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Cooling system for a computer system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28F-007/00
  • H05K-007/20
출원번호 US-0269234 (2011-10-07)
등록번호 US-8245764 (2012-08-21)
발명자 / 주소
  • Eriksen, André Sloth
출원인 / 주소
  • Asetek A/S
대리인 / 주소
    Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
인용정보 피인용 횟수 : 23  인용 특허 : 27

초록

The invention relates to a cooling system for a computer system, said computer system comprising at least one unit such as a central processing unit (CPU) generating thermal energy and said cooling system intended for cooling the at least one processing unit and comprising a reservoir having an amou

대표청구항

1. A cooling system for a heat-generating component, comprising: a double-sided chassis adapted to mount a pump configured to circulate a cooling liquid, the pump comprising a stator and an impeller, the impeller being positioned on the underside of the chassis and the stator being positioned on the

이 특허에 인용된 특허 (27)

  1. Salmonson Richard B., Air or liquid cooled computer module cold plate.
  2. Robert A. Schmidt ; Bruce A. Smetana ; Thomas T. Weir, Brushless coolant pump and cooling system.
  3. Chien Chuan-Fu,TWX, CPU cooling system.
  4. Hamilton Robin E. ; Fagan Thomas J. ; Kennedy Paul G. ; Woodward William S., Closed loop liquid cooling for semiconductor RF amplifier modules.
  5. Scott, Alexander Robin Walter, Computer cooling apparatus.
  6. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled.
  7. Chu, Richard C.; Ellsworth, Jr., Michael J.; Schmidt, Roger R.; Simons, Robert E., Cooling assembly for electronics drawer using passive fluid loop and air-cooled cover.
  8. Cheon Kioan, Cooling system for computer.
  9. Kelly, Kevin W.; Harris, Chad R.; Despa, Mircea S., Crossflow micro heat exchanger.
  10. Kevin W. Kelly ; Chad R. Harris ; Mircea S. Despa, Crossflow micro heat exchanger.
  11. Batchelder John Samuel, Heat exchange apparatus.
  12. Rife William B. ; Pare Rodney H., Heat sink assembly with adjustable mounting clip.
  13. Lin Andy,TWX, Heat sink mounting structure.
  14. Tata Peter D., Heatsink assembly with adjustable retaining clip.
  15. Malone,Christopher G.; Simon,Glenn C.; Barsun,Stephan K., High serviceability liquid cooling loop using flexible bellows.
  16. Groshong Leroy E. (Portland OR) Groshong Judson C. (Beaverton OR) Brawn ; deceased R. James (late of Portland OR by Stanley C. Fisher ; administrator), Infusion pump.
  17. Chen Shiaw-Jong S. ; Hooey Roger J. ; Radke Robert E., Integrated active cooling device for board mounted electric components.
  18. Minamitani, Rintaro; Kitano, Makoto; Ashiwake, Noriyuki; Ohashi, Shigeo; Kondo, Yoshihiro; Naganawa, Takashi; Yoshitomi, Yuji; Nakagawa, Tsuyoshi, Liquid cooling system and personal computer using the same.
  19. Gwin, Paul J.; Konstad, Rolf A., Liquid cooling system for processors.
  20. Duan,Qiang Fei; Lo,Lieh Feng, Liquid-cooling heat dissipation apparatus.
  21. Bingler, Douglas J., Pump system for use in a heat exchange application.
  22. Hata,Yukihiko; Tomioka,Kentaro, Pump, electronic apparatus, and cooling system.
  23. Lustwerk Ferdinand, Sealed motor driven centrifugal fluid pump.
  24. Simpkins, Haskell; Thomas, Stephen M.; Labarge, William J., Solid oxide fuel cell having a monolithic heat exchanger and method for managing thermal energy flow of the fuel cell.
  25. Komatsu Fumito (1632-12 Nomura ; Ooazo Hiroaka ; Shiojini Nagand-ken JPX), Start-up method for synchronous motors.
  26. Stefanoski,Zoran; Kim,Jeong H., System for efficiently cooling a processor.
  27. Neng-Chao Chang TW, Water/air dual cooling arrangement for a CPU.

이 특허를 인용한 특허 (23)

  1. Subat, Bradford Kyle, Circuit cooling.
  2. Shedd, Timothy A.; Lindeman, Brett A., Flexible two-phase cooling system.
  3. Shedd, Timothy A.; Meives, Mark S., Fluid distribution unit for two-phase cooling system.
  4. Lyon, Geoff Sean, Fluid heat exchange systems.
  5. Lyon, Geoff Sean, Fluid heat exchange systems.
  6. Lyon, Geoff Sean, Fluid heat exchange systems.
  7. Lyon, Geoff Sean, Fluid heat exchanger configured to provide a split flow.
  8. Lyon, Geoff Sean, Fluid heat exchanger configured to provide a split flow.
  9. Tsai, Chang-han; Tsai, Shui-Fa, Heat dissipating module, heat dissipating system and circuit module.
  10. Shedd, Timothy A.; Lindeman, Brett A., Heat sink module.
  11. Huang, Tai-Chi, Liquid-cooled heat sink.
  12. Huang, Tai-Chi, Liquid-cooled heat sink for electronic devices.
  13. Zhang, Rong-Xian; Yin, Jian-Wu, Liquid-cooling device and system thereof.
  14. Lyon, Geoff Sean; Holden, Mike; Gierl, Brydon, Manifolded heat exchangers and related systems.
  15. Shedd, Timothy A., Method of absorbing sensible and latent heat with series-connected heat sinks.
  16. Shedd, Timothy A.; Lindeman, Brett A., Method of cooling series-connected heat sink modules.
  17. Shedd, Timothy A., Method of operating a cooling apparatus to provide stable two-phase flow.
  18. Shedd, Timothy A.; Lindeman, Brett A.; Buchanan, Robert A., Microprocessor assembly adapted for fluid cooling.
  19. Lyon, Geoff Sean; Holden, Mike; Gierl, Brydon, Modular heat-transfer systems.
  20. Mounioloux, Stephen, Radiator with integrated pump for actively cooling electronic devices.
  21. Shedd, Timothy A.; Lindeman, Brett A., Redundant heat sink module.
  22. Shelnutt, Austin Michael; Vancil, Paul W.; Stuewe, John R.; Bailey, Edmond I., Runtime service of liquid cooled servers operating under positive hydraulic pressure without impacting component performance.
  23. Zhang, Rong-Xian; Yin, Jian-Wu, Water cooling device with detachably assembled modularized units.
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