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Method for manufacturing semiconductor apparatus, and semiconductor apparatus and electric appliance

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/48
  • H01L-023/52
  • H01L-029/40
출원번호 US-0440116 (2006-05-25)
등록번호 US-8212364 (2012-07-03)
우선권정보 JP-2002-366158 (2002-12-18)
발명자 / 주소
  • Yamazaki, Shunpei
  • Takayama, Toru
  • Maruyama, Junya
  • Ohno, Yumiko
  • Tanaka, Koichiro
출원인 / 주소
  • Semiconductor Energy Laboratory Co., Ltd.
대리인 / 주소
    Robinson, Eric J.
인용정보 피인용 횟수 : 2  인용 특허 : 42

초록

The present invention is directed to a semiconductor device having: an interposer; a wiring provided on the interposer; a first chip having a first semiconductor device, a first pad and a first solder ball over the interposer, the first semiconductor device being connected to the first pad and the f

대표청구항

1. A semiconductor device comprising: an interposer;a wiring provided on the interposer;an oxide film bonded to the interposer with an adhesive;a metal oxide pasted on a part of the oxide film;a first chip over the oxide film, the first chip comprising: a first semiconductor device, wherein the firs

이 특허에 인용된 특허 (42)

  1. Yamazaki Shunpei,JPX ; Teramoto Satoshi,JPX ; Kusumoto Naoto,JPX ; Tanaka Koichiro,JPX, Apparatus and method for laser radiation.
  2. Patrick W. Tandy, Assembling a stacked die package.
  3. Tsunashima Yoshitaka,JPX, Chip for multi-chip semiconductor device and method of manufacturing the same.
  4. Glenn, Thomas P.; Webster, Steven; DiCaprio, Vincent, Chip size semiconductor packages with stacked dies.
  5. Hsuan Min-Chih,TWX ; Han Charlie,TWX, Direct contact through hole type wafer structure.
  6. Kuribayashi, Takeshi; Nakano, Kazuyuki, Electronic component mounting method.
  7. Gaynes Michael Anthony ; Emerick Alan James ; Puligandla Viswanadham ; Woychik Charles Gerard ; Zalesinski Jerzy Maria, High density integrated circuit packaging with chip stacking and via interconnections.
  8. Farnworth, Warren M.; Brooks, Jerry M., Integrated circuit package having reduced interconnects.
  9. Adelmann,Todd C., Interconnect method for directly connected stacked integrated circuits.
  10. Tanaka Koichiro,JPX, Laser illumination method.
  11. Yamazaki Shunpei,JPX ; Tanaka Koichiro,JPX ; Kusumoto Naoto,JPX, Laser irradiation apparatus.
  12. Yamazaki Shunpei,JPX ; Tanaka Koichiro,JPX ; Teramoto Satoshi,JPX, Laser irradiation apparatus.
  13. Yamazaki Shunpei,JPX ; Zhang Hongyong,JPX ; Ishihara Hiroaki,JPX, Laser processing apparatus.
  14. Ishihara Hiroaki (Kanagawa JPX) Nakashita Kazuhisa (Kanagawa JPX) Ohnuma Hideto (Kanagawa JPX) Tanaka Nobuhiro (Kanagawa JPX) Adachi Hiroki (Kanagawa JPX), Laser processing method and alignment.
  15. Toshiaki Oda JP, Memory package implementing two-fold memory capacity and two different memory functions.
  16. Tayanaka Hiroshi,JPX, Method for making thin film semiconductor.
  17. Ohtani Hisashi,JPX ; Miyanaga Akiharu,JPX ; Fukunaga Takeshi,JPX ; Zhang Hongyong,JPX, Method for manufacturing a semiconductor device.
  18. Kim,Soon Bum; Kim,Ung Kwang; Lee,Kang Wook; Jeong,Se Young; Song,Young Hee; Sim,Sung min, Method for manufacturing wafer level chip stack package.
  19. Yamazaki Shunpei,JPX ; Nakajima Setsuo,JPX ; Arai Yasuyuki,JPX, Method for producing display device.
  20. Yamazaki,Shunpei; Nakajima,Setsuo; Arai,Yasuyuki, Method for producing display device.
  21. Yamazaki,Shunpei; Nakajima,Setsuo; Arai,Yasuyuki, Method for producing display-device.
  22. Kusumoto Naoto,JPX ; Yamazaki Shunpei,JPX, Method for producing insulated gate thin film semiconductor device.
  23. Figuet, Christophe; Aspar, Bernard; Blet, Vincent, Method for selectively transferring at least an element from an initial support onto a final support.
  24. Kasahara, Kenji; Kawasaki, Ritsuko; Ohtani, Hisashi; Yamazaki, Shunpei, Method of crystallizing a semiconductor layer by applying laser irradiation that vary in energy to its top and bottom surfaces.
  25. Yamazaki, Shunpei, Method of fabricating a MIS transistor.
  26. Maas Henricus G. R.,NLX ; Dekker Ronald,NLX ; Van Deurzen Maria H. W. A.,NLX, Method of manufacturing a device, by which method a substrate with semiconductor element and conductor tracks is glued.
  27. Yamazaki Shunpei,JPX ; Kusumoto Naoto,JPX ; Tanaka Koichiro,JPX, Method of producing a semiconductor device with overlapped scanned linear lasers.
  28. Inoue, Satoshi; Shimoda, Tatsuya, Method of separating thin film device, method of transferring thin film device, thin film device, active matrix substrate and liquid crystal display device.
  29. Inoue, Satoshi; Shimoda, Tatsuya, Method of separating thin-film device, method of transferring thin-film device, thin-film device, active matrix substrate, and liquid crystal display device.
  30. Sakui Koji,JPX ; Miyamoto Junichi,JPX ; Hayasaka Nobuo,JPX ; Okumura Katsuya,JPX, Multichip semiconductor device and memory card.
  31. Hayasaka, Nobuo; Okumura, Katsuya; Sasaki, Keiichi; Matsuo, Mie, Multichip semiconductor device, chip therefor and method of formation thereof.
  32. Yu Allen S. ; Steffan Paul J. ; Scholer Thomas C., Multiple chip hybrid package using bump technology.
  33. Takasu Hidemi (Kyoto JPX) Ozawa Takanori (Kyoto JPX) Shimoji Noriyuki (Kyoto JPX), Semiconductor device with stacked alternate-facing chips.
  34. Toshiyuki Sameshima JP, Semiconductor element forming process having a step of separating film structure from substrate.
  35. Yamamoto,Satoshi; Suemasu,Tatsuo; Hirafune,Sayaka; Isokawa,Toshihiko; Shiotani,Koichi; Matsumoto,Kazuya, Semiconductor package with through-hole.
  36. Taketomi, Yoshinao; Kuramasu, Keizaburo; Izuchi, Masumi; Satani, Hiroshi; Tsutsu, Hiroshi; Nishitani, Hikaru; Nishitani, Mikihiko; Goto, Masashi; Mino, Yoshiko, Semiconductor thin film, method and apparatus for producing the same, and semiconductor device and method of producing the same.
  37. Taketomi, Yoshinao; Kuramasu, Keizaburo; Izuchi, Masumi; Satani, Hiroshi; Tsutsu, Hiroshi; Nishitani, Hikaru; Nishitani, Mikihiko; Goto, Masashi; MIno, Yoshiko, Semiconductor thin film, method of producing the same, apparatus for producing the same, semiconductor device and method of producing the same.
  38. Tatsuya Shimoda JP; Satoshi Inoue JP; Wakao Miyazawa JP, Separating method, method for transferring thin film device, thin film device, thin film integrated circuit device, and liquid crystal display device manufactured by using the transferring method.
  39. Matsuo, Mie; Hayasaka, Nobuo; Arikado, Tsunetoshi; Ishiuchi, Hidemi; Sakui, Koji; Takubo, Chiaki, Stacked type semiconductor device.
  40. Matsuo, Mie; Yoda, Takashi, Stacked type semiconductor device.
  41. Ka Hing Fung ; H. Bernhard Pogge, Three-dimensional chip stacking assembly.
  42. Lee,Kang Wook; Oh,Se Yong; Song,Young Hee; Kim,Gu Sung, Wafer level stack structure for system-in-package and method thereof.

이 특허를 인용한 특허 (2)

  1. Sele, Christoph Wilhelm; Beenhakkers, Monica Johanna; Gelinck, Gerwin Hermanus; Van Aerle, Nicolaas Aldegonda Jan Maria; Huitema, Hjalmar Edzer Ayco, Electronic device having spatially inverted thin film transistors.
  2. Saito, Tomiyasu; Mise, Tatsuya; Ichikawa, Hiromichi; Takeuchi, Tetsuya; Okuda, Genshi, Fabrication of semiconductor device including chemical mechanical polishing.
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