The invention relates to a cooling system for a computer system, said computer system comprising at least one unit such as a central processing unit (CPU) generating thermal energy and said cooling system intended for cooling the at least one processing unit and comprising a reservoir having an amou
The invention relates to a cooling system for a computer system, said computer system comprising at least one unit such as a central processing unit (CPU) generating thermal energy and said cooling system intended for cooling the at least one processing unit and comprising a reservoir having an amount of cooling liquid, said cooling liquid intended for accumulating and transferring of thermal energy dissipated from the processing unit to the cooling liquid. The cooling system has a heat exchanging interface for providing thermal contact between the processing unit and the cooling liquid for dissipating heat from the processing unit to the cooling liquid. Different embodiments of the heat exchanging system as well as means for establishing and controlling a flow of cooling liquid and a cooling strategy constitutes the invention of the cooling system.
대표청구항▼
1. A cooling system for a computer system processing unit, comprising: an integrated element including a heat exchanging interface, a reservoir, and a pump, wherein the reservoir is configured to receive a cooling liquid from outside the reservoir through an inlet and pass the cooling liquid to the
1. A cooling system for a computer system processing unit, comprising: an integrated element including a heat exchanging interface, a reservoir, and a pump, wherein the reservoir is configured to receive a cooling liquid from outside the reservoir through an inlet and pass the cooling liquid to the outside through an outlet, the reservoir including an upper chamber and a lower chamber, the upper chamber and the lower chamber being vertically displaced chambers that are separated from each other by at least a horizontal wall and fluidly coupled together by a plurality of substantially circular passages, at least one of the plurality of substantially circular passages being positioned on the horizontal wall, a boundary wall of the lower chamber being formed by the heat exchanging interface;the heat exchanging interface is adapted to provide separable thermal contact between the processing unit and the cooling liquid such that heat is dissipated from the processing unit to the cooling liquid as the cooling liquid passes through the lower chamber of the reservoir; andthe pump is adapted to direct the cooling liquid through the upper chamber and the lower chamber of the reservoir, the pump including a motor having a rotor, a stator and an impeller having a plurality of curved blades, the impeller being positioned within the reservoir;a heat radiator spaced apart from the integrated element, the heat radiator being fluidly coupled to the outlet and the inlet of the reservoir, the heat radiator being configured to circulate the cooling liquid therethrough and exhaust heat from the cooling liquid; anda fan configured to direct air through the heat radiator, the fan being driven by a motor separate from the motor of the pump. 2. The cooling system of claim 1, wherein the impeller is positioned in the lower chamber of the reservoir. 3. The cooling system of claim 1, further including a plurality of channels in the lower chamber of the reservoir. 4. The cooling system of claim 1, wherein the pump is positioned in the upper chamber of the reservoir. 5. The cooling system of claim 1, wherein the cooling liquid is transferred between the upper chamber and the lower chamber of the reservoir only through the plurality of passages that fluidly couple the upper chamber and the lower chamber. 6. The cooling system of claim 1, wherein the heat exchanging interface is removably coupled to the reservoir. 7. The cooling system of claim 1, wherein a surface of the heat exchanging interface exposed to the lower chamber includes features to enhance heat dissipation. 8. The cooling system of claim 7, wherein the plurality of passages includes only two passages. 9. The cooling system of claim 1, wherein the lower chamber of the reservoir includes one or more features that are configured to increase an amount of time the cooling liquid takes to flow through the lower chamber. 10. The cooling system of claim 1, wherein the motor of the pump is an AC motor. 11. The cooling system of claim 1, wherein the motor of the pump is a DC motor. 12. The cooling system of claim 1, wherein a speed of the fan is configured to be varied independent of a speed of the impeller of the pump. 13. The cooling system of claim 1, wherein the integrated element is separate from the heat radiator and the integrated element and the heat radiator are fluidly coupled together by tubing such that the heat radiator can be positioned at a location away from the integrated element when the heat exchanging interface is in thermal contact with the processing unit. 14. A cooling system for a processing unit positioned on a motherboard of a computer, comprising: a reservoir configured to be coupled to the processing unit positioned on the motherboard at a first location, the reservoir being adapted to pass a cooling liquid therethrough, wherein the reservoir includes an upper chamber and a lower chamber, the upper chamber and the lower chamber being separate chambers containing cooling liquid that are separated by at least a horizontal wall and fluidly coupled together by one or more passageways, at least one of the one or more passageways being a substantially circular passageway positioned on the horizontal wall, the reservoir further including a heat exchanging interface configured to be placed in separable thermal contact with the processing unit, the heat exchanging interface being removably attached to the reservoir such that the heat exchanging interface forms a boundary wall of the lower chamber of the reservoir;a heat radiator configured to be positioned at a second location horizontally spaced apart from the first location when the reservoir is coupled to the processing unit;a fan adapted to direct air to the heat radiator to dissipate heat from the cooling liquid to surrounding atmosphere;a pump configured to circulate the cooling liquid between the reservoir and the heat radiator, the pump including a motor having a rotor, a stator, and an impeller having curved blades, the impeller being mechanically coupled to the rotor and at least partially submerged in the cooling liquid in the reservoir, wherein a speed of the impeller is configured to be varied independent of the speed of the fan. 15. The cooling system of claim 14, wherein the lower chamber of the reservoir includes one or more features that are configured to increase an amount of time the cooling liquid takes to flow through the lower chamber. 16. The cooling system of claim 14, wherein at least one of a location of the pump or a configuration of the reservoir is selected to create a turbulence of cooling liquid flow proximate the heat exchanging interface. 17. A method of operating a liquid cooling system for an electronic component positioned on a motherboard of a computer system, comprising: separably thermally coupling a heat exchanging interface of a reservoir with the electronic component positioned at a first location on the motherboard, the reservoir including an upper chamber and a lower chamber, the upper chamber and the lower chamber being separate chambers that are vertically spaced apart and separated by at least a horizontal wall, the upper chamber and the lower chamber being fluidly coupled by one or more passageways, at least one of the one or more passageways being positioned on the horizontal wall, the heat exchanging interface being removably coupled to the reservoir such that an inside surface of the heat exchanging interface is exposed to the lower chamber of the reservoir;positioning a heat radiator at a second location horizontally spaced apart from the first location, the heat radiator and the reservoir being fluidly coupled together by tubing that extends from the first location to the second location;activating a pump to a circulate a cooling liquid through the reservoir and the heat radiator, the pump including a motor and an impeller having curved blades, the impeller being positioned in the reservoir; andactivating a fan to direct air through the heat radiator, the fan being operated by a motor separate from the motor of the pump. 18. The method of claim 17, wherein activating the pump includes circulating the cooling liquid between the upper and the lower chambers of the reservoir. 19. The method of claim 18, wherein circulating the cooling liquid between the upper and the lower chambers includes passing the cooling liquid from the upper chamber to the lower chamber through a single passageway of the one or more passageways.
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