초록 ▼

A preferred embodiment of the invention is directed to support structures such as spacers used to provide a uniform distance between two layers of a device. In accordance with a preferred embodiment, the spacers may be formed utilizing flow-fill deposition of a wet film in the form of a precursor su

A preferred embodiment of the invention is directed to support structures such as spacers used to provide a uniform distance between two layers of a device. In accordance with a preferred embodiment, the spacers may be formed utilizing flow-fill deposition of a wet film in the form of a precursor such as silicon dioxide. Formation of spacers in this manner provides a homogenous amorphous support structure that may be used to provide necessary spacing between layers of a device such as a flat panel display.

대표청구항 ▼

1. A method of forming a structure on a display component, comprising: depositing photoresist on the display component;forming an opening in the photoresist, wherein the opening extends to the substrate; andflow-fill depositing a substantially liquid sol-gel precursor in the opening. 2. The method o

1. A method of forming a structure on a display component, comprising: depositing photoresist on the display component;forming an opening in the photoresist, wherein the opening extends to the substrate; andflow-fill depositing a substantially liquid sol-gel precursor in the opening. 2. The method of forming a structure on a display component as recited in claim 1, wherein the flow-fill depositing step further comprises depositing silicon dioxide (SiO2) doped with a material from the group of boron (B) and phosphor (P). 3. The method of forming a structure on a display component as recited in claim 1, wherein the flow-fill depositing step comprises: initially cooling the display component;mixing separated reactive gases; anddepositing a sol-gel precursor over the photoresist. 4. The method of forming a structure on a display component as recited in claim 3, wherein the flow-fill depositing step comprises initially cooling the display component to a temperature between 0° C. and 50° C.; mixing silane (SiH4) gas and hydrogen peroxide (H2O2); and depositing a wet-film sol-gel precursor in the opening of the photoresist. 5. The method of forming a structure on a display component as recited in claim 1, wherein the flow-fill depositing step comprises initially cooling the display component to a temperature between 0° C. and 50° C. 6. The method of forming a structure on a display component as recited in claim 1, further comprising forming structures having a substantially circular cross-section normal to the surface of the substrate. 7. A method of fabricating a flat panel display having a cathode and a faceplate, comprising: depositing a first photoresist on the faceplate;depositing a patterned second photoresist on the first photoresist, wherein the second photoresist exposes a portion of the first photoresist;exposing the second photoresist and the portion of the first photoresist to a light source;removing exposed portions of the first and second photoresist, wherein removing defines an opening in the first photoresist down to the faceplate;flow-fill depositing a wet sol-gel on the first photoresist and in the opening;baking the sol-gel into a solid silicon oxide;removing the silicon oxide on the first photoresist while retaining the silicon oxide in the opening;removing remains of the first photoresist while retaining remains of the silicon oxide; andassembling the flat panel display with the cathode and the faceplate separated by the spacers. 8. The method in claim 7, wherein the act of removing the silicon oxide comprises planarizing. 9. The method in claim 7, further comprising prior to the act of flow-fill depositing a wet sol-gel, depositing an underlayer on the faceplate. 10. The method in claim 9, wherein the act of depositing an underlayer on the faceplate is performed using plasma enhanced chemical vapor deposition (PECVD). 11. The method in claim 10, further comprising after the act of flow-fill depositing a wet sol-gel, forming an oxide capping layer over the spacers on the faceplate using PECVD.