Integrated motion processing unit (MPU) with MEMS inertial sensing and embedded digital electronics
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
G01P-015/00
G01P-001/02
출원번호
US-0774488
(2007-07-06)
등록번호
US-8250921
(2012-08-28)
발명자
/ 주소
Nasiri, Steven S.
Sachs, David
Taheri, Babak
출원인 / 주소
Invensense, Inc.
대리인 / 주소
Sawyer Law Group, P.C.
인용정보
피인용 횟수 :
95인용 특허 :
154
초록▼
A module operable to be mounted onto a surface of a board. The module includes a linear accelerometer to provide a first measurement output corresponding to a measurement of linear acceleration in at least one axis, and a first rotation sensor operable to provide a second measurement output correspo
A module operable to be mounted onto a surface of a board. The module includes a linear accelerometer to provide a first measurement output corresponding to a measurement of linear acceleration in at least one axis, and a first rotation sensor operable to provide a second measurement output corresponding to a measurement of rotation about at least one axis. The accelerometer and the first rotation sensor are formed on a first substrate. The module further includes an application specific integrated circuit (ASIC) to receive both the first measurement output from the linear accelerometer and the second measurement output from the first rotation sensor. The ASIC includes an analog-to-digital converter and is implemented on a second substrate. The first substrate is vertically bonded to the second substrate.
대표청구항▼
1. An inertial measurement unit (IMU) operable to be mounted onto a surface of a board, the IMU comprising: three linear accelerometers, each one of the three accelerometers operable to provide a first measurement output corresponding to a measurement of linear acceleration in one axis, wherein a se
1. An inertial measurement unit (IMU) operable to be mounted onto a surface of a board, the IMU comprising: three linear accelerometers, each one of the three accelerometers operable to provide a first measurement output corresponding to a measurement of linear acceleration in one axis, wherein a sensitive axis of each accelerometer is orthogonal to the sensitive axes of the other accelerometers, wherein the three accelerometers being formed on a first silicon substrate;three rotation sensors, each one of the three rotation sensors is a vibratory gyroscope with electrostatic actuation and electrostatic sensing operable to provide a second measurement output corresponding to a measurement of rotation about one axis, wherein a sensitive axis of each vibratory gyroscope is orthogonal to the sensitive axis of the other vibratory gyroscopes, wherein the three of vibratory gyroscopes-being formed on the first silicon substrate; andan application specific integrated circuit (ASIC) to receive both the first measurement outputs from the three linear accelerometers and the second measurement outputs from the three vibratory gyroscopes, wherein the ASIC includes a computation unit and a memory coupled to the computation unit, wherein the computation unit receives and processes data from the three accelerometers and the three vibratory gyroscopes to track motion in space, the ASIC being implemented on a second silicon substrate,wherein the first silicon substrate is vertically stacked and attached to the second silicon substrate and is substantially parallel to the second silicon substrate, the first silicon substrate being electrically connected to the second silicon substrate to form a single semiconductor chip. 2. The IMU of claim 1, wherein the IMU includes built-in logic for analyzing data from the three accelerometers and the three vibratory gyroscopes. 3. The IMU of claim 2, wherein the built-in logic is configured to determine an orientation of the IMU. 4. The IMU of claim 2, wherein the built-in logic is configured to detect rotational motion or linear motion, and determine an axis of the rotational motion or the linear motion. 5. The IMU of claim 2, wherein the built-in logic includes a system of programmable interrupts, the system of interrupts permitting a user to determine which types of motion should provide interrupts. 6. The IMU of claim 5, wherein the built-in logic is modifiable by the user to detect linear motion or rotational motion responsive to the linear motion or the rotational motion exceeding a pre-determined threshold for a pre-determined time period, wherein both the pre-determined threshold and the pre-determined time period is programmable by the user. 7. The IMU of claim 2, wherein the built-in logic is further configured to detect when motion of the IMU is below a pre-determined threshold, and reset biases of the three vibratory gyroscopes responsive to the motion of the IMU being below the pre-determined threshold. 8. The IMU of claim 1, further comprising a third silicon substrate that is vertically bonded to the first silicon substrate to seal the first silicon substrate within a hermetic enclosure in between the third silicon substrate and the second silicon substrate. 9. The IMU of claim 8, further comprising bond pads for bonding the IMU onto a printed circuit board. 10. The IMU of claim 1, wherein the ASIC comprises an analog to digital converter (ADC). 11. The IMU of claim 10, wherein the analog-to-digital converter is operable to convert both the first measurement output and the second measurement output from an analog signal to a corresponding digital signal. 12. The IMU of claim 11, wherein the application specific integrated circuit (ASIC) further comprises a microcontroller operable to receive the digital signal from the analog-to-digital converter and process the digital signal. 13. The IMU of claim 12, wherein the microcontroller is operable to process the digital signal including performing an optical image stabilization calculation based on the digital signal or the computation unit. 14. The IMU of claim 1, wherein the application specific integrated circuit (ASIC) further comprises a pulse width modulator (PWM) in communication with a microcontroller, the pulse width modulator operable to drive an actuator. 15. The IMU of claim 14, wherein the application specific integrated circuit (ASIC) further comprises a communication interface in communication with the microcontroller. 16. The IMU of claim 15, wherein the communication interface comprises a serial peripheral interface (SPI) or an integrated circuit (I2C) interface. 17. The IMU of claim 16, wherein a footprint of the module is substantially 6×8 mm or less. 18. The IMU of claim 1, further comprising a pin that is useable to synchronize motion data to an external signal, the external signal being one of a mechanical shutter signal, a frame valid signal, a GPS clock signal, or external timing input signal. 19. The IMU of claim 1, wherein the application specific integrated circuit (ASIC) further comprises a multiplexer operable to selectively provide at least one of the first measurement outputs from the three accelerometers or one or more measurement outputs from one or more corresponding measurement devices coupled to the analog-to-digital converter. 20. The IMU of claim 19, wherein the one or more measurement devices includes one or more of a rotation sensor, an accelerometer, a position sensor, a barometer, a geomagnetic sensor, or a temperature sensor. 21. The IMU of claim 1, wherein the first and second silicon substrates comprise silicon wafers. 22. The IMU of claim 1 wherein the first substrate is mechanically and hermetically bonded to the second substrate.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (154)
Liberty,Matthew G.; Simpkins,Daniel S.; Gritton,Charles W. K.; Turner,Mark; Hunleth,Frank A., 3D pointing devices and methods.
Case ; Jr. Charles Whipple ; Hovden Torbjorn ; Smith Gregory Clark ; Hotelling Steven Porter ; Sabina Michael Kenneth, Electronic pointing apparatus and method.
Ichiro Onuki JP, Image sensing apparatus and method capable of merging function for obtaining high-precision image by synthesizing images and image stabilization function.
Byeoung Ju Ha KR; Seog-soon Baek KR; Hyun-cheol Kim KR; Hoon Song KR; Yong-soo Oh KR, Method of fabricating micro electro mechanical system structure which can be vacuum-packed at wafer level.
Nasiri,Steven S.; Flannery, Jr.,Anthony Francis, Method of fabrication of a AL/GE bonding in a wafer packaging environment and a product produced therefrom.
Nasiri, Steven S.; Flannery, Jr., Anthony Francis, Method of making an X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging.
Nasiri,Steven S.; Flannery, Jr.,Anthony Francis, Method of making an X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging.
Hotelling,Steve; Pabon,Gus, Methods and apparatuses for docking a portable electronic device that has a planar like configuration and that operates in multiple orientations.
Wehrenberg, Paul J.; Leiba, Aaron; Williams, Richard C.; Falkenburg, David R.; Gerbarg, Louis G.; Chang, Ray L., Methods and apparatuses for operating a portable device based on an accelerometer.
Hall Malcolm G. (7901 Queenair Dr. #104 Gaithersburg MD 20879) Faulkner Russell W. (7901 Queenair Dr. Gaithersburg MD 20879), Smart orientation sensing circuit for remote control.
Grottodden, Nicole C.; Buritica, George M.; Nishikubo, Sam S., System and method for electronic stabilization for second generation forward looking infrared systems.
Lee Ki Bang,KRX ; Lee Byung-leul,KRX ; Cho Young-ho,KRX ; Song Ci-moo,KRX, Vibratory structure, method for controlling natural frequency thereof, and actuator, sensor, accelerator, gyroscope and.
Nasiri, Steve; Sachs, David; Castro, Alex; Li, Richard; Gu, Anjia; Lin, Shang-Hung; Nakayama, Takashi, Handheld computer systems and techniques for character and command recognition related to human movements.
Nasiri, Steve; Sachs, David; Castro, Alex; Li, Richard; Gu, Anjia; Lin, Shang-Hung; Nakayama, Takashi, Handheld computer systems and techniques for character and command recognition related to human movements.
Bowles, Philip H.; Hooper, Stephen R., Microelectronic packages having stacked accelerometer and magnetometer die and methods for the production thereof.
Yang, Xiao “Charles”, System configured for integrated communication, MEMS, Processor, and applications using a foundry compatible semiconductor process.
Rios, Gabrielle A.; Crockett, Jeff; Foster, Clark B.; Mishelevich, David J.; Trcka, Milan; Gifford, Aaron J.; Ludolph, Chris C., System for cosmetic and therapeutic training.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.