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Apparatus for transferring heat in a fin of a heat sink 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28F-007/00
  • H05K-007/20
출원번호 US-0831561 (2007-07-31)
등록번호 US-8235094 (2012-08-07)
발명자 / 주소
  • Wayman, Michael J.
  • Nelson, Michael J.
출원인 / 주소
  • ADC Telecommunications, Inc.
대리인 / 주소
    Fogg & Powers LLC
인용정보 피인용 횟수 : 1  인용 특허 : 42

초록

An apparatus for dissipating heat through a plurality of fins is provided. The apparatus includes a heat dissipating member composed of metal and having a plurality of fins projecting from a first side of the heat dissipating member. Additionally, the apparatus includes a thermal material within at

대표청구항

1. An apparatus for dissipating heat through a plurality of fins, the apparatus comprising: a heat dissipating member composed of metal and having a plurality of parallel fins projecting from a first side of the heat dissipating member;a thermal material within at least one fin of the plurality of f

이 특허에 인용된 특허 (42)

  1. Edwards,David L.; Fleischman,Thomas; Zucco,Paul A., Anisotropic heat spreading apparatus and method for semiconductor devices.
  2. Wayman, Michael J.; Nelson, Michael J., Apparatus for transferring heat from a heat spreader.
  3. Anthony Thomas R. (Schenectady NY), Articles having thermal conductors of graphite.
  4. Sayir,Haluk; Mariner,John Thomas, Bulk high thermal conductivity feedstock and method of making thereof.
  5. Sabina J. Houle ; Paul A. Koning ; Greg M. Chrysler, Carbon-carbon and/or metal-carbon fiber composite heat spreader.
  6. Houle,Sabina J.; Koning,Paul A.; Chrysler,Greg M., Carbon-carbon and/or metal-carbon fiber composite heat spreaders.
  7. Asanuma Yoshihiko (Tochigi JPX) Shimajiri Yoshihumi (Tochigi JPX), Device for releasing heat.
  8. Yoshikawa Minoru,JPX, Device having a heat sink for cooling an integrated circuit.
  9. Hornung, Craig Warren, Dual material heat sink core assembly.
  10. Murasawa,Osamu, Electronic device, information processor, and electromagnetic radiation suppressing member.
  11. Ellsworth, Jr., Michael J.; Marotta, Egidio; Singh, Prabjit, Finned heat sink.
  12. Richey ; III Joseph B., Flexible heat transfer device and method.
  13. Krassowski, Daniel W.; Chen, Gary G., Heat dissipating component using high conducting inserts.
  14. Wu,Chung Ju, Heat dissipation mechanism for electronic apparatus.
  15. Jeong,Kwang Jin, Heat dissipation structure of intelligent power module, display module having the same, and method for installing heat dissipation plate for intelligent power module.
  16. Davison, Peter A., Heat sink attachment device.
  17. Gwin,Paul J, Heat sink design using clad metal.
  18. Miyazaki,Ryuuji; Suzuki,Masumi, Heat sink having high efficiency cooling capacity and semiconductor device comprising it.
  19. Getz, Jr., George; Burkett, Thomas W., Heat sink made from longer and shorter graphite sheets.
  20. Leu,Charles; Yu,Tai Cherng; Chen,Ga Lanee; Lin,Jyh Chain, Heat sink with carbon nanotubes and method for manufacturing same.
  21. Miyazaki,Ryuuji; Suzuki,Masumi, Heat sink with increased cooling capacity and semiconductor device comprising the heat sink.
  22. Murphy William S. (Kokomo IN) King David A. (Kokomo IN), Heat sinking assembly for electrical components.
  23. Michael Z. Eckblad ; Pardeep K. Bhatti, Heat spreader, electronic package including the heat spreader, and methods of manufacturing the heat spreader.
  24. Kim,Seo Young, Heat spreader, heat sink, heat exchanger and PDP chassis base.
  25. Hsieh, Teh-Ming; Tran, Bryan H.; Alipio, Julian A., Heatsink design for uniform heat dissipation.
  26. Hegde, Shankar, High performance cooling device with heat spreader.
  27. Mariner John Thomas ; Sayir Haluk, High thermal conductivity composite and method.
  28. Schmidt Detlef ; Pais Martin R., Hybrid substrate for cooling an electronic component.
  29. Smith Darryl K. (Spring TX), Insulative cradle isolation structure for electrical components.
  30. Unger Scott M. ; Riddle Guy T., Integrated circuit subassembly with thermally anisotropic heat transfer element.
  31. Kim David K. J. ; Marshall Barry ; Barnes Ronald, Interfitting heat sink and heat spreader slug.
  32. McCullough, Kevin A., Method of manufacturing a heat sink assembly with overmolded carbon matrix.
  33. Ali, Mir Akbar; Peterson, Carl W., Microwave monolithic integrated circuit assembly with multi-orientation pyrolytic graphite heat-dissipating assembly.
  34. Krassowski,Daniel W.; Chen,Gary G., Optimized heat sink using high thermal conducting base and low thermal conducting fins.
  35. Furrer,Willy; Abderraziq,Abdellatif; Boogh,Louis, Process for crosslinking thermoplastic polymers with silanes employing peroxide blends and the resulting crosslinked thermoplastic polymers.
  36. Benefield, Joseph A., Process for forming molded heat dissipation devices.
  37. Panek, Jeffrey, Structure and method of attaching a heat transfer part having a compressible interface.
  38. Miyahara Masaharu,JPX ; Suga Kenji,JPX, Thermal conductive member and electronic device using same.
  39. Fujiwara Norio,JPX ; Akiba Yasuhiro,JPX ; Watanabe Tetsuyuki,JPX ; Nishiki Naomi,JPX, Thermal conductive unit and thermal connection structure using the same.
  40. Misra, Sanjay, Thermal diffusion apparatus.
  41. Smalc,Martin David; Shives,Gary D.; Reynolds, III,Robert Anderson, Thermal solution for electronic devices.
  42. Fujimura,Kensuke; Mariner,John, Vacuum insulated heater assembly.

이 특허를 인용한 특허 (1)

  1. Chen, Hong-Long; Chou, Chien-Jiu, Heat sink.
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