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Composite coatings for whisker reduction 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C25D-015/00
  • C25D-015/02
출원번호 US-0254207 (2008-10-20)
등록번호 US-8226807 (2012-07-24)
발명자 / 주소
  • Abys, Joseph A.
  • Li, Jingye
  • Kudrak, Jr., Edward J.
  • Xu, Chen
출원인 / 주소
  • Enthone Inc.
대리인 / 주소
    Senniger Powers LLP
인용정보 피인용 횟수 : 2  인용 특허 : 50

초록

There is provided a method and composition for applying a wear resistant composite coating onto a metal surface of an electrical component. The method comprises contacting the metal surface with an electrolytic plating composition comprising (a) a source of tin ions and (b) non-metallic particles, a

대표청구항

1. A method for applying a composite coating onto a metal surface of an electrical component, the method comprising: contacting the metal surface with an electrolytic plating composition comprising (a) a source of tin ions and (b) a pre-mixed dispersion of non-metallic particles having a mean partic

이 특허에 인용된 특허 (50)

  1. Rosenberg William E. (Strongsville OH) Eckles William E. (Cleveland Heights OH), Additive for electrodeposition of bright tin and tin-lead alloy.
  2. Adavikolanu, Srinivas; Poon, Kar Hoong, Alloy and orifice plate for an ink-jet pen using the same.
  3. Bokisa George S. (North Olmsted OH) Willis William J. (North Royalton OH), Aqueous electroless plating solutions.
  4. Nishimura Shigefumi (Yawata JPX) Fukuda Masao (Takatsuki JPX) Shimizu Yoshiji (Higashiosaka JPX), Bath for immersion plating tin-lead alloys.
  5. Mori Sanae (Nagoya JPX), Bearing material.
  6. Wilson Harold P. (Huron OH), Bismuth composition, method of electroplating a tin-bismuth alloy and electroplating bath therefor.
  7. Helle ; Kees ; Groot ; Robert Cornelis ; Kamp ; Andries, Codeposition of a metal and fluorocarbon resin particles.
  8. Dodd John R. (Wilmington) Arduengo ; III Anthony J. (Wilmington) King Randal D. (Wilmington DE) Vitale Americus C. (West Chester PA), Complexing agent for displacement tin plating.
  9. Elliott, Kenneth H., Composite material containing tungsten, tin and organic additive.
  10. Niebauer, Daniel A., Electrical connectors incorporating low friction coatings and methods for making them.
  11. Wilson Harold P. (Huron OH), Electrodeposited eutectic tin-bismuth alloy on a conductive substrate.
  12. Abys Joseph Anthony ; Dullaghan Conor Anthony ; Fan Chonglun ; Smith Brian Thomas, Electrodeposited precious metal finishes having wear resistant particles therein.
  13. Davis ; Thomas Francis, Electroless tin and tin-lead alloy plating baths.
  14. Davis Thomas F. (Harrisburg PA), Electroless tin and tin-lead alloy plating baths.
  15. Igarashi Shuji (Tokyo JPX) Fujisawa Yoshikazu (Tokyo JPX) Igarashi Toshio (Tokyo JPX), Electroplating bath for depositing tin or tin alloy with brightness.
  16. Hsu Grace F. (Somers CT), Electroplating bath for the electrodeposition of tin and tin/cadmium deposits.
  17. Teichmann Robert J. (Belleville NJ) Mayer Linda J. (Denville NJ), Electroplating tin and tin alloys and baths therefor.
  18. Nakayama Hiroshi (Tokyo JPX) Suzuki Keijiro (Tokyo JPX) Miyata Susumu (Tokyo JPX), Film carrier having tin and indium plated layers.
  19. Tsuyoshi Kashiwada JP; Katsushige Konno JP; Kaoru Kaneko JP; Tadashi Kiyokawa JP; Hajime Kiyokawa JP, Hydrodynamic bearing, hydrodynamic bearing apparatus.
  20. Melton Cynthia M. (Bolingbrook IL) Growney Alicia (Barrington IL) Fuerhaupter Harry (Lombard IL), Immersion plating of tin-bismuth solder.
  21. Tanimoto Morimasa,JPX ; Suzuki Satoshi,JPX ; Matsuda Akira,JPX ; Sugie Kinya,JPX, Lead material for electronic part, lead and semiconductor device using the same.
  22. Cisar Alan J. ; Murphy Oliver J. ; Jeng King-Tsai ; Salinas Carlos ; Simpson Stan ; Weng Dacong, Lightweight metal bipolar plates and methods for making the same.
  23. Drew George Albert ; Ricketts Mark S.,CAX ; Gillispie Bryan A. ; Cheng Yang-Tse ; Suchanek Robert A., Low friction electrical terminals.
  24. Souza Theresa R. ; Molvar Allen E., Low friction, ductile, multilayer electrodeposits.
  25. Tanaka,Yoshiaki; Okinaga,Nobuyuki; Matsubara,Manabu, Method for producing electroconductive particles.
  26. Carbone, Ralph A.; Roche, David J., Method for sampling and testing data centers for metallic particulates.
  27. Hyner Jacob (Waterbury CT) Michelson Robert A. (Waterbury CT), Method of electrodepositing an alloy of tin, cobalt and a third metal and electrolyte therefor.
  28. Grenda David W. (Houston PA), Method of electroplating tin and alkaline electroplating bath therefor.
  29. Wilson Harold P. (Huron OH) Bradbury Walter C. (Townsend GA), Method of electroplating tin and alkaline electroplating bath therefor.
  30. MacKay Colin A. (Austin TX), Method of inhibiting tin whisker growth.
  31. Guenin Bruce M. (Guilford CT) Fister Julius C. (Hamden CT), Method of making coated electrical connectors.
  32. Cody, Charles A.; Neuberg, William; Sui, Manshi; Awad, Youssef, Methods for producing submicron polytetrafluoroethylene powder and products thereof.
  33. Monaco Emlee (5925 W. 130th St. Cleveland OH 44130) Monaco Pasquale F. (5925 W. 130th St. Cleveland OH 44130), Plating bath and method of plating therewith.
  34. Tuttle Ralph C. (Derry NH) Payne Richard S. (Andover MA), Process for forming an IC wafer with buried Zener diodes.
  35. Eberl Karl (Burgkirchen DEX), Process for the preparation of an agglomerated molding powder composed of polytetrafluoroethylene and metallic fillers.
  36. Nakamaru Takashi,JPX ; Yanase Sumihide,JPX ; Okimura Akihiko,JPX, Resin composition for sliding member and sliding member.
  37. Tanaka Takuya,JPX ; Hiramatsu Nobutaka,JPX ; Ono Akira,JPX ; Yamamoto Koichi,JPX ; Shibayama Takayuki,JPX, Sliding bearing.
  38. Takahiro Niwa JP; Hideki Iwata JP; Nobutaka Hiramatsu JP; Takayuki Shibayama JP, Sliding material.
  39. Kohl Paul A. (Chatham NJ), Solder plating process.
  40. Kobayashi, Heihachi; Takeshita, Masato; Sugi, Minori, Surface treatment structure, contact, sliding, fitting-in and ornamental members, and method for manufacturing the same.
  41. Laurello, Christopher P.; Tyler, Derek E.; Chen, Szuchain; Fister, Julius C., Tarnish deterring tin coating.
  42. Bokisa, Sr.,George S.; Eckles,William E.; Frischauf,Robert E., Tin alloy electroplating system.
  43. Fister Julius C. ; Chen Szuchain ; Khan Abid A. ; Bender Dale L., Tin coated electrical connector.
  44. Chen Szuchain ; Fister Julius ; Brauer Dennis ; Parthasarathi Arvind ; Laurello Christopher, Tin coatings incorporating selected elemental additions to reduce discoloration.
  45. Bokisa, George S.; Bishop, Craig V.; Kochilla, John R., Tin whisker-free printed circuit board.
  46. Shimauchi Hidenori (Takatsuki JPX) Suzuki Keijiro (Tokyo JPX), Tin whisker-free tin or tin alloy plated article and coating technique thereof.
  47. Obata Keigo (Himeji JPX) Dohi Nobuyasu (Kobe JPX) Okuhama Yoshiaki (Kobe JPX) Masaki Seishi (Kobe JPX) Okada Yukiyoshi (Kobe JPX) Yoshimoto Masakazu (Kobe JPX), Tin, lead, and tin-lead alloy plating baths.
  48. Morrissey Ronald J. (Cranston RI), Tin-nickel plating.
  49. Holtzman Abraham M. (Bat Yam ILX) Relis Joseph (Ramat Gan ILX), Use of immersion tin coating as etch resist.
  50. Kadija Igor V. (Cheshire CT) Fister Julius C. (Hamden CT) Winter Joseph (New Haven CT) Parthasarathi Arvind (Hamden CT), Whisker resistant tin coatings and baths and methods for making such coatings.

이 특허를 인용한 특허 (2)

  1. Abys, Joseph A.; Li, Jingye; Kudrak, Jr., Edward J.; Xu, Chen, Composite coatings for whisker reduction.
  2. Abys, Joseph A.; Kudrak, Jr., Edward J.; Li, Jingye; Xu, Chen; Fan, Chonglun, Electrolytic deposition of metal-based composite coatings comprising nano-particles.
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