IPC분류정보
국가/구분 |
United States(US) Patent
등록
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국제특허분류(IPC7판) |
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출원번호 |
US-0680761
(2007-03-01)
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등록번호 |
US-8213479
(2012-07-03)
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발명자
/ 주소 |
- Doerfel, Falk
- Heinemann, Stefan
- Witte, Reiner
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출원인 / 주소 |
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대리인 / 주소 |
Renner, Otto, Boisselle & Sklar, LLP
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인용정보 |
피인용 횟수 :
7 인용 특허 :
4 |
초록
▼
The invention discloses a high power laser diode comprising a plurality of laser light emitters (2) and a plurality of light collimating means (33), wherein each of the laser light emitters (2) defines, in a direction perpendicular to a direction of propagation (32) of an output laser beam, a fast a
The invention discloses a high power laser diode comprising a plurality of laser light emitters (2) and a plurality of light collimating means (33), wherein each of the laser light emitters (2) defines, in a direction perpendicular to a direction of propagation (32) of an output laser beam, a fast axis (y) and a slow axis (x), and wherein each of the light collimating means is associated with a laser light emitter and configured for collimating the output laser beam at least in a fast axis (y) direction. In order to enable a simple and cost-efficient assembly of the diode laser with collimating means, having a layered structure consisting of a plurality of plane-parallel substrates. For this purpose, the diode laser comprises planar substrate means (10, 30) which serves to precisely define a distance between a respective laser light emitter (2) and an associated light collimating means to the order of one or several millimetres and to support the collimating means (33) such that the optical axis of said laser light emitters are parallel to each other and for defining a precise location of emitters on the planar substrate (10), preferably at predetermined distance in fast axis direction between said laser light emitters. The collimating means is an array or multiple single of micro-optical lenses having a rear side which is bonded to the upper surface of the planar spacer means. The submounts of the light emitters (2) are mounted to the planar substrate means (10, 30) and to a heatsink (6).
대표청구항
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1. A high power laser diode comprising a plurality of laser light emitters, a plurality of light collimating means and a planar substrate means, each of said laser light emitters defining, in a direction perpendicular to a direction of propagation of an output laser beam, a fast axis y and a slow ax
1. A high power laser diode comprising a plurality of laser light emitters, a plurality of light collimating means and a planar substrate means, each of said laser light emitters defining, in a direction perpendicular to a direction of propagation of an output laser beam, a fast axis y and a slow axis x, andeach of said light collimating means being associated with a laser light emitter and configured for collimating said output laser beam at least in a fast axis direction y, whereinsaid planar substrate means comprises a planar alignment substrate and a planar spacer plate disposed on top of said planar alignment substrate and having a first surface and a second surface opposite to and in parallel with said first surface,said planar alignment substrate comprises a plurality of cut-outs, andat least one stop formed by a respective edge of said cut-outs,by abutment of a respective laser light emitter or of a respective submount used for mounting a laser light emitter to said at least one stop said planar alignment substrate aligns said plurality of laser light emitters to each other such that the optical axes of said laser light emitters are parallel to each other and a predetermined distance is defined between said laser light emitters, andsaid first surface and said second surface of said planar spacer plate extend perpendicular to said direction of propagation, said first surface abuts to a planar spacer alignment surface of said planar alignment substrate, which is perpendicular to said direction of propagation, and said second surface abuts to a plane rear side of said collimating means so that a thickness of said planar spacer plate precisely defines a distance between a respective laser light emitter and an associated light collimating means. 2. The high power laser diode as claimed by claim 1, wherein said first surface and said planar spacer alignment surface as well as said second surface and said plane rear side of said collimating means are bonded to each other using one of: fusion bonding, soldering and laser welding. 3. The high power laser diode as claimed by claim 1, wherein each of said laser light emitters is mounted on a submount, said submounts being mounted on a single carrier at predetermined spacings in fast axis direction y, said stops aligning said submounts in at least one of fast axis y and slow axis x direction and parallel to the surface of the single carrier resulting in parallel emission of each laser light emitter. 4. The high power laser diode as claimed by claim 3, further comprising at least one stop disposed on a surface of said submounts for precisely aligning said laser light emitters with edges of said submounts. 5. The high power laser diode as claimed by claim 3, wherein said single carrier is formed by said planar alignment substrate. 6. The high power laser diode as claimed by claim 3, wherein said single carrier is a heatsink having a plurality of upright mounting protrusions and cut-outs being disposed on a base in an alternating manner and at predetermined spacings. 7. The high power laser diode as claimed by claim 3, wherein said cut-outs of said planar alignment substrate are provided by an etching process, micro machining or laser cutting, wherein said submounts are mounted on at least one heatsink and wherein said planar alignment substrate is supported by said submounts such that said laser light emitters are at least partly received by said cut-outs. 8. The high power laser diode as claimed by claim 7, said heatsink further comprising beam deflecting means for deflecting a respective output laser beam toward said collimating means. 9. The high power laser diode as claimed by claim 8, wherein said beam deflecting means comprises a reflective surface, which is shaped such that said output laser beams are shaped while being deflected toward said collimating means. 10. The high power laser diode as claimed by claim 3, wherein each of said laser light emitters is mounted on a submount or heat sink, said submounts or heat sinks being disposed at different levels on a common carrier. 11. The high power laser diode as claimed by claim 10, said submounts or heat sinks being disposed along a half-circle at equiangular distances on said common carrier, central beam deflecting means being disposed at a centre of said half-circle for deflecting said output laser beams in slow axis direction. 12. The high power laser diode as claimed by claim 3, said submounts or heat sinks each further comprising a beam deflecting means for deflecting an output laser beam toward said collimating means. 13. The high power laser diode as claimed by claim 12, wherein said beam deflecting means comprise a reflective surface, which is shaped such that said output laser beams are shaped while being deflected toward said collimating means. 14. The high power laser diode as claimed by claim 1, wherein said plurality of cut-outs are configured for at least one of passing said output laser beams and receiving electrical connection means of said laser light emitters. 15. The high power laser diode as claimed by claim 1, wherein a thickness of said planar substrate means along said direction of light propagation is such that a fill rate of said output laser beams on a surface of said light collimating means in fast axis direction is less than 100%, more preferably less than 90%, most preferably 50% or 33%, such that said collimating means are substantially larger than said output laser beams to be collimated. 16. The high power laser diode as claimed by claim 1, wherein each of said laser light emitters is mounted on a submount, said planar alignment substrate being configured for stacking n submounts in fast axis direction, with the number n of submounts determined to equal a beam parameter product in fast axis direction and slow axis direction after stacking. 17. The high power laser diode as claimed by claim 1, wherein each of said laser light emitters is mounted on a submount, said planar alignment substrate being configured for aligning said submounts along at least two rows in an interleaved manner such that said output laser beams are collimated to an output laser beam of a predetermined geometric shape with 100% optical fill factor. 18. The high power laser diode as claimed by claim 1, wherein each of said laser light emitters is a diode laser bar each comprising a plurality of laser light emitters. 19. The high power laser diode as claimed by claim 1, further comprising downstream refractive optical means configured to symmetrize at least one of divergence and geometry in fast axis direction and slow axis direction. 20. A method for manufacturing a high power laser diode, which comprises a plurality of laser light emitters and a plurality of light collimating means, comprising the steps of: providing a planar alignment substrate having a plurality of cut-outs and at least one stop formed by a respective edge of said cut-outs; andmounting said laser light emitters on top surfaces of submounts;mounting said submounts to said planar alignment substrate and such that by abutment of a respective laser light emitter or of a respective submount to said at least one stop said planar alignment substrate aligns said plurality of laser light emitters to each other such that the optical axes of said laser light emitters are parallel to each other and a predetermined distance in fast axis direction is defined between said laser light emitters;providing a planar spacer plate having a first surface and a second surface opposite to and in parallel with said first surface; anddisposing said planar spacer plate on top of said planar alignment substrate such that said first surface and said second surface of said planar spacer plate extend perpendicular to a direction of propagation of an output laser beam, said first surface abuts to a planar spacer alignment surface of said spacer alignment substrate, which is perpendicular to said direction of propagation, and said second surface abuts to a plane rear side of said collimating means such that a thickness of said planar spacer plate precisely defines a distance between a respective laser light emitter and an associated light collimating means. 21. The method as claimed by claim 20, further comprising the steps of: bonding said plane rear side of said collimating means with said planar spacer plate and said planar spacer plate with said planar alignment substrate using one of: bonding, soldering and laser welding. 22. A high power laser diode comprising a plurality of laser light emitters, a plurality of light collimating means and a planar substrate, each of said laser light emitters defining, in a direction perpendicular to a direction of propagation of an output laser beam, a fast axis and a slow axis, andeach of said light collimating means being associated with a laser light emitter and configured for collimating said output laser beam at least in a fast axis direction y,said planar substrate means extending perpendicular to said direction of propagation and comprising a plurality of first mounting surfaces and a plurality of second mounting surfaces opposite to and in parallel with said first mounting surfaces, said first mounting surfaces and said second mounting surfaces extending in parallel with said direction of propagation, whereinsaid planar substrate means comprises a planar alignment substrate and a planar spacer plate disposed on top of said planar alignment substrate and having a first surface and a second surface opposite to and in parallel with said first surface,said laser light emitters or carriers supporting said laser light emitters are mounted to said first mounting surfaces, which are provided on said planar alignment substrate; andsaid output laser beams pass said planar spacer plate,said planar spacer plate being transparent to or providing cut-outs for said output laser beams; andsaid first surface and said second surface of said planar spacer plate extend perpendicular to said direction of propagation, said first surface abuts to a planar spacer alignment surface of said planar alignment substrate, which is perpendicular to said direction of propagation, and said second surface abuts to a plane rear side of said collimating means so that a thickness of said planar spacer plate precisely defines a distance between a respective laser light emitter and an associated light collimating means. 23. The high power laser diode as claimed by claim 22, wherein said laser light emitters or said carriers supporting said laser light emitters are mounted to said first mounting surfaces of said planar alignment substrate using one of: fusion bonding, soldering and laser welding; said light collimating means being mounted to said second mounting surface of said planar spacer plate using one of: fusion bonding, soldering and laser welding. 24. The high power laser diode as claimed by claim 23, wherein each of said laser light emitters is mounted on a submount, said submounts being mounted on said first mounting surfaces of said planar alignment substrate at predetermined spacings in fast axis direction, wherein stops are provided for aligning said submounts in at least one of fast axis and slow axis direction and parallel to the surface of the planar alignment substrate resulting in parallel emission of each laser light emitter. 25. The high power laser diode as claimed by claim 24, wherein said planar spacer plate comprises a plurality of cut-outs, said stops being formed by a respective edge of said cut-outs, and wherein, by abutment of a respective laser light emitter or of a respective submount to an associated stop, said planar spacer plate aligns said plurality of laser light emitters to each other. 26. The high power laser diode as claimed by claim 25, wherein said cut-outs are provided by an etching process, micro-machining or laser cutting. 27. The high power laser diode as claimed by claim 25, wherein a thickness of said planar spacer plate along said direction of light propagation is such that a fill rate of said output laser beams on a surface of said light collimating means in fast axis direction is less than 100%, more preferably less than 90%, most preferably 50% or 33%, said collimating means being substantially larger than said output laser beams to be collimated. 28. The high power laser diode as claimed by claim 22, wherein said planar alignment substrate is a heatsink having a plurality of upright mounting protrusions and cut-outs being disposed on a base in an alternating manner and at predetermined spacings, said first mounting surfaces and said second mounting surfaces being provided on said upright mounting protrusions. 29. The high power laser diode as claimed by claim 28, wherein a thickness of said planar spacer plate along said direction of light propagation is such that a fill rate of said output laser beams on a surface of said light collimating means in fast axis direction is less than 100%, more preferably less than 90%, most preferably 50% or 33%, said collimating means being substantially larger than said output laser beams to be collimated. 30. A high power laser diode comprising a plurality of laser light emitters, a plurality of light collimating means and a planar substrate means, each of said laser light emitters defining, in a direction perpendicular to a direction of propagation of an output laser beam, a fast axis y and a slow axis x,each of said light collimating means being associated with a laser light emitter and configured for collimating said output laser beam at least in said fast axis direction y, andsaid planar substrate means comprising a plurality of cut-outs, wherein:at least one stop is formed by a respective edge of said cut-outs,by abutment of a respective laser light emitter or of a respective submount used for mounting a laser light emitter to said at least one stop said planar substrate means aligns said plurality of laser light emitters to each other such that the optical axes of said laser light emitters are parallel to each other and defines a predetermined distance between said laser light emitters, andsaid planar substrate means extends perpendicular to said direction of propagation for precisely defining a distance between a respective laser light emitter and an associated light collimating means,wherein each of said laser light emitters is mounted on a submount, said submounts being mounted on a single carrier at predetermined spacings in said fast axis direction y, said stops aligning said submounts in at least one of said fast axis y and said slow axis x direction and parallel to the surface of the single carrier resulting in parallel emission of each laser light emitter,wherein each of said laser light emitters is mounted on a submount or heat sink, said submounts or heat sinks being disposed at different levels on a common carrier, said submounts or heat sinks being disposed along a half-circle at equiangular distances on said common carrier, central beam deflecting means being disposed at a center of said half-circle for deflecting said output laser beams in slow axis direction.
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