초록 ▼

To provide a semiconductor device having lower junction capacitance, which can be manufactured with lower power consumption through a simpler process as compared with conventional, a semiconductor device includes a base substrate; a semiconductor film formed over the base substrate; a gate insulatin

To provide a semiconductor device having lower junction capacitance, which can be manufactured with lower power consumption through a simpler process as compared with conventional, a semiconductor device includes a base substrate; a semiconductor film formed over the base substrate; a gate insulating film formed over the semiconductor film; and an electrode formed over the gate insulating film. The semiconductor film has a channel formation region which overlaps with the electrode with the gate insulating film interposed therebetween, a cavity is formed between a recess included in the semiconductor film and the base substrate, and the channel formation region is in contact with the cavity on the recess.

대표청구항 ▼

1. A semiconductor device comprising: a first insulating film formed over a base substrate;a second insulating film formed over the first insulating film; anda semiconductor film overlapping the second insulating film, the semiconductor film including a pair of impurity regions and a channel formati

1. A semiconductor device comprising: a first insulating film formed over a base substrate;a second insulating film formed over the first insulating film; anda semiconductor film overlapping the second insulating film, the semiconductor film including a pair of impurity regions and a channel formation region with a recess,wherein the second insulating film is interposed between the first insulating film and the semiconductor film,wherein the channel formation region and the recess are provided between the pair of impurity regions,wherein the second insulating film has an opening, the opening is overlapped with the recess,wherein one cavity is formed between the recess and the first insulating film, andwherein the channel formation region is exposed to the one cavity. 2. The semiconductor device according to claim 1, wherein the first insulating film is formed between the base substrate and the second insulating film. 3. The semiconductor device according to claim 1, wherein the first insulating film is in contact with the base substrate. 4. A semiconductor device comprising: a first insulating film formed over a base substrate;a second insulating film formed over the first insulating film;a semiconductor film overlapping the second insulating film, the semiconductor film including a pair of impurity regions and a channel formation region with a recess;a gate insulating film formed over the semiconductor film; andan electrode formed over the gate insulating film,wherein the second insulating film is interposed between the first insulating film and the semiconductor film,wherein the channel formation region and the recess are provided between the pair of impurity regions,wherein the channel formation region overlaps with the electrode with the gate insulating film interposed therebetween,wherein the second insulating film has an opening, the opening is overlapped with the recess,wherein one cavity is formed between the recess and the first insulating film, andwherein the channel formation region is exposed to the one cavity. 5. The semiconductor device according to claim 4, wherein the first insulating film is formed between the base substrate and the second insulating film. 6. A semiconductor device comprising: a first insulating film formed over a base substrate;a second insulating film formed over the first insulating film;a semiconductor film overlapping the second insulating film, wherein a first recess and a second recess are provided in the second insulating film and the semiconductor film;a gate insulating film formed over the semiconductor film; andan electrode formed over the gate insulating film,wherein the semiconductor film comprises a channel formation region overlapping with the electrode with the gate insulating film interposed therebetween, and a pair of impurity regions with the channel formation region interposed therebetween,wherein a first cavity is formed between the first recess and the first insulating film,wherein a second cavity is formed between the second recess and the first insulating film,wherein one of the pair of impurity regions overlaps with the first cavity,wherein the other of the pair of impurity regions overlaps with the second cavity,wherein the semiconductor film includes a third recess,wherein one third cavity is formed between the third recess and the first insulating film, andwherein the channel formation region is exposed to the one third cavity. 7. The semiconductor device according to claim 6, wherein the semiconductor film includes a plurality of the first recesses and a plurality of the second recesses, andwherein the semiconductor device includes a plurality of the first cavities and a plurality of the second cavities. 8. The semiconductor device according to claim 6, wherein the first insulating film is formed between the base substrate and the second insulating film. 9. The semiconductor device according to claim 6, wherein the first recess is not overlapped with the channel formation region, andwherein the second recess is not overlapped with the channel formation region. 10. The semiconductor device according to claim 6, wherein the first recess is not overlapped with the channel formation region,wherein the second recess is not overlapped with the channel formation region, andwherein the third recess is overlapped with the pair of impurity regions and the channel formation region.