Process for the purification of benzene feedstock containing contaminating sulfur compounds
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
C10G-025/05
C10G-045/04
출원번호
US-0909226
(2006-03-07)
등록번호
US-8202414
(2012-06-19)
우선권정보
EP-05075694 (2005-03-23)
국제출원번호
PCT/NL2006/000116
(2006-03-07)
§371/§102 date
20100518
(20100518)
국제공개번호
WO2006/101382
(2006-09-28)
발명자
/ 주소
Reesink, Bernard Hendrik
출원인 / 주소
BASF Corporation
대리인 / 주소
Keller, Raymond F.
인용정보
피인용 횟수 :
4인용 특허 :
2
초록▼
The invention is directed to a process for the purification of benzene feedstock containing contaminating sulfur compounds, more in particular thiophenic sulfur compounds, said process comprising contacting the benzene feedstock in the presence of hydrogen with a sulfided nickel adsorbent, wherein i
The invention is directed to a process for the purification of benzene feedstock containing contaminating sulfur compounds, more in particular thiophenic sulfur compounds, said process comprising contacting the benzene feedstock in the presence of hydrogen with a sulfided nickel adsorbent, wherein in said adsorbent part of the nickel is present in the metallic form, and subsequently contacting the said feedstock with a supported metallic copper adsorbent.
대표청구항▼
1. Process for the purification of benzene feedstock containing contaminating sulfur compounds, more in particular thiophenic sulfur compounds, said process comprising contacting the benzene feedstock in the presence of hydrogen with a sulfided nickel adsorbent, wherein in said adsorbent part of the
1. Process for the purification of benzene feedstock containing contaminating sulfur compounds, more in particular thiophenic sulfur compounds, said process comprising contacting the benzene feedstock in the presence of hydrogen with a sulfided nickel adsorbent, wherein in said adsorbent part of the nickel is present in the metallic form, and subsequently contacting the said feedstock with a supported metallic copper adsorbent. 2. Process according to claim 1, wherein at least 10%, on atomic basis, of the nickel is in the metallic form. 3. Process according to claim 1, wherein the nickel surface has an atomic S to Ni ratio of at least 0.5. 4. Process according to claim 1, wherein the adsorbent has a rate constant for tetralin hydrogenation activity at 150° C. is less than 0.01 1/s·g cat. 5. Process according to claim 1, wherein the said nickel adsorbent has been obtained by treating a metallic nickel adsorbent, optionally on a support or containing a structural promoter, with sulfur or a sulfur compound or by coprecipitating the precursors for the nickel adsorbent and the sulfur compound, said treatment preferably encompassing precipitating S, a polysulfide or an S-compound on the nickel adsorbent, by coprecipitating S, a polysulfide or an S-compound with the nickel adsorbent precursors, or impregnating the nickel adsorbent with S, a polysulfide or an S-compound sulfur compound. 6. Process according to claim 1, wherein the hydrogen partial pressure is between 0.1 and 200 bar and preferably between 10 and 75 bar and more in particular between 30 and 50 bar. 7. Process according to claim 1, wherein the metallic copper adsorbent is supported on an oxidic support, preferably a metal oxide that forms stable sulfides. 8. Process according to claim 1, wherein the nickel adsorbent comprises nickel that is present on a support material. 9. Process according to claim 1, wherein the volume of the bed of the nickel adsorbent is between 10 and 90% of the combined volume of the beds of the nickel adsorbent and the copper adsorbent. 10. Process for producing cyclohexane from benzene, said process comprising treating a sulfur contaminants containing benzene feedstock using the process of claim 1, followed by selectively hydrogenating the benzene to produce cyclohexane. 11. Process according to claim 2, wherein the nickel surface has an atomic S to Ni ratio of at least 0.5. 12. Process according to claim 2, wherein the adsorbent has a rate constant for tetralin hydrogenation activity at 150° C. is less than 0.01 1/s·g cat. 13. Process according to claim 2, wherein the said nickel adsorbent has been obtained by treating a metallic nickel adsorbent, optionally on a support or containing a structural promoter, with sulfur or a sulfur compound or by coprecipitating the precursors for the nickel adsorbent and the sulfur compound, said treatment preferably encompassing precipitating S, a polysulfide or an S-compound on the nickel adsorbent, by coprecipitating S, a polysulfide or an S-compound with the nickel adsorbent precursors, or impregnating the nickel adsorbent with S, a polysulfide or an S-compound sulfur compound. 14. Process according to claim 2, wherein the hydrogen partial pressure is between 0.1 and 200 bar and preferably between 10 and 75 bar and more in particular between 30 and 50 bar. 15. Process according to claim 2, wherein the metallic copper adsorbent is supported on an oxidic support, preferably a metal oxide that forms stable sulfides. 16. Process according to claim 2, wherein the nickel adsorbent comprises nickel that is present on a support material. 17. Process according to claim 2, wherein the volume of the bed of the nickel adsorbent is between 10 and 90% of the combined volume of the beds of the nickel adsorbent and the copper adsorbent. 18. Process for producing cyclohexane from benzene, said process comprising treating a sulfur contaminants containing benzene feedstock using the process of claim 2, followed by selectively hydrogenating the benzene to produce cyclohexane. 19. Process according to claim 3, wherein the adsorbent has a rate constant for tetralin hydrogenation activity at 150° C. is less than 0.01 1/s·g cat. 20. Process according to claim 3, wherein the said nickel adsorbent has been obtained by treating a metallic nickel adsorbent, optionally on a support or containing a structural promoter, with sulfur or a sulfur compound or by coprecipitating the precursors for the nickel adsorbent and the sulfur compound, said treatment preferably encompassing precipitating S, a polysulfide or an S-compound on the nickel adsorbent, by coprecipitating S, a polysulfide or an S-compound with the nickel adsorbent precursors, or impregnating the nickel adsorbent with S, a polysulfide or an S-compound sulfur compound.
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