초록 ▼

A submount for arranging electronic components on a substrate is provided. The submount comprises a head member and at least one substrate-engaging member protruding from the head member. The head member comprises at least two, from each other isolated, electrically conductive portions, where each e

A submount for arranging electronic components on a substrate is provided. The submount comprises a head member and at least one substrate-engaging member protruding from the head member. The head member comprises at least two, from each other isolated, electrically conductive portions, where each electrically conductive portion comprises a component contact, adapted for connection of electronic components thereto, and a substrate contact on arranged on said substrate side, adapted for bringing said electrically conductive portions in contact with a circuitry comprised in said substrate. The submount of the present invention may be used to attach electronic components, such as light-emitting diodes, to a textile substrate, without the need for soldering the electronic component directly on the substrate.

대표청구항 ▼

1. A submount for arranging electronic components on a substrate, comprising a head member having an upper side and a substrate side and at least one substrate-engaging member protruding from the substrate side of said head member, wherein said head member comprises at least two, from each other iso

1. A submount for arranging electronic components on a substrate, comprising a head member having an upper side and a substrate side and at least one substrate-engaging member protruding from the substrate side of said head member, wherein said head member comprises at least two, from each other isolated, electrically conductive portions, each electrically conductive portion comprising a component contact for connection of electronic components thereto, and a substrate contact arranged on said substrate side for bringing said electrically conductive portions in contact with a circuitry comprised in said substrate; wherein the cross-section of said substrate-engaging member, in a plane perpendicular to the main extension of said substrate engaging member, has an oblong shape. 2. A submount according to claim 1, wherein at least one of said substrate contacts is at least partly constituted by a substrate-engaging member. 3. A submount according to claim 1, wherein said at least one substrate-engaging member is essentially pin-shaped. 4. A submount according to claim 1, wherein said substrate-engaging member has a length exceeding the thickness of the substrate. 5. A submount according to claim 1, wherein at least one substrate-engaging member is foldable. 6. A submount according to claim 5, comprising at least a first substrate engaging member and a second substrate-engaging member, wherein the long axis of the oblong cross section of said first substrate-engaging member forms an angle of from 15° to 165° to the long axis of the oblong cross section of said second substrate-engaging member. 7. A submount according to claim 1, wherein at least one of said substrate-engaging members comprises a portion having a serrated surface. 8. A submount according to claim 1, wherein at least one electronic component is connected to said component contacts. 9. A submount according to claim 1, wherein said at least one electronic component is selected from the group consisting of light-emitting diodes, integrated circuitry packages, sensors, actuators and semi-conductor components. 10. A submount for arranging electronic components on a substrate, comprising a head member having an upper side and a substrate side and at least one substrate-engaging member protruding from the substrate side of said head member, wherein said head member comprises at least two, from each other isolated, electrically conductive portions, each electrically conductive portion comprising a component contact for connection of electronic components thereto, and a substrate contact arranged on said substrate side for bringing said electrically conductive portions in contact with a circuitry comprised in said substrate; wherein a portion of said head member constitutes a male member of a snap fastener comprising an engaging protrusion for engaging with an engaging recess of an female member of a snap fastener. 11. A submount according to claim 10, wherein an electronic component, constituting said female member of a snap fastener comprising an engaging recess, is snap-locked on said engaging protrusion. 12. A submount for arranging electronic components on a substrate, comprising a head member having an upper side and a substrate side and at least one substrate-engaging member protruding from the substrate side of said head member, wherein said head member comprises at least two, from each other isolated, electrically conductive portions, each electrically conductive portion comprising a component contact for connection of electronic components thereto, and a substrate contact arranged on said substrate side for bringing said electrically conductive portions in contact with a circuitry comprised in said substrate; wherein a portion of said head member constitutes a female member of a snap fastener comprising an engaging recess for engaging with an engaging protrusion of an male member of a snap fastener. 13. A submount according to claim 12, wherein an electronic component, constituting said male member of a snap fastener, is snap-locked on said head member engaging recess. 14. A submount for arranging electronic components on a substrate, comprising a head member having an upper side and a substrate side and at least one substrate-engaging member protruding from the substrate side of said head member, wherein said head member comprises at least two, from each other isolated, electrically conductive portions, each electrically conductive portion comprising a component contact for connection of electronic components thereto, and a substrate contact arranged on said substrate side for bringing said electrically conductive portions in contact with a circuitry comprised in said substrate wherein a conductive adhesive material is arranged on at least one of said substrate contacts. 15. A submount according to claim 14, wherein said conductive adhesive material comprises a conductive epoxy material or an conductive adhesive tape. 16. An arrangement comprising: a textile substrate having a front side and a back side and comprising at least two separate conductive electrodes, andat least one submount, said submount comprising a head member having an upper side and a substrate side and at least one substrate-engaging member protruding from the substrate side of said head member, wherein said head member comprises at least two, from each other isolated, electrically conductive portions, each electrically conductive portion comprising a component contact for connection of electronic components thereto, and a substrate contact arranged on said substrate side for bringing said electrically conductive portions in contact with a circuitry comprised in said substrate;wherein said at least one substrate-engaging member of said submount penetrates said substrate from the front side thereof, and wherein each of said conductive electrodes is in contact with a separate substrate contact of said submount. 17. An arrangement according to claim 16, wherein said conductive electrodes are clamped between said substrate contacts and said substrate. 18. An arrangement according to claim 16, wherein a conductive adhesive material bonds at least one of said substrate contact to one of said conductive electrodes. 19. An arrangement according to claim 16, wherein at least one substrate-engaging member extends through said substrate to the backside thereof, and wherein a section of said substrate-engaging member located on said backside is bent towards the backside surface of the substrate. 20. An arrangement according to claim 16, wherein at least one of said conductive electrodes is arranged on the backside of the substrate, and is connected to said submount via contact to a section of a substrate-engaging member extending to said backside. 21. An arrangement according to claim 16, wherein said conductive electrode arranged on the backside of said substrate is clamped between said substrate and said substrate-engaging member. 22. An arrangement according to claim 16, wherein an isolating layer, arranged to isolate a conductive electrode, is penetrated by a substrate contact to form an electrical connection from said conductive electrode to said substrate contact. 23. An arrangement according to claim 16, wherein a female or male member of a snap fastener is arranged on the backside of said substrate and retained by engagement with said substrate engaging means.