IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0831987
(2007-08-01)
|
등록번호 |
US-8240022
(2012-08-14)
|
발명자
/ 주소 |
|
출원인 / 주소 |
- Feinics Amatech Teorowita
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
1 인용 특허 :
65 |
초록
▼
Method of connecting an antenna wire to a transponder chip. A transponder chip or chip module in a recess in a substrate, and an antenna wire mounted to the surface of the substrate and having end portions spanning the recess. The end portions are spaced wider than the chip, to allow the chip to be
Method of connecting an antenna wire to a transponder chip. A transponder chip or chip module in a recess in a substrate, and an antenna wire mounted to the surface of the substrate and having end portions spanning the recess. The end portions are spaced wider than the chip, to allow the chip to be inserted (installed) into the recess from the same side as the antenna past the end portions of the antenna wire. The chip may be moved in the recess so that its terminals are under the wires, or the wires may be repositioned to be over the terminals, for subsequently bonding thereto. Prior to installing the chip in the recess, insulation may be removed from the end portions of the antenna wire, which may also be flattened to improve bonding.
대표청구항
▼
1. Method of connecting an antenna wire to a transponder chip comprising: providing a recess in a surface of a substrate;mounting the antenna wire to the surface of the substrate so that two end portions of the antenna wire span the recess;characterized by:after mounting the antenna wire to the surf
1. Method of connecting an antenna wire to a transponder chip comprising: providing a recess in a surface of a substrate;mounting the antenna wire to the surface of the substrate so that two end portions of the antenna wire span the recess;characterized by:after mounting the antenna wire to the surface of the substrate, installing the transponder chip in the recess, past the end portions of the antenna wire; andafter installing the transponder chip in the recess, bonding the end portions of the antenna wire to corresponding terminals of the transponder chip. 2. The method of claim 1, wherein the antenna wire is an insulated wire conductor, further comprising: prior to installing the transponder chip in the recess, removing insulation from the end portions of the antenna wire. 3. The method of claim 1, further comprising: after installing the transponder chip in the recess and prior to bonding, rotating the transponder chip in the recess to bring the terminals into alignment with the end portions of the antenna wire. 4. The method of claim, further comprising: after installing the transponder chip in the recess and prior to bonding, repositioning the end portions of the antenna wire to be in alignment with the terminals of the transponder chip. 5. The method of claim 1, wherein: the two end portions of the antenna wire are spaced a distance apart which is greater than at least one of the cross dimensions of the transponder chip; andthe distance is substantially equal to a spacing between the terminals of the transponder chip. 6. The method of claim 1, wherein: the two end portions of the antenna wire are initially spaced a distance apart which is greater than at least one of the cross dimensions of the transponder chip;after installing the transponder chip in the recess and prior to bonding, the end portions of the antenna wire are repositioned so that the distance between the two end portions of the antenna wire is substantially equal to a spacing between the terminals of the transponder chip. 7. The method of claim 1, further comprising: prior to bonding the end portions of the antenna wire to the terminals, flattening the end portions of the antenna wire. 8. The method of claim 1, further comprising: after installing the transponder chip in the recess and prior to bonding, rotating the transponder chip within the recess to bring terminals of the transponder chip into alignment with, substantially directly below corresponding ones of the end poritons of the antenna wire, for bonding thereto. 9. The method of claim 8, wherein the transponder chip is rotated 90 degress within the recess. 10. The method of claim 8, wherein the antenna wire is an insulated wire conductor, further comprising; prior to installing the transponder chip in the recess, removing insulation from the end portions of the antenna wire. 11. Method of connecting an antenna wire to a transponder chip comprising: providing a recess in a surface of a substrate;mounting the antenna wire to the surface of the substrate so that two end portions of the antenna wire span the recess;characterized by:after mounting the antenna wire to the surface of the substrate, installing the transponder chip in the recess, past the end portions of the antenna wire; andafter installing the transponder chip in the recess, bonding the end portions of the antenna wire to corresponding terminals of the transponder chip; andprior to bonding the end portions of the antenna wire to corresponding terminals of the transponder chip, flattening the end portions of the antenna wire. 12. Method of connecting an antenna wire to a transponder chip comprising: providing a recess in a surface of a substrate;mounting the antenna wire to the surface of the substrate so that two end portions of the antenna wire span the recess;installing the transponder chip in the recess, between the two end portions of the antenna wire; andafter installing the transponder chip in the recess and prior to bonding, repositioning the end portions of the antenna wire to be substantially directly over respective terminals of the transponder chip for bonding thereto. 13. The method of claim 12, further comprising: bonding the end portions of the antenna wire to the terminals. 14. The method of claim 13, further comprising; prior to bonding the end portions of the antenna wire to the terminals, flattening the end portions of the antenna wire. 15. The method of claim 12, wherein the antenna wire is an insulated wire conductor, further comprising: prior to installing the transponder chip in the recess, removing insulation from the end portions of the antenna wire. 16. Method of connecting an antenna wire to a transponder chip comprising: providing a recess in a surface of a substrate;mounting the antenna wire to the surface of the substrate so that two end portions of the antenna wire span the recess;installing the transponder chip into the recess from the same side of the substrate as the antenna, past the end portions of the wires, after the antenna has been mounted to the substrate;after installing the transponder chip into the recess and prior to bonding, aligning the terminals with the end portions of the antenna wire for bonding thereto. 17. The method of claim 16, further comprising: bonding the end portions of the antenna wire to the terminals. 18. The method of claim 17, further comprising: prior to bonding the end portions of the antenna wire to the terminals, flattening the end portions of the antenna wire. 19. The method of claim 16, wherein the antenna wire is an insulated wire conductor, further comprising: prior to installing the transponder chip in the recess, removing insulation from the end portions of the antenna wire.
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