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An electrolytic capacitor that is configured to be embedded into a circuit board is provided. The electrolytic capacitor contains a capacitor element, anode and cathode terminations, and a case that encapsulates the capacitor element and leaves at least a portion of the anode and cathode termination

An electrolytic capacitor that is configured to be embedded into a circuit board is provided. The electrolytic capacitor contains a capacitor element, anode and cathode terminations, and a case that encapsulates the capacitor element and leaves at least a portion of the anode and cathode terminations exposed that extend outwardly from opposite ends of the case. Each of the terminations possesses an upper surface that faces toward the capacitor element and a lower surface that faces away from the capacitor element. In contrast to conventional surface-mounted electrolytic capacitors, the upper surfaces of these exposed anode and cathode termination portions are mounted to the circuit board. In this manner, the capacitor may essentially be mounted “upside down” so that some or all of its thickness becomes embedded within the board itself, thereby minimizing the height profile of the capacitor on the board.

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1. A circuit board comprising: a substrate that defines a mounting surface on which is located opposing conductive members, wherein a recessed opening is provided in the mounting surface between the conductive members; anda capacitor that comprises: a solid electrolytic capacitor element containing

1. A circuit board comprising: a substrate that defines a mounting surface on which is located opposing conductive members, wherein a recessed opening is provided in the mounting surface between the conductive members; anda capacitor that comprises: a solid electrolytic capacitor element containing an anode and cathode;an anode termination that is electrically connected to the anode and contains a first component that is generally parallel to a lower surface of the capacitor element;a cathode termination that is electrically connected to the cathode and contains a second component that is generally parallel and physically connected to a lower surface of the capacitor element, wherein the second component exists in a single plane; anda case that encapsulates the solid electrolytic capacitor element yet leaves exposed at least a portion of the first component and the second component,wherein a lower surface of the case is generally coplanar with a lower surface of the first component and a lower surface of the second component,wherein the exposed portions of the first component and the second component extend outwardly from the case in a direction parallel to a lower surface of the capacitor element and in a generally coplanar relationship, the exposed portions each defining an upper surface facing the capacitor element and an opposing lower surface facing away from the capacitor element, wherein the upper surfaces of the first component and the second component are electrically connected to respective conductive members so that the capacitor element is substantially embedded within the recessed opening and so that a surface of the case is substantially coplanar with the mounting surface of the substrate. 2. The circuit board of claim 1, wherein the second component of the cathode termination is connected to the capacitor element by a conductive adhesive. 3. The circuit board of claim 1, wherein the capacitor element includes a dielectric layer overlying the anode, and a cathode overlying the dielectric layer that includes a solid electrolyte, and wherein an anode lead is electrically connected to the anode. 4. The circuit board of claim 3, wherein the anode includes tantalum, niobium, or an electrically conductive oxide thereof. 5. The circuit board of claim 3, wherein the solid electrolyte includes manganese dioxide, a conductive polymer, or a combination thereof. 6. The circuit board of claim 3, wherein the anode lead is positioned within the recessed opening. 7. The circuit board of claim 1, wherein the first component of the anode termination is physically connected to the lower surface of the capacitor element. 8. The circuit board of claim 1, wherein the anode termination further comprises a third component that is generally perpendicular to the first component. 9. The circuit board of claim 8, wherein the third component contains a U-shaped region to which an anode lead is electrically connected. 10. The circuit board of claim 8, wherein the third component is encapsulated within the case. 11. The circuit board of claim 1, wherein the cathode termination further comprises a fourth component that is generally perpendicular to the second component and is electrically connected to a rear surface of the capacitor element. 12. The circuit board of claim 11, wherein the fourth component is encapsulated within the case. 13. The circuit board of claim 1, wherein the ratio of the length of the exposed portion of the first component or the length of the exposed portion of the second component to the length of the case is from about 0.05 to about 1. 14. The circuit board of claim 1, wherein the ratio of the length of the exposed portion of the first component or the length of the exposed portion of the second component to the length of the case is from about 0.08 to about 0.5. 15. The circuit board of claim 1, wherein the case has a thickness of from about from about 0.1 to about 2.0 millimeters and the substrate has a thickness of from about 0.2 to about 3 millimeters. 16. The circuit board of claim 1, wherein the lower surface of the case extends slightly above the mounting surface of the substrate.