[특허]Power semiconductor package with bottom surface protrusions

Power semiconductor package with bottom surface protrusions 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H01L-023/48
출원번호	US-0462245 (2009-07-31)
등록번호	US-8207455 (2012-06-26)
발명자 / 주소	Balakrishnan, Balu Hawthorne, Brad L. Bäurle, Stefan
출원인 / 주소	Power Integrations, Inc.
대리인 / 주소	The Law Offices of Bradley J. Bereznak
인용정보	피인용 횟수 : 0 인용 특허 : 86

초록 ▼

A package includes a body that encapsulates a semiconductor die, the body having a first pair of opposing lateral sides, a second pair of opposing lateral sides, a top, and a bottom. The bottom has a primary surface and a plurality of protrusions that extend outward from the primary surface. When the package is mounted to a printed circuit board (PCB) the protrusions contact the PCB and the primary surface is disposed a first distance away from the PCB. The package further includes a plurality of leads that extend outward from the first pair of opposing lateral sides.

대표청구항 ▼

1. A package for housing a power semiconductor device comprising: a body that encapsulates the power semiconductor device, the body having a first pair of opposing lateral sides, front and back sides, a top that provides a mounting surface for a heat sink, and a bottom surface,a single elongated protrusion disposed substantially coincident with an edge of the bottom surface, the single elongated protrusion extending outward from the bottom surface such that when the package is mounted to a printed circuit board (PCB) the one or more non-conductive protrusions contact the PCB and the bottom surface lies at an angle or incline in relation to the surface of the PCB after assembly; anda plurality of leads that extend outward from at least the first pair of opposing lateral sides, each of the leads having a substantially constant width over a length that extends from the body to a point through an insertion hole of the PCB when the package is mounted to the PCB. 2. The package of claim 1 wherein the single elongated protrusion is disposed substantially coincident with an edge of the bottom surface. 3. The package of claim 1 wherein the single elongated protrusion is substantially linear. 4. The package of claim 1 wherein single elongated protrusion has a substantially flat base. 5. The package of claim 1 wherein the body is rectilinear and the single elongated protrusion extends substantially across a length of a first lateral side between first and second corners of the body. 6. The package of claim 1 wherein each of the leads is separated from an adjacent one of the leads by a second distance that is substantially constant over the length. 7. The package of claim 1 wherein the body comprises a material, the single elongated protrusion being integral with the material. 8. The package of claim 1 wherein a force applied to a heat sink during mounting to the top is substantially transferred to the single elongated protrusions when the package is mounted to the PCB.

이 특허에 인용된 특허 (86)

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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
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저장형식	Text(ASCII format) Excel format PIAS분석(.xls)
메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
안내	총 건의 자료가 검색되었습니다. 다운받으실 자료의 인덱스를 입력하세요. (1-10,000) 검색결과의 순서대로 최대 10,000건 까지 다운로드가 가능합니다. 데이타가 많을 경우 속도가 느려질 수 있습니다.(최대 2~3분 소요) 다운로드 파일은 UTF-8 형태로 저장됩니다. 파일의 내용이 제대로 보이지 않을실 때는 웹브라우저 상단의 보기 -> 인코딩 -> 자동선택 여부를 확인하십시오. ~ Text(ASCII format) Excel format

연합인증

Power semiconductor package with bottom surface protrusions 원문보기

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Power semiconductor package with bottom surface protrusions 원문보기

초록 ▼

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연구과제 타임라인

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이 특허에 인용된 특허 (86)

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