Wafer polishing carrier apparatus and chemical mechanical polishing equipment using the same
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B24B-029/00
B24B-047/00
출원번호
US-0231529
(2008-09-03)
등록번호
US-8202140
(2012-06-19)
우선권정보
KR-10-2007-0089262 (2007-09-04)
발명자
/ 주소
Hong, Yong-Sung
Park, Jong-Yoon
Park, Hyun-Joon
출원인 / 주소
Samsung Electronics Co., Ltd.
대리인 / 주소
Onello & Mello, LLP
인용정보
피인용 횟수 :
3인용 특허 :
3
초록▼
A wafer polishing carrier apparatus and a chemical mechanical polishing equipment employing the same includes a drive rotary union rotating on an axis and receiving a flow of fluid through a first conduit in a sealed-up state; driven rotary unions revolving on their own axis at different sides of th
A wafer polishing carrier apparatus and a chemical mechanical polishing equipment employing the same includes a drive rotary union rotating on an axis and receiving a flow of fluid through a first conduit in a sealed-up state; driven rotary unions revolving on their own axis at different sides of the drive rotary union, and receiving the flow of fluid from the drive rotary union through a second conduit in a sealed-up state; a carrier attached to an end part of the driven rotary union to adsorb/detach a wafer using a fluid pressure provided through a third conduit connected through the second conduit; and a filter filtering pollution material in the fluid flowing in and out of the third conduit on the periphery of the carrier to prevent the pollution material from escaping external to the carrier, the pollution material generated from rotation of the drive rotary union and driven rotary unions.
대표청구항▼
1. A wafer polishing carrier apparatus, comprising: a drive rotary union configured to rotate on a given axis and to receive a flow of fluid through a first conduit in a sealed-up state thereof;driven rotary unions configured to revolve on their own axis at different sides of the drive rotary union,
1. A wafer polishing carrier apparatus, comprising: a drive rotary union configured to rotate on a given axis and to receive a flow of fluid through a first conduit in a sealed-up state thereof;driven rotary unions configured to revolve on their own axis at different sides of the drive rotary union, and to receive the flow of the fluid from the drive rotary union through a second conduit in a sealed-up state thereof;carriers, each carrier attached to an end part of a different one of the driven rotary unions to adsorb or detach a wafer by using a pressure from the flow of the fluid provided through a third conduit connected to the second conduit of the corresponding driven rotary union; anda filter configured to filter pollution material contained in the flow of the fluid as it flows in and out of the third conduit on a periphery of each carrier to prevent the pollution material from escaping external to each carrier, the pollution material being generated from a rotation of the drive rotary union and the driven rotary union. 2. The apparatus of claim 1, wherein each carrier comprises a carrier adapter that is combined with an end part of the driven rotary union and that is provided with the third conduit extended from the second conduit of the driven rotary union, and a carrier head configured to suck or separate the wafer by using the flow of the fluid through the third conduit of the carrier adapter, the carrier head being formed to surround a rear face and an outer circumference of the wafer. 3. The apparatus of claim 2, wherein the filter is adapted in a plurality of tubes coupled with a plurality of connectors to which the third conduit of the carrier adapter is external to the carrier adapter. 4. The apparatus of claim 1, wherein the fluid is air and the filter comprises a dry filter configured to filter the pollution material contained in the air by using pressure of the air flowing through the third conduit. 5. The apparatus of claim 4, wherein the filter is configured to filter pollution material having a size of 1 μm or larger contained in the air. 6. The apparatus of claim 1, wherein the filter comprises a plurality of individual filters sequentially arrayed, each of the plurality of individual filters comprising a filtering material or filtering mesh with numerous holes, at least some holes having different sizes. 7. The apparatus of claim 1, wherein the drive rotary union comprises a central fixation axis including a plurality of first conduits adapted in a lengthwise direction through which the flow of the fluid flows, a hollow rotary axis rotating along a girth of the central fixation axis to open end parts of the plurality of first conduits, a seal housing spaced by a given distance from the hollow rotary axis and formed to surround the hollow rotary axis, a fluid pipe branched from the seal housing for providing the flow of the fluid into the driven rotary union, and spins formed to surround a periphery of the fluid pipe and the driven rotary union. 8. The apparatus of claim 7, wherein the driven rotary union comprises a second seal housing coupled to the fluid pipe of the drive rotary union, and a driven axis in which a second conduit is formed, the second conduit configured to rotate on a center of the second seal housing and to flow the fluid. 9. The apparatus of claim 8, wherein each carrier comprises a carrier adapter that is combined with an end part of the driven axis of the driven rotary union and that is provided with the third conduit extended from the second conduit of the driven axis, and a carrier head for sucking or separating the wafer using the flow of the fluid through the third conduit of the carrier adapter, the carrier head being formed to surround a rear face and an outer circumference of the wafer. 10. The apparatus of claim 9, wherein the third conduit is exposed to a plurality of connectors formed into a sidewall of the carrier adapter and is coupled to a tube adapted external to the carrier adapter. 11. The apparatus of claim 1, wherein the filter is configured to filter the pollution material contained in the flow of the fluid as it flows through the tube. 12. A polishing unit for use in a chemical mechanical polishing apparatus, comprising: a platen provided with a polishing pad having a given surface roughness;a slurry supply nozzle configured to supply a slurry onto the polishing pad of the platen;a pad conditioner configured to grind a surface of the polishing pad at an upper part of the platen adjacent to the slurry supply nozzle; anda wafer polishing carrier apparatus including: a drive rotary union configured to rotate on a given axis and to receive a flow of fluid through a first conduit in a sealed-up state thereof and to position the pad conditioner and the slurry supply nozzle above the platen;driven rotary unions configured to revolve on their own axis at different sides of the drive rotary union and to receive the flow of the fluid from the drive rotary union through a second conduit in a sealed-up state thereof;carriers, each carrier attached to an end part of a different one of the driven rotary unions to adsorb or detach a wafer by using a pressure from the flow of the fluid provided through a third conduit connected to the second conduit of the corresponding driven rotary union; anda filter configured to filter pollution material contained in the flow of the fluid as it flows in and out of the third conduit on a periphery of each carrier so as to prevent the pollution material from escaping external to each carrier, the pollution material being generated from a rotation of the drive rotary union and the driven rotary union. 13. The unit of claim 12, wherein each carrier comprises a carrier adapter that is combined with an end part of the driven rotary union and that is provided with the third conduit extended from the second conduit of the driven rotary union, and a carrier head configured to suck or separate the wafer by using the flow of the fluid through the third conduit of the carrier adapter, the carrier head being formed to surround a rear face and an outer circumference of the wafer. 14. The unit of claim 13, wherein the filter is adapted in a plurality of tubes coupled with a plurality of connectors to which the third conduit of the carrier adapter is external to the carrier adapter. 15. The unit of claim 12, wherein the fluid is air and the filter comprises a dry filter configured to filter the pollution material contained in the air by using pressure of air flowing through the third conduit. 16. The unit of claim 15, wherein the filter is configured to filter pollution material having a size of 1 μm or larger contained in the air. 17. The unit of claim 12, wherein the filter comprises a plurality of individual filters sequentially arrayed, each of the plurality of individual filters comprising a filtering material or filtering mesh with numerous holes, at least some holes having different sizes. 18. A chemical mechanical polishing apparatus, comprising: a wafer cassette load port configured to load a plurality of wafer cassettes thereon, the plurality of wafer cassettes configured to hold a plurality of wafers;a factory interface configured to take out a wafer from one of the plurality of wafer cassettes loaded on the wafer cassette load port and to transfer the wafer to a polishing unit, then to a cleaning and drying device, and then to mount the wafer onto one of the plurality of wafer cassettes; anda wafer polishing carrier apparatus including: a drive rotary union configured to rotate at a center upper part of a platen provided with a polishing pad having a given surface roughness, and to receive a flow of fluid through a first conduit in a sealed-up state thereof;driven rotary unions configured to revolve on their own axis at different sides of the drive rotary union and to receive the flow of the fluid from the drive rotary union through a second conduit in a sealed-up state thereof;carriers, each carrier attached to an end part of a different one of the driven rotary unions to adsorb or detach the wafer by using a pressure from the flow of the fluid provided through a third conduit connected to the second conduit of the corresponding driven rotary union, anda filter configured to filter pollution material contained in the flow of fluid as it flows in and out of the third conduit on a periphery of each carrier so as to prevent the pollution material from escaping external to each carrier, the pollution material being generated from a rotation of the drive rotary union and the driven rotary union. 19. The apparatus of claim 18, wherein each carrier comprises a carrier adapter that is combined with an end part of the driven rotary union and that is provided with the third conduit extended from the second conduit of the driven rotary union, and a carrier head configured to suck or separate the wafer by using the flow of the fluid through the third conduit of the carrier adapter, the carrier head being formed to surround a rear face and an outer circumference of the wafer. 20. The apparatus of claim 19, wherein the filter is adapted in a plurality of tubes coupled with a plurality of connectors to which the third conduit of the carrier adapter is external to the carrier adapter.
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이 특허에 인용된 특허 (3)
Yo-han Ahn KR; Byung moo Lee KR; Jae-won Choi KR; Tae-ho Kim KR, Chemical mechanical polishing apparatus and method of washing contaminants off of the polishing head thereof.
Tolles Robert D. ; Shendon Norm ; Somekh Sasson ; Perlov Ilya ; Gantvarg Eugene ; Lee Harry Q., Continuous processing system for chemical mechanical polishing.
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