The invention relates to a cooling system for a computer system, said computer system comprising at least one unit such as a central processing unit (CPU) generating thermal energy and said cooling system intended for cooling the at least one processing unit and comprising a reservoir having an amou
The invention relates to a cooling system for a computer system, said computer system comprising at least one unit such as a central processing unit (CPU) generating thermal energy and said cooling system intended for cooling the at least one processing unit and comprising a reservoir having an amount of cooling liquid, said cooling liquid intended for accumulating and transferring of thermal energy dissipated from the processing unit to the cooling liquid. The cooling system has a heat exchanging interface for providing thermal contact between the processing unit and the cooling liquid for dissipating heat from the processing unit to the cooling liquid, Different embodiments of the heat exchanging system as well as means for establishing and controlling a flow of cooling liquid and a cooling strategy constitutes the invention of the cooling system.
대표청구항▼
1. A cooling system for a heat-generating component, comprising: a double-sided chassis adapted to mount a pump configured to circulate a cooling liquid, the pump comprising a stator and an impeller, the impeller being positioned on the underside of the chassis and the stator being positioned on the
1. A cooling system for a heat-generating component, comprising: a double-sided chassis adapted to mount a pump configured to circulate a cooling liquid, the pump comprising a stator and an impeller, the impeller being positioned on the underside of the chassis and the stator being positioned on the upper side of the chassis and isolated from the cooling liquid;a reservoir adapted to pass the cooling liquid therethrough, the reservoir including: a pump chamber including the impeller and formed below the chassis, the pump chamber being defined by at least an impeller cover having one or more passages for the cooling liquid to pass through;a thermal exchange chamber formed below the pump chamber and vertically spaced apart from the pump chamber, the pump chamber and the thermal exchange chamber being separate chambers that are fluidly coupled together by the one or more passages; anda heat-exchanging interface, the heat-exchanging interface forming a boundary wall of the thermal exchange chamber, and configured to be placed in thermal contact with a surface of the heat-generating component; anda heat radiator fluidly coupled to the reservoir and configured to dissipate heat from the cooling liquid. 2. The cooling system of claim 1, wherein the chassis shields the stator from the cooling liquid in the reservoir. 3. The cooling system of claim 1, wherein the heat-exchanging interface includes a first side and a second side opposite the first side, and wherein the heat-exchanging interface contacts the cooling liquid in the thermal exchange chamber on the first side and the heat-exchanging interface is configured to be in thermal contact with the surface of the heat-generating component on the second side. 4. The cooling system of claim 3, wherein the first side of the heat-exchanging interface includes features that are adapted to increase heat transfer from the heat-exchanging interface to the cooling liquid in the thermal exchange chamber. 5. The cooling system of claim 4, wherein the features include at least one of pins or fins. 6. The cooling system of claim 1, wherein a passage of the one or more passages that fluidly couple the pump chamber and the thermal exchange chamber is offset from a center of the impeller. 7. The cooling system of claim 1, wherein the impeller includes a plurality of curved blades. 8. The cooling system of claim 1, wherein the heat-exchanging interface includes one of copper and aluminum. 9. The cooling system of claim 1, wherein the heat radiator is fluidly coupled to the reservoir using flexible conduits, and the heat radiator is configured to be positioned remote from the reservoir. 10. A cooling system for a computer system, comprising: a centrifugal pump adapted to circulate a cooling liquid, the pump including: an impeller exposed to the cooling liquid; anda stator isolated from the cooling liquid;a reservoir configured to be thermally coupled to a heat-generating component of the computer system, the reservoir including: a thermal exchange chamber adapted to be positioned in thermal contact with the heat-generating component;a separate pump chamber vertically spaced part from the thermal exchange chamber and coupled with the thermal exchange chamber through one or more passages configured for fluid communication between the pump chamber and the thermal exchange chamber, and wherein at least one of the one or more passages is offset from a center of the impeller. 11. The cooling system of claim 10, wherein a top wall of the reservoir physically separates the impeller from the stator. 12. The cooling system of claim 10, wherein the thermal exchange chamber includes a heat-exchange interface configured to be placed in thermal contact with the heat-generating component. 13. The cooling system of claim 10, further including a heat radiator fluidly coupled to the reservoir using flexible conduits, wherein the heat radiator is configured to be positioned remote from the reservoir. 14. The cooling system of claim 10, wherein the fluid passage that is offset from the center of the impeller is positioned tangentially to the circumference of the impeller. 15. A cooling system for a heat-generating component, comprising: a pump adapted to circulate a cooling liquid, the pump including: an impeller exposed to the cooling liquid; anda stator isolated from the cooling liquid;a reservoir including an impeller cover, an intermediate member and a heat exchange interface, wherein a top wall of the reservoir and the impeller cover define a pump chamber for housing the impeller, and the intermediate member and the heat exchange interface define a thermal exchange chamber, the pump chamber and the thermal exchange chamber being spaced apart from each other in a vertical direction and fluidly coupled together; and wherein a first side of the heat-exchanging interface is in contact with a cooling liquid in the thermal exchange chamber and a second side of the heat-exchanging interface opposite the first side is configured to be placed in thermal contact with a surface of the heat-generating component; anda liquid-to-air heat exchanger fluidly coupled to the reservoir using flexible conduits, the heat exchanger being configured to be positioned remote from the reservoir. 16. The cooling system of claim 15, wherein the impeller cover includes a first opening radially offset from a center of the impeller and the intermediate member includes a second passage that is aligned with the first opening, the first and the second opening being configured to direct the cooling liquid from the pump chamber into the thermal exchange chamber. 17. The cooling system of claim 15, wherein the first side of the heat-exchanging interface includes at least one of pins or fins. 18. The cooling system of claim 15, wherein the top wall of the reservoir extends between the stator and the impeller and shields the stator from the cooling liquid in the reservoir.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (27)
Salmonson Richard B., Air or liquid cooled computer module cold plate.
Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled.
Chu, Richard C.; Ellsworth, Jr., Michael J.; Schmidt, Roger R.; Simons, Robert E., Cooling assembly for electronics drawer using passive fluid loop and air-cooled cover.
Groshong Leroy E. (Portland OR) Groshong Judson C. (Beaverton OR) Brawn ; deceased R. James (late of Portland OR by Stanley C. Fisher ; administrator), Infusion pump.
Minamitani, Rintaro; Kitano, Makoto; Ashiwake, Noriyuki; Ohashi, Shigeo; Kondo, Yoshihiro; Naganawa, Takashi; Yoshitomi, Yuji; Nakagawa, Tsuyoshi, Liquid cooling system and personal computer using the same.
Simpkins, Haskell; Thomas, Stephen M.; Labarge, William J., Solid oxide fuel cell having a monolithic heat exchanger and method for managing thermal energy flow of the fuel cell.
Shelnutt, Austin Michael; Vancil, Paul W.; Stuewe, John R.; Bailey, Edmond I., Runtime service of liquid cooled servers operating under positive hydraulic pressure without impacting component performance.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.