IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0085476
(2011-04-12)
|
등록번호 |
US-8244482
(2012-08-14)
|
발명자
/ 주소 |
|
출원인 / 주소 |
- Advanced Technology Materials, Inc.
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
1 인용 특허 :
89 |
초록
▼
A process system adapted for processing of or with a material therein. The process system includes: a sampling region for the material; an infrared photometric monitor constructed and arranged to transmit infrared radiation through the sampling region and to responsively generate an output signal co
A process system adapted for processing of or with a material therein. The process system includes: a sampling region for the material; an infrared photometric monitor constructed and arranged to transmit infrared radiation through the sampling region and to responsively generate an output signal correlative of the material in the sampling region, based on its interaction with the infrared radiation; and process control means arranged to receive the output of the infrared photometric monitor and to responsively control one or more process conditions in and/or affecting the process system.
대표청구항
▼
1. A method of performing process control in a manufacturing process for a semiconductor product, said method comprising: monitoring a gaseous organometallic compound using a system adapted to supply the gaseous organometallic compound to a gaseous organometallic compound-utilizing manufacturing pro
1. A method of performing process control in a manufacturing process for a semiconductor product, said method comprising: monitoring a gaseous organometallic compound using a system adapted to supply the gaseous organometallic compound to a gaseous organometallic compound-utilizing manufacturing process region in said process, the system comprising (a) a sampling region for analyzing the gaseous organometallic compound, (b) a monitor in sensory communication with the sampling region, the monitor being constructed and arranged to responsively generate an output signal correlative of presence or concentration of any of (i) said gaseous organometallic compound, and (ii) at least one decomposition byproduct of said gaseous organometallic compound or a species thereof, and (c) a process controller arranged to receive the output signal of the monitor and to responsively control one or more process conditions in and/or affecting the gaseous organometallic compound-utilizing manufacturing process region; andcontrolling one or more process conditions in and/or affecting the gaseous organometallic compound-utilizing manufacturing process region responsive to the output signal of the monitor. 2. The method of claim 1, wherein the monitor comprises an infrared radiation source arranged to emit infrared radiation into the sampling region; and a photometric detector arranged to receive infrared radiation from the sampling region. 3. The method of claim 2, wherein the monitor further comprises at least one infrared radiation filter element optically coupled between the infrared radiation source and the photometric detector. 4. The method of claim 1, wherein the monitor comprises a photometric monitor. 5. The method of claim 4, wherein the process controller is adapted to receive the output signal to determine whether degradation of gaseous organometallic compound exceeds a predetermined level. 6. The method of claim 2, wherein monitoring the gaseous organometallic compound comprises photometrically detecting radiation emitted into the sampling region and responsively generating an output signal correlative of presence or concentration of any of (i) at least one species of said gaseous organometallic compound, and (ii) at least one decomposition by-product of said gaseous organometallic compound or a species thereof. 7. The method of claim 1, further comprising utilizing the process controller to suppress degradation of the gaseous organometallic compound responsive to the output signal from the monitor. 8. The method of claim 1, wherein the gaseous organometallic compound is generated from a non-gaseous material. 9. The method of claim 8, wherein the non-gaseous material is transformed into the gaseous organometallic compound by vaporizing, subliming, volatilizing, or atomizing. 10. The method of claim 1, wherein gaseous organometallic compound further comprises a solid or a liquid. 11. The method of claim 1, wherein the monitor comprises an infrared photometric monitor constructed and arranged to transmit infrared radiation through the sampling region and to responsively generate an output signal correlative of presence or concentration of the gaseous organometallic compound in the sampling region, based on its interaction with the infrared radiation. 12. The method of claim 1, wherein said process controller is adapted to control a delivery parameter selected from gaseous organometallic compound flow rate, vaporizer temperature, pressure and combinations thereof. 13. The method of claim 1, further comprising supplying the gaseous organometallic compound to the gaseous organometallic compound-utilizing manufacturing process region from a source vessel. 14. The method of claim 1, further comprising flow circuitry for the gaseous material. 15. The method of claim 14, wherein a portion of the flow circuitry is heated. 16. The method of claim 1, wherein the sampling region comprises a gas cell, and the gas cell is heated to prevent condensation. 17. The method of claim 1, wherein the process controller controls flow rate of the gaseous organometallic compound, temperature of the gaseous organometallic compound, or utilization of the gaseous organometallic compound in the gaseous organometallic compound-utilizing manufacturing process region. 18. The method of claim 1, comprising controlling gaseous organometallic compound flow rate, temperature, or utilization in the gaseous organometallic compound-utilizing manufacturing process region. 19. The method of claim 2, wherein the process controller is adapted to control a delivery parameter selected from gaseous organometallic compound flow rate, temperature, pressure and combinations thereof. 20. The method of claim 2, comprising controlling gaseous organometallic compound flow rate, temperature, or utilization in the gaseous organometallic compound-utilizing manufacturing process region.
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