초록 ▼

Shaped integrated passive devices and corresponding methodologies relate to construction and mounting of shaped passive devices on substrates so as to provide both mechanical and electrical connection. Certain components and component assemblies are associated with the implementation of surface moun

Shaped integrated passive devices and corresponding methodologies relate to construction and mounting of shaped passive devices on substrates so as to provide both mechanical and electrical connection. Certain components and component assemblies are associated with the implementation of surface mountable devices. Specially shaped integrated passive device are capable of providing simplified mounting on and simultaneous connection to selected electrical pathways on a printed circuit board or other mounting substrate. Shaped, plated side filter devices have plated sides which provide both mounting and grounding/power coupling functions. Thin film filters may be constructed on silicon wafers, which are then diced from the top surface with an angular dicing saw to produce a shaped groove in the top surface. The groove may be v-shaped or other shape, and is then plated with a conductive material. Individual pieces are separated by grinding the back surface of the wafer down to where the grooves are intercepted. The plated grooves serve as ground or power connection points for the filter circuit. The metallized slopes of the plated grooves are used in securing the individual pieces to a mounting surface, by soldering or using conductive epoxy.

대표청구항 ▼

1. An integrated electronic component, comprising: a printed circuit board with at least one conductive trace thereon;an electronic device characterized by opposing top and bottom surfaces, first and second side surfaces and first and second end surfaces, said electronic device comprising a circuit

1. An integrated electronic component, comprising: a printed circuit board with at least one conductive trace thereon;an electronic device characterized by opposing top and bottom surfaces, first and second side surfaces and first and second end surfaces, said electronic device comprising a circuit and at least one respective first and second connection points for said circuit formed on said top surface of said electronic device;a first portion of plating material extending from said bottom surface of the electronic device, along said first side surface of the electronic device, and onto said top surface of said electronic device, wherein said first portion of plating material forms an electrical connection to the at least one first connection point on said top surface of said electronic device;a second portion of plating material extending from said bottom surface of said electronic device, along said second side surface of the electronic device, and onto said top surface of said electronic device, wherein said second portion of plating material forms an electrical connection to the at least one second connection point on said top surface of said electronic device; andat least one portion of conductive epoxy positioned between said printed circuit board and said electronic device for mounting said electronic device to said printed circuit board and for electrically connecting said first and second portions of plating material to the at least one conductive trace located on said printed circuit board. 2. The integrated electronic component of claim 1, wherein said circuit comprises an integrated thin-film filter including at least one inductor and at least one capacitor. 3. The integrated electronic component of claim 1, wherein said circuit comprises at least one of a capacitor, inductor, resistor, filter, amplifier, and oscillator. 4. The integrated electronic component of claim 1, wherein each of said first and second side surfaces of said electronic device slopes outwardly from said top surface of said electronic device to said bottom surface of said electronic device. 5. The integrated electronic component of claim 1, wherein: said first portion of plating material substantially covers said first side surface of said electronic device; andwherein said second portion of plating material substantially covers said second side surface of said electronic device. 6. The integrated electronic component of claim 1, wherein selected ones of the at least one conductive trace on said printed circuit board provide a ground connection to selected ones of said at least one first and second connection points for the circuit. 7. The integrated electronic component of claim 1, wherein selected ones of said at least one conductive trace on said printed circuit board provide a power connection to selected ones of said at least one first and second connection points for said circuit. 8. The integrated electronic component of claim 1, wherein: said circuit further comprises respective input and output terminals; andsaid printed circuit board includes respective terminal pads to which said respective input and output terminals of said circuit are electrically connected. 9. The integrated electronic component of claim 8, further comprising: a first wire bond connection for electrically coupling said input terminal of said circuit to one of said terminal pads on said printed circuit board; anda second wire bond connection for electrically coupling said output terminal of said circuit to one of said terminal pads on said printed circuit board. 10. A surface mount electronic component, comprising: a substrate characterized by opposing top and bottom surfaces, first and second side surfaces, and first and second end surfaces;a circuit, formed on said top surface of said substrate, and including at least one pair of first and second opposing connection points;a first portion of plating material, formed along said top surface of said substrate onto said at least one first connection point, and also extending from said top surface of said substrate along said first side surface of said substrate to said bottom surface of said substrate; anda second portion of plating material, formed along said top surface of said substrate onto said at least one second connection point, and also extending from said top surface of said substrate along said second side surface of said substrate to said bottom surface of said substrate;wherein said first and second portions of plating material are respectively configured to provide both mechanical and electrical connections for said electronic component when said electronic component is mounted in a circuit environment; andeach of said first and second side surfaces of said substrate slopes outwardly from said top surface of said substrate to said bottom surface of said substrate. 11. The surface mount electronic component of claim 10, wherein said circuit comprises an integrated thin-film filter including at least one inductor and at least one capacitor. 12. The surface mount electronic component of claim 10, wherein said circuit comprises at least one of a capacitor, inductor, resistor, filter, amplifier, and oscillator. 13. The surface mount electronic component of claim 10, wherein: said first portion of plating material substantially covers said first side surface of said substrate; andwherein said second portion of plating material substantially covers said second side surface of said substrate. 14. The surface mount electronic component of claim 10, wherein said first and second side surfaces of said substrate are longer than said first and second end surfaces of said substrate. 15. The surface mount electronic component of claim 10, wherein selected ones of said first and second opposing connection points are configured for providing an electrical ground connection to said circuit. 16. The surface mount electronic component of claim 10, wherein selected ones of said first and second opposing connection points are configured for providing an electrical power connection to said circuit.