Method for generating a glass ceramic composite structure
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B29C-065/00
C03B-029/00
B32B-009/00
출원번호
US-0941262
(2010-11-08)
등록번호
US-8293059
(2012-10-23)
우선권정보
DE-10 2008 023 826 (2008-05-08)
발명자
/ 주소
Hoppe, Bernd
Weiss, Evelin
Bonitz, Ralf
출원인 / 주소
Schott AG
대리인 / 주소
Harness, Dickey & Pierce, P.L.C.
인용정보
피인용 횟수 :
2인용 특허 :
9
초록▼
A method for making glass ceramic composite structures, wherein a first and at least a second glass component, with an intermediate layer of a joining solder consisting of glass placed between them, are assembled to form a raw composite structure, wherein the joining solder has a radiation absorptio
A method for making glass ceramic composite structures, wherein a first and at least a second glass component, with an intermediate layer of a joining solder consisting of glass placed between them, are assembled to form a raw composite structure, wherein the joining solder has a radiation absorption capacity higher than the components to be joined, and wherein the raw composite structure is irradiated with energy, for example IR energy, at least in the area of the joining solder until the joining solder has softened sufficiently to bond together the components and the joining solder to produce a composite glassy structure. Thereafter a ceramization treatment is performed.
대표청구항▼
1. A method for joining components from glass based materials, comprising the steps of: providing a first component and at least a second component, both made from glasses that can be transformed by heat treatment into glass ceramics;providing a joining solder made of a glass that can be transformed
1. A method for joining components from glass based materials, comprising the steps of: providing a first component and at least a second component, both made from glasses that can be transformed by heat treatment into glass ceramics;providing a joining solder made of a glass that can be transformed by heat treatment into a glass ceramic;wherein said joining solder has a radiation absorption capacity higher than that of said first and second components to be joined;placing an intermediate layer of said joining solder between said first and second components, thereby forming a raw composite structure;irradiating said raw composite structure with radiation energy at least in a region wherein said joining solder extends between said first and second components until said joining solder softens sufficiently to bond together said first and second components and said joining solder for producing a composite structure; andthereafter ceramizing said composite structure, wherein said first and second components consist of LAS glasses and are pre-heated to a pre-heating temperature of at least 600 ° C., wherein said joining solder is heated by IR radiation within less than 1 minute to a bonding temperature of the joining solder in the range of 1100 ° C. to 1350 ° C., is held at said bonding temperature up to a maximum of 120 seconds to effect bonding of the composite structure, and is cooled thereafter. 2. The method of claim 1, wherein said joining solder has a radiation absorption capacity which is higher than said absorption capacity of said first and second components at least in a range selected from the group consisting of ultraviolet rays, visible rays, the infrared rays and microwave rays. 3. The method of claim 1, wherein irradiation is effected using radiation selected from the group consisting of ultraviolet radiation, visible light, microwave radiation and laser radiation. 4. The method of claim 1, wherein said first and second components to be bonded together consist of lithium aluminosilicate glasses in a glassy green glass condition that are transformed into lithium aluminosilicate glass ceramics (LAS glass ceramics) in the ceramizing step. 5. The method of claim 1, wherein a joining solder is used which is a glass that absorbs in the infrared range. 6. The method of claim 1, wherein a joining solder is used which substantially comprises the same glass components as said first and second components to be joined, and wherein said joining solder further comprises components that absorb more strongly infrared radiation than do said first and second components. 7. The method of claim 1, wherein a joining solder is used comprising at least one absorbing component being selected from the group consisting of oxides of Co, Fe, Mn, Ni, Cr, Sn, Ti, Zn, V, Nb, Au, Ag, Cu, Mo, Rh, Dy, Pr, Nd, Ce, Eu, Tm, Er, and Yb. 8. The method of claim 1, wherein a joining solder is used that has a cumulative content of absorbing component of at least 0.1% by weight and a maximum cumulative content of absorbing component of 5% by weight. 9. The method of claim 1, wherein said first and second components consist of a base glass comprising the following components (in wt.-% on oxide basis): SiO250-70Al2O318-28Li2O2-5Na2O0-3K2O0-3MgO0-3CaO0-3SrO0-3BaO0-4ZnO0-3TiO20-6ZrO20-4SnO20-2ΣTiO2 + ZrO2 + SnO22.5-6 P2O50-8F0-1B2O30-2refining agents 0-2,and wherein said joining solder further comprises 0.1 to 2 wt.-% of coloring oxides. 10. The method of claim 1, wherein for producing the infrared energy an IR heater unit is used having a radiation temperature of at least 1500 K. 11. The method of claim 1, wherein said first and second components are pre-heated to a temperature above their glass transformation temperatures Tg, before the raw composite structure is irradiated. 12. The method of claim 1, wherein said composite structure is cooled to a temperature below its ceramization temperature within less than 10 minutes. 13. The method of claim 1, wherein said first and second components have first and second glass transition temperatures, and wherein said composite structure after irradiating is at least cooled to a temperature which is equal to or lower than said glass transition temperatures Tg of said first and second components, before ceramizing is started. 14. The method of claim 1, wherein a first composite structure, produced by irradiation from at least one first and one second component and an intermediate layer of joining solder, is joined with another component via an intermediate layer of joining solder to form another raw composite structure, whereafter the joining solder is irradiated until said joining solder has sufficiently softened to bond the components together. 15. The method of claim 1, wherein said first and second components to be bonded together consist of a zero-expansion material.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (9)
Mueller Werner (Neu-Germering DEX) Rotter Christoph (Munich DEX) Welsch Wolfgang (Munich DEX), Liquid crystal cell with a glass solder seal.
Fotheringham,Ulrich; Esemann,Hauke; Garsche Andres,Markus; Hoppe,Bernd; Brinkmann,Matthias; Greulich Hickmann,Norbert, Method and device for the homogenous heating of glass and/or glass-ceramic articles using infrared radiation.
Hanno Hesener DE, Method for processing and for joining, especially, for soldering a component or a component arrangement using electromagnetic radiation.
Wang, Yei-Ping (Mimi) H.; Thomsen, Scott V., Vacuum IG window unit with edge seal at least partially diffused at temper and completed via microwave curing, and corresponding method of making the same.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.