초록 ▼

Systems and methods for potted shock isolation are provided. In once embodiment a shock isolation system comprises an isolator comprising an outer ring for mounting to an external housing, and an inner ring connected to the outer ring via an isolating element; and an inertial sensing assembly compri

Systems and methods for potted shock isolation are provided. In once embodiment a shock isolation system comprises an isolator comprising an outer ring for mounting to an external housing, and an inner ring connected to the outer ring via an isolating element; and an inertial sensing assembly comprising: at least one circuit board secured to the inner ring of the isolator, the at least one circuit board further comprising a triad of gyroscopes and a triad of accelerometers; and a low durometer highly dampened supporting material encapsulating a first surface of the at least one circuit board.

대표청구항 ▼

1. An inertial measurement unit for projectile applications, the inertial measurement unit comprising: an isolator mounted to a chassis within the inertial measurement unit, the isolator comprising an outer ring and an inner ring connected via an isolating element;an inertial sensing assembly compri

1. An inertial measurement unit for projectile applications, the inertial measurement unit comprising: an isolator mounted to a chassis within the inertial measurement unit, the isolator comprising an outer ring and an inner ring connected via an isolating element;an inertial sensing assembly comprising at least one circuit board secured to the inner ring of the isolator; andan enclosure for the inertial sensing assembly, the enclosure having an external surface that comprises a low durometer highly dampened supporting material applied across a first surface of the at least one circuit board, the low durometer highly dampened supporting material of the enclosure encapsulating and potting one or more electrical components mounted to the first surface within the low durometer highly dampened supporting material. 2. The inertial measurement unit of claim 1 further comprising: at least one shock ring mounted about a periphery of the at least one circuit board;wherein the low durometer highly dampened supporting material further encapsulates the at least one shock ring. 3. The inertial measurement unit of claim 1, wherein an exposed surface of the low durometer highly dampened supporting material is contoured. 4. The inertial measurement unit of claim 1, the inertial sensing assembly further comprising: a first circuit board secured to a forward region side of the inner ring; anda second circuit board to a back region side of the inner ring. 5. The inertial measurement unit of claim 4, wherein the first circuit board comprises a triad of gyroscopes and the second circuit board comprises a triad of accelerometers. 6. The inertial measurement unit of claim 4, wherein the first circuit board, the second circuit board and the inner ring define a first volume and wherein the first volume is filled with a second supporting material. 7. The inertial measurement unit of claim 1, further comprising: a processor;wherein the low durometer highly dampened material further comprises at least one connector penetration; andwherein the processor is coupled to the at least one circuit board through the at least one connector penetration.