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New compositions and methods of using those compositions as bonding compositions are provided. The compositions are preferably thermoplastic and comprise imides, amideimides, and/or amideimide-siloxanes (either in polymeric or oligomeric form) dispersed or dissolved in a solvent system, and can be u

New compositions and methods of using those compositions as bonding compositions are provided. The compositions are preferably thermoplastic and comprise imides, amideimides, and/or amideimide-siloxanes (either in polymeric or oligomeric form) dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened to allow the wafers to slide apart at the appropriate stage in the fabrication process.

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1. A wafer bonding method comprising: providing a stack comprising first and second substrates bonded together via a bonding composition layer comprising a compound;subjecting said stack to a temperature sufficient to soften said bonding layer; andseparating said first and second substrates, wherein

1. A wafer bonding method comprising: providing a stack comprising first and second substrates bonded together via a bonding composition layer comprising a compound;subjecting said stack to a temperature sufficient to soften said bonding layer; andseparating said first and second substrates, wherein said compound is selected from the group consisting of polymers and oligomers having a formula selected from the group consisting of wherein R is selected from the group consisting of wherein R is selected from the group consisting of alkyl-substiteted phenyls  andX is selected from the group consisting of phenyl sulfones, aromatics, aliphatic, and cyclic aliphatics; and wherein Z is selected from the group consisting of siloxanes and moieties comprising ether bridges, and wherein said compound further comprises an endcap group derived from a compound selected from the group consisting of aromatic mono-amines, aliphatic mono-amines, cyclo-aliphatic mono-amines, and phthalic anhydrides. 2. The method of claim 1, wherein said temperature is at least about 200° C. 3. The method of claim 1, wherein said separating comprises applying a force to at least one of said first and second substrates while causing the other of said first and second substrates to resist said force, said force being applied in a sufficient amount so as to separate said first and second substrates. 4. The method of claim 3, said stack having an axis that passes through both the first and second substrates, said force being applied in a generally transverse direction relative to said axis. 5. The method of claim 3, said applying a force comprising lifting the at least one first and second substrate in a direction generally away from the other of said first and second substrates. 6. The method of claim 1, further comprising thinning one of said substrates prior to said subjecting. 7. The method of claim 1, further comprising subjecting said stack to a process selected from the group consisting of backgrinding, metallizing, patterning, and combinations thereof prior to said subjecting to a temperature. 8. The method of claim 1, wherein said providing a stack comprises: applying a bonding composition to at least one of the first and second substrates; andcontacting the substrates with one another so as to bond the substrates together. 9. The method of claim 8, wherein said applying comprises spin-coating the bonding composition onto one of the first and second substrates. 10. The method of claim 8, wherein said contacting comprises applying pressure to the substrates. 11. The method of claim 1, wherein: said first substrate has a first surface and a second surface remote from said first surface and comprising at least one active site and plurality of topographical features, and said bonding composition layer is bonded to said second surface; andsaid second substrate comprises a bonding surface that is bonded to said bonding composition layer. 12. The method of claim 11, wherein: said topographical features present respective end surfaces remote from the first surface of said first substrate, and at least one of the end surfaces is further from the first surface of the first substrate than the other of said end surfaces, said further end surface defining a plane that is substantially parallel to said first surface; andthe distance from said plane to the bonding surface on said second substrate varying by less than about 10% across said plane and second substrate bonding surface. 13. The method of claim 1, wherein said first substrate: has a first surface and a second surface remote from said first surface;comprises at least one active site and plurality of topographical features on said second surface; andis selected from the group consisting of microelectromechanical system devices, display devices, flexible substrates, compound semiconductors, low k dielectric layers, dielectric layers, ion implant layers, and substrates comprising silicon, aluminum, tungsten, tungsten silicide, gallium arsenide, germanium, tantalum, tantalum nitrite, SiGe, and mixtures of the foregoing. 14. The method of claim 1, wherein said second substrate comprises a material selected from the group consisting of sapphire, ceramic, glass, quartz, aluminum, and silicon. 15. The method of claim 1, wherein said compound is (I), and X is selected from the group consisting of alkyl-substituted phenyls, isopropylidenediphenyl, and hexafluoroisopropylidene. 16. The method of claim 1, wherein said endcap group is selected from the group consisting of alkyls, where: R4 is an alkyl;R5 is a cyclic aliphatic group; andk is 0 to 20. 17. The method of claim 1, wherein said compound is (II), and Z is a siloxane having the formula where: each R3 is individually selected from the group consisting of hydrogen, alkyls, and phenyls;m is 1 to 6; andp is 1 to 50. 18. The method of claim 1, wherein said compound is (II), and Z is a moiety comprising an ether bridge selected from the group consisting of