom side of the substrate; andproviding a PCB, to which other electrical components are mounted, comprising conductive traces to provide electrical communication between the die and the other electrical components, wherein the bottom side of the substrate is attached to the PCB via solder elements, and the first distance that the encapsulating material protrudes is less than a second distance between the bottom side of the substrate and the PCB. 52. The method of claim 51, wherein providing the packaged device comprises providing the device wherein the conductive wires are bond wires. 53. The method of claim 52, wherein providing the packaged device comprises providing the device wherein the die pads comprise two or more rows of die pads. 54. The method of claim 53, wherein providing the packaged device comprises providing the device wherein the die pads comprise first and second rows of die pads electrically coupled by the bond wires to first and second arrays of substrate pads, respectively, adjacent to first and second sides of the through-hole, respectively. 55. The method of claim 54, wherein providing the packaged device comprises providing the device wherein the first and second sides of the through-hole are the only sides of the through-hole having substrate pads proximate thereto, the substrate comprises only one through-hole, and the through-hole exposes the die to the encapsulating material from approximately one edge of the die to another. 56. The method of claim 51, wherein providing the PCB comprises providing the PCB wherein the first distance is at least a majority of the second distance between the bottom side of the substrate and the PCB. 57. The method of claim 51, wherein providing the packaged device comprises providing the device further comprising an adhering material to adhere the die to the top side of the package substrate, wherein the adhering material does not encroach above the through-hole, and further comprising an encapsulating material disposed on the top side of the substrate and surrounding a periphery of the die. 58. The method of claim 57, wherein providing the packaged device comprises providing the device wherein the adhering material extends beyond a periphery of the die. 59. The method of claim 51, wherein providing the packaged device comprises providing the device wherein the encapsulating material tapers toward the plane from a portion of the encapsulating material disposed beneath the center line of the die. 60. The method of claim 51, wherein providing the PCB comprises providing the PCB wherein at least some of the solder elements are at least partially disposed outside of any location underneath the die. 61. The method of claim 60, wherein providing the PCB comprises providing the PCB wherein a majority of the solder elements are disposed underneath the die. 62. The method of claim 51, wherein providing the PCB comprises providing the PCB wherein most of the solder elements are disposed underneath the die. 63. The method of claim 51, wherein providing the PCB comprises providing the PCB wherein the solder elements are arranged in accordance with an industry-standard pattern and the die pads are arranged in a non-industry-standard pattern. 64. The method of claim 63, wherein providing the packaged device comprises providing the device wherein the through-hole exposes a region of the die to the encapsulating material that extends from one edge of the die to an opposite edge of the die. 65. The method of claim 51, wherein providing the packaged device comprises providing the device wherein the substrate is sufficiently rigid to maintain planarity in a region between outer edges of the die and outer edges of the substrate. 66. The method of claim 65, wherein providing the PCB comprises providing the PCB wherein the solder elements have a minimum pitch and at least one side of the peripheral region is at least as wide as the pitch. 67. The method of claim 51, wherein providing the packaged device comprises providing the device wherein the through-hole exposes a region of the die to the encapsulanting material that extends from one edge of the die to an opposite edge of the die. 68. The method of claim 67, wherein providing the packaged device comprises providing the device wherein the substrate is of sufficient rigidity to maintain planarity in a peripheral region that extends out from a periphery of the die to a periphery of the substrate. 69. The method of claim 51, wherein providing the PCB comprises providing the PCB wherein a first three rows of the solder elements, parallel to the through-hole, are disposed beneath a first region of the bottom side of the substrate that extends between the through-hole and a first edge of the substrate, and a second three rows of the solder balls, parallel to the through-hole, are disposed beneath a second region of the bottom side of the substrate that extends between the through-hole and a second edge, opposite the first edge, of the substrate. 70. The method of claim 69, wherein providing the packaged device comprises providing the device wherein the encapsulating material is substantially absent from beneath the first and second regions of the bottom side of the substrate other than proximate the through-hole. 71. The method of claim 70, wherein providing the PCB comprises providing the PCB further comprising connector pads to which the solder elements are soldered, the connector pads are electrically coupled to the conductive traces, the through-hole exposes a region of the die to the encapsulating material that extends from one edge of the die to an opposite edge of the die, the connector pads are arranged in accordance with an industry-standard pattern, and the die pads are arranged in a non-industry-standard pattern. 72. The method of claim 51, wherein providing the packaged device comprises providing the device further comprising encapsulating material disposed on the top side of the substrate and surrounding a periphery of the die. 73. The method of claim 51, wherein providing the packaged device comprises providing the device wherein the package substrate is a printed circuit board.
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