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An integrated circuit device includes a die, a lead, and an electrically-conductive structure that is arranged to facilitate electrical communication between the die and the lead. The device also includes a potting material, in which the electrically conductive structure, the die, and at least part

An integrated circuit device includes a die, a lead, and an electrically-conductive structure that is arranged to facilitate electrical communication between the die and the lead. The device also includes a potting material, in which the electrically conductive structure, the die, and at least part of the lead are embedded. An electrically-conductive housing encases the potting material and forms exterior packaging of the device. During manufacturing, the electrically-conductive structure, the die, and at least part of the lead may be arranged within the electrically-conductive housing either before or after the potting material is disposed in the housing. When the integrated circuit device is operating, heat is removable from the die via a thermal conduction path formed by the electrically-conductive structure, the potting material, and the electrically-conductive housing.

대표청구항 ▼

1. An integrated circuit device, comprising: a die;a first lead and a second lead;an electrically-conductive structure, distinct from said first lead and said second lead, wherein said die has two opposing sides, wherein one side of said die faces said electrically-conductive structure and the other

1. An integrated circuit device, comprising: a die;a first lead and a second lead;an electrically-conductive structure, distinct from said first lead and said second lead, wherein said die has two opposing sides, wherein one side of said die faces said electrically-conductive structure and the other side of said die contacts said first lead, and wherein said second lead makes direct contact with said first lead and also with a same side of said electrically-conductive structure as said die faces;a potting material having the electrically conductive structure, the die, the first lead and at least part of the second lead embedded therein, wherein said die rests on said electrically-conductive structure embedded in said potting material; andan electrically-conductive housing encasing only the potting material, together with the electrically conductive structure, the die, the first lead and at least part of the second lead embedded therein, and arranged to form exterior packaging of the integrated circuit device,wherein heat is removable from the die via a thermal conduction path formed by the electrically-conductive structure, the potting material, and the electrically-conductive housing. 2. The integrated circuit device according to claim 1, wherein the electrically-conductive housing encases a majority of a surface area of the potting material. 3. The integrated circuit device according to claim 1, wherein the die comprises a semiconductor die. 4. The integrated circuit device according to claim 1, wherein the integrated circuit device comprises a rectifier. 5. The integrated circuit device according to claim 1, wherein the integrated circuit device comprises one of a surface-mountable device and a through-hole-mountable device. 6. The integrated circuit device according to claim 1, wherein the integrated circuit device comprises an active device. 7. The integrated circuit device according to claim 1, wherein the electrically-conductive structure comprises one of a copper pad, a solder ball, a lead, and a lead frame. 8. The integrated circuit device according to claim 1, wherein the potting material comprises a dielectric thermally-conductive material. 9. The integrated circuit device according to claim 8, wherein the potting material comprises epoxy. 10. The integrated circuit device according to claim 1, wherein the electrically-conductive housing comprises a metal case. 11. The integrated circuit device according to claim 10, wherein the metal case comprises an aluminum composite case. 12. The integrated circuit device according to claim 1, further comprising: a structure integral with and extending from the electrically-conductive housing, wherein heat is removable from the integrated circuit device via a thermal conduction path formed by the structure. 13. An integrated circuit device, comprising: an electrically-conductive housing having an interior surface and an exterior surface, the interior surface defining a cavity;a sub-assembly arranged in the cavity in such a manner that space exists between the sub-assembly and the interior surface, the sub-assembly comprising a die,a first lead and a second lead;an electrically-conductive structure, distinct from said first lead and said second lead, wherein said die has two opposing sides, wherein one side of said die faces said electrically-conductive structure and the other side of said die contacts said first lead, and wherein said second lead makes direct contact with said first lead and also with a same side of said electrically-conductive structure as said die faces; anda potting material disposed in the space between the sub-assembly and the interior surface, wherein said die rests on said electrically-conductive structure embedded in said potting material, and wherein said electrically-conductive housing encases only the potting material, the electrically conductive structure, the die, the first lead and at least part of the second lead embedded therein, and is arranged to form exterior packaging of the integrated circuit device. 14. The integrated circuit device according to claim 13, wherein heat is removable from the die through the exterior surface of the electrically-conductive housing via a thermal conduction path formed by the electrically-conductive structure, the potting material, the interior surface of the electrically-conductive housing, and the exterior surface of the electrically-conductive housing. 15. The integrated circuit device according to claim 1, wherein a portion of said lead extends from one exterior side of said electrically conductive housing, and wherein said potting material is exposed at the one exterior side of said electrically conductive housing from which said lead extends.