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A single crystal semiconductor substrate including an embrittlement layer is attached to a base substrate with an insulating layer interposed therebetween, and the single crystal semiconductor layer is separated at the embrittlement layer by heat treatment; accordingly, a single crystal semiconducto

A single crystal semiconductor substrate including an embrittlement layer is attached to a base substrate with an insulating layer interposed therebetween, and the single crystal semiconductor layer is separated at the embrittlement layer by heat treatment; accordingly, a single crystal semiconductor layer is fixed over the base substrate. The single crystal semiconductor layer is irradiated with a laser beam so that the single crystal semiconductor layer is partially melted and then is re-single crystallized, whereby crystal defects are removed. In addition, an island-shaped single crystal semiconductor layer for forming an n-channel transistor is channel-doped using a photomask and then is etched back using the photomask so that the island-shaped single crystal semiconductor layer for forming an n-channel transistor is thinner than the island-shaped single crystal semiconductor layer for forming a p-channel transistor.

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1. A manufacturing method of a semiconductor device, comprising the steps of: forming an embrittlement region in a single crystal semiconductor substrate;attaching and fixing the single crystal semiconductor substrate to a substrate;generating a crack in the embrittlement region by heating the singl

1. A manufacturing method of a semiconductor device, comprising the steps of: forming an embrittlement region in a single crystal semiconductor substrate;attaching and fixing the single crystal semiconductor substrate to a substrate;generating a crack in the embrittlement region by heating the single crystal semiconductor substrate, thereby separating from a part of the single crystal semiconductor substrate to form a semiconductor layer, wherein the semiconductor layer is attached to the substrate;forming a first island-shaped semiconductor layer and a second island-shaped semiconductor layer from the semiconductor layer;adding an impurity element imparting n-type conductivity into part of the first island-shaped semiconductor layer to form a first source region and a first drain region; andadding an impurity element imparting p-type conductivity into part of the second island-shaped semiconductor layer to form a second source region and a second drain region,wherein a thickness of the first source region is thinner than a thickness of the second source region, andwherein a thickness of the first drain region is thinner than a thickness of the second drain region. 2. The manufacturing method of a semiconductor device according to claim 1, further comprising the step of forming an n-type transistor including the first island-shaped semiconductor layer and a p-type transistor including the second island-shaped semiconductor layer. 3. The manufacturing method of a semiconductor device according to claim 1, further comprising the step of performing heat treatment so that the substrate and the single crystal semiconductor substrate are bonded to each other more efficiently. 4. The manufacturing method of a semiconductor device according to claim 3, wherein the heat treatment is performed by irradiating a region relating to bonding of the substrate and the single crystal semiconductor substrate with microwave. 5. The manufacturing method of a semiconductor device according to claim 1, further comprising the step of forming a first silicide layer in the first source region, a second silicide layer in the first drain region, a third silicide layer in the second source region, and a fourth silicide layer in the second drain region. 6. The manufacturing method of a semiconductor device according to claim 5, wherein a metal included in the first to fourth silicide layers is selected from the group consisting of titanium, nickel, tungsten, molybdenum, cobalt, zirconium, hafnium, tantalum, vanadium, neodymium, chromium, platinum, and palladium. 7. The manufacturing method of a semiconductor device according to claim 1, further comprising the step of irradiating the semiconductor layer with a laser beam to recrystallize the semiconductor layer. 8. The manufacturing method of a semiconductor device according to claim 1, further comprising the step of forming an insulating layer over the substrate or the single crystal semiconductor substrate, wherein the insulating layer is interposed between the substrate and the semiconductor layer. 9. A manufacturing method of a semiconductor device, comprising the steps of: forming an embrittlement region in a single crystal semiconductor substrate;attaching and fixing the single crystal semiconductor substrate to a substrate;generating a crack in the embrittlement region by heating the single crystal semiconductor substrate, thereby separating from a part of the single crystal semiconductor substrate to form a semiconductor layer, wherein the semiconductor layer is attached to the substrate;separating the semiconductor layer into a first island-shaped semiconductor layer and a second island-shaped semiconductor layer;etching the first island-shaped semiconductor layer by using a mask;adding an impurity element imparting n-type conductivity into part of the first island-shaped semiconductor layer to form a first source region and a first drain region by using the mask; andadding an impurity element imparting p-type conductivity into part of the second island-shaped semiconductor layer to form a second source region and a second drain region,wherein a thickness of the first source region is thinner than a thickness of the second source region, andwherein a thickness of the first drain region is thinner than a thickness of the second drain region. 10. The manufacturing method of a semiconductor device according to claim 9, further comprising the step of forming an n-type transistor including the first island-shaped semiconductor layer and a p-type transistor including the second island-shaped semiconductor layer. 11. The manufacturing method of a semiconductor device according to claim 9, further comprising the step of performing heat treatment so that the substrate and the single crystal semiconductor substrate are bonded to each other more efficiently. 12. The manufacturing method of a semiconductor device according to claim 11, wherein the heat treatment is performed by irradiating a region relating to bonding of the substrate and the single crystal semiconductor substrate with microwave. 13. The manufacturing method of a semiconductor device according to claim 9, further comprising the step of forming a first silicide layer in the first source region, a second silicide layer in the first drain region, a third silicide layer in the second source region, and a fourth silicide layer in the second drain region. 14. The manufacturing method of a semiconductor device according to claim 13, wherein a metal included in the first to fourth silicide layers is selected from the group consisting of titanium, nickel, tungsten, molybdenum, cobalt, zirconium, hafnium, tantalum, vanadium, neodymium, chromium, platinum, and palladium. 15. The manufacturing method of a semiconductor device according to claim 9, further comprising the step of irradiating the semiconductor layer with a laser beam to recrystallize the semiconductor layer. 16. The manufacturing method of a semiconductor device according to claim 9, further comprising the step of forming an insulating layer over the substrate or the single crystal semiconductor substrate, wherein the insulating layer is interposed between the substrate and the semiconductor layer. 17. A manufacturing method of a semiconductor device, comprising the steps of: forming an embrittlement region in a single crystal semiconductor substrate;attaching and fixing the single crystal semiconductor substrate to a substrate;generating a crack in the embrittlement region by heating the single crystal semiconductor substrate, thereby separating from a part of the single crystal semiconductor substrate to form a semiconductor layer, wherein the semiconductor layer is attached to the substrate;separating the semiconductor layer into a first island-shaped semiconductor layer and a second island-shaped semiconductor layer;etching the first island-shaped semiconductor layer by using a first mask;forming a gate insulating film over the first island-shaped semiconductor layer and the second island-shaped semiconductor layer;forming a first gate electrode over the first island-shaped semiconductor layer and a second gate electrode over the second island-shaped semiconductor layer;adding an impurity element imparting n-type conductivity into part of the first island-shaped semiconductor layer to form a first source region and a first drain region by using the first mask and the first gate electrode as a second mask; andadding an impurity element imparting p-type conductivity into part of the second island-shaped semiconductor layer to form a second source region and a second drain region by using the second gate electrode as a third mask,wherein a thickness of the first source region is thinner than a thickness of the second source region, andwherein a thickness of the first drain region is thinner than a thickness of the second drain region. 18. The manufacturing method of a semiconductor device according to claim 17, further comprising the step of performing heat treatment so that the substrate and the single crystal semiconductor substrate are bonded to each other more efficiently. 19. The manufacturing method of a semiconductor device according to claim 18, wherein the heat treatment is performed by irradiating a region relating to bonding of the substrate and the single crystal semiconductor substrate with microwave. 20. The manufacturing method of a semiconductor device according to claim 17, further comprising the step of forming a first silicide layer in the first source region, a second silicide layer in the first drain region, a third silicide layer in the second source region, and a fourth silicide layer in the second drain region. 21. The manufacturing method of a semiconductor device according to claim 20, wherein a metal included in the first to fourth silicide layers is selected from the group consisting of titanium, nickel, tungsten, molybdenum, cobalt, zirconium, hafnium, tantalum, vanadium, neodymium, chromium, platinum, and palladium. 22. The manufacturing method of a semiconductor device according to claim 17, further comprising the step of irradiating the semiconductor layer with a laser beam to recrystallize the semiconductor layer. 23. The manufacturing method of a semiconductor device according to claim 17, further comprising the step of forming an insulating layer over the substrate or the single crystal semiconductor substrate, wherein the insulating layer is interposed between the substrate and the semiconductor layer. 24. The manufacturing method of a semiconductor device according to claim 17, wherein the gate insulating film includes hydrogen. 25. The manufacturing method of a semiconductor device according to claim 17, wherein the gate insulating film is formed by oxidizing or nitriding the first island-shaped semiconductor layer and the second island-shaped semiconductor layer by high-density plasma treatment.